Inventor · disambiguated record
Ohk Kun Lim
Also filed as: LIM OHK-KUN
4 granted patents·3 pending applications·39 citations·filing 2004–2006
75Inventor score
Top patents by PatentIndex Score
7 records- 0189US7394139B2Optical modulator module package using flip-chip mounting technologySAMSUNG ELECTRO MECH·Filed 2006·Granted Jul 1, 2008·19 cites·4 claims
- 0281US7368816B2Micro-electro-mechanical system (MEMS) package having metal sealing memberSAMSUNG ELECTRO MECH·Filed 2005·Granted May 6, 2008·11 cites·8 claims
- 0369US7116456B2Light modulator module packageSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 3, 2006·5 cites·4 claims
- 0465US7289258B2Light modulator having variable blaze diffraction gratingSAMSUNG ELECTRO MECH·Filed 2005·Granted Oct 30, 2007·4 cites·7 claims
- 0542US2006078247A1Package structure for optical modulatorSAMSUNG ELECTRO MECH·Filed 2005·Application pending·0 cites
- 0641US2007092179A1MEMS module packageSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
- 0736US2005275075A1Micro-electro-mechanical system (MEMS) package with spacer for sealing and method of manufacturing the sameHONG SUK-KEE·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →