Inventor · disambiguated record
Osher Avsian
Also filed as: AVSIAN OSHER
4 granted patents·2 pending applications·146 citations·filing 2007–2013
78Inventor score
Technology areasH10W
Top patents by PatentIndex Score
6 records- 0194US7936062B2Wafer level chip packagingTESSERA TECH IRELAND LTD·Filed 2007·Granted May 3, 2011·75 cites·23 claims
- 0293US8466542B2Stacked microelectronic assemblies having vias extending through bond padsKRIMAN MOSHE·Filed 2010·Granted Jun 18, 2013·50 cites·23 claims
- 0387US8551815B2Stack packages using reconstituted wafersAVSIAN OSHER·Filed 2008·Granted Oct 8, 2013·21 cites·9 claims
- 0450US2014027931A1Stack packages using reconstituted wafersTESSERA INC·Filed 2013·Application pending·0 cites
- 0540US2007190747A1Wafer level packaging to lidded chipsTESSERA TECH HUNGARY KFT·Filed 2007·Application pending·0 cites
- 0631US10147750B2Optical imaging apparatus and methods of making the sameKRIMAN MOSHE·Filed 2010·Granted Dec 4, 2018·0 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →