Inventor · disambiguated record
Osamu Kasahara
Also filed as: KASAHARA OSAMU
31 granted patents·5 pending applications·750 citations·filing 1984–2013
98Inventor score
Top patents by PatentIndex Score
36 records- 0192US5060045ASemiconductor integrated circuit device and method of manufacturing the sameHITACHI LTD·Filed 1989·Granted Oct 22, 1991·80 cites·51 claims
- 0291US4606802APlanar magnetron sputtering with modified field configurationHITACHI LTD·Filed 1984·Granted Aug 19, 1986·36 cites·33 claims
- 0390US5734188ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Mar 31, 1998·73 cites·13 claims
- 0488US8575042B2Method of manufacturing semiconductor device and method of processing substrate and substrate processing apparatusOTA YOSUKE·Filed 2012·Granted Nov 5, 2013·7 cites·14 claims
- 0588US7494941B2Manufacturing method of semiconductor device, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2004·Granted Feb 24, 2009·46 cites·16 claims
- 0688US4610774ATarget for sputteringHITACHI LTD·Filed 1985·Granted Sep 9, 1986·40 cites·7 claims
- 0786US4907046ASemiconductor device with multilayer silicon oxide silicon nitride dielectricHITACHI LTD·Filed 1988·Granted Mar 6, 1990·39 cites·10 claims
- 0883US5202275ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1990·Granted Apr 13, 1993·43 cites·23 claims
- 0980US5498768AProcess for forming multilayer wiringHITACHI LTD·Filed 1993·Granted Mar 12, 1996·60 cites·18 claims
- 1079US5780882ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1995·Granted Jul 14, 1998·33 cites·8 claims
- 1176US6548847B2Semiconductor integrated circuit device having a first wiring strip exposed through a connecting hole, a transition-metal film in the connecting hole and an aluminum wiring strip thereover, and a transition-metal nitride film between the aluminum wiring strip and the transition-metal filmHITACHI LTD·Filed 2001·Granted Apr 15, 2003·12 cites·33 claims
- 1273US8293646B2Semiconductor device manufacturing method and substrate processing apparatusOZAKI TAKASHI·Filed 2005·Granted Oct 23, 2012·4 cites·13 claims
- 1373US5917211ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Jun 29, 1999·37 cites·11 claims
- 1473US5331191ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Jul 19, 1994·24 cites·11 claims
- 1572US9023429B2Method of manufacturing semiconductor device and substrate processing apparatusTAKESHIMA YUICHIRO·Filed 2012·Granted May 5, 2015·4 cites·11 claims
- 1672US5059791AReference position detecting device utilizing a plurality of photo-detectors and an encoder using the deviceCANON KK·Filed 1990·Granted Oct 22, 1991·27 cites·48 claims
- 1767US5670421AProcess for forming multilayer wiringHITACHI LTD·Filed 1996·Granted Sep 23, 1997·31 cites·9 claims
- 1866US5773340AMethod of manufacturing a BIMISHITACHI LTD·Filed 1995·Granted Jun 30, 1998·26 cites·14 claims
- 1965US5264712ASemiconductor integrated circuit, method of fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1992·Granted Nov 23, 1993·27 cites·10 claims
- 2064US6576063B2Apparatus and method for use in manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2001·Granted Jun 10, 2003·8 cites·16 claims
- 2162US6894334B2Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI VLSI ENG·Filed 2003·Granted May 17, 2005·5 cites·33 claims
- 2261US6169324B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 2, 2001·13 cites·19 claims
- 2361US5739589ASemiconductor integrated circuit device process for fabricating the same and apparatus for fabricating the sameHITACHI LTD·Filed 1996·Granted Apr 14, 1998·13 cites·21 claims
- 2461US5036192ARotary encoder using reflected lightCANON KK·Filed 1990·Granted Jul 30, 1991·19 cites·24 claims
- 2551US6342412B1Semiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1999·Granted Jan 29, 2002·8 cites·19 claims
- 2650US9096928B2Method of manufacturing semiconductor device and substrate processing apparatusSASAJIMA RYOTA·Filed 2011·Granted Aug 4, 2015·0 cites·14 claims
- 2750US7033937B2Apparatus and method for use in manufacturing a semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2003·Granted Apr 25, 2006·2 cites·18 claims
- 2850US6127255ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1997·Granted Oct 3, 2000·8 cites·12 claims
- 2950US5811316AMethod of forming teos oxide and silicon nitride passivation layer on aluminum wiringHITACHI LTD·Filed 1995·Granted Sep 22, 1998·8 cites·13 claims
- 3047US5557147ASemiconductor integrated circuit device, process for fabricating the same, and apparatus for fabricating the sameHITACHI LTD·Filed 1994·Granted Sep 17, 1996·7 cites·18 claims
- 3142US2014087567A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2013·Application pending·0 cites
- 3238US2011212625A1Substrate processing apparatus and method of manufacturing semiconductor deviceHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 3337US2013276983A1Injection member for manufacturing semiconductor device and plasma processing apparatus having the samePARK YONG SUNG·Filed 2012·Application pending·0 cites
- 3437US2011207302A1Semiconductor device manufacturing method, and substrate processing method and apparatusHITACHI INT ELECTRIC INC·Filed 2011·Application pending·0 cites
- 3536US5468989ASemiconductor integrated circuit device having an improved vertical bipolar transistor structureHITACHI LTD·Filed 1992·Granted Nov 21, 1995·10 cites·7 claims
- 3636US2002192984A1Method for manufacturing semiconductor device, method for processing substrate, and substrate processing apparatusHITACHI INT ELECTRIC INC·Filed 2002·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Osamu Kasahara files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →