Inventor · disambiguated record
Okito Umehara
Also filed as: UMEHARA OKITO
4 granted patents·2 pending applications·8 citations·filing 2008–2023
64Inventor score
Technology areasH10P
Top patents by PatentIndex Score
6 records- 0175US11474143B2Testing apparatusDISCO CORP·Filed 2019·Granted Oct 18, 2022·2 cites·16 claims
- 0274US7820006B2Die pickup apparatus for picking up semiconductor dies and methods for picking up semiconductor diesSHINKKAWA LTD·Filed 2010·Granted Oct 26, 2010·6 cites·11 claims
- 0373US11901234B2Method of processing wafer, and chip measuring apparatusDISCO CORP·Filed 2023·Granted Feb 13, 2024·0 cites·1 claims
- 0458US11637039B2Method of processing wafer, and chip measuring apparatusDISCO CORP·Filed 2020·Granted Apr 25, 2023·0 cites·5 claims
- 0545US2009101282A1Apparatus and method for picking-up semiconductor diesSHINKAWA KK·Filed 2008·Application pending·0 cites
- 0645US2009075459A1Apparatus and method for picking-up semiconductor diesSHINKAWA KK·Filed 2008·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Okito Umehara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →