Inventor · disambiguated record
Oscar Khaselev
Also filed as: KHASELEV OSCAR
27 granted patents·8 pending applications·78 citations·filing 2002–2024
94Inventor score
Top patents by PatentIndex Score
35 records- 0189US7968008B2Particles and inks and films using themFRY METALS INC·Filed 2006·Granted Jun 28, 2011·16 cites·14 claims
- 0288US11162007B2Sintering pasteALPHA ASSEMBLY SOLUTIONS INC·Filed 2019·Granted Nov 2, 2021·3 cites·20 claims
- 0385US10259980B2Sintering powderALPHA ASSEMBLY SOLUTIONS INC·Filed 2013·Granted Apr 16, 2019·5 cites·8 claims
- 0482US2024351882A1Production of GrapheneALPHA ASSEMBLY SOLUTIONS INC·Filed 2024·Application pending·0 cites
- 0581US10535628B2Sintering materials and attachment methods using sameKHASELEV OSCAR·Filed 2011·Granted Jan 14, 2020·5 cites·16 claims
- 0681US8555491B2Methods of attaching a die to a substrateBOUREGHDA MONNIR·Filed 2008·Granted Oct 15, 2013·11 cites·6 claims
- 0779US10710336B2Composite and multilayered silver films for joining electrical and mechanical componentsALPHA ASSEMBLY SOLUTIONS INC·Filed 2014·Granted Jul 14, 2020·4 cites·16 claims
- 0879US9217088B2Particles and inks and films using themPARASHAR SACHIN·Filed 2011·Granted Dec 22, 2015·3 cites·16 claims
- 0978US7413805B2Preparation of metallic particles for electrokinetic or electrostatic depositionFRY METALS INC·Filed 2005·Granted Aug 19, 2008·4 cites·18 claims
- 1077US6808614B2Electroplating solution for high speed plating of tin-copper solderLUCENT TECHNOLOGIES INC·Filed 2002·Granted Oct 26, 2004·12 cites·8 claims
- 1172US6726827B2Electroplating solution for high speed plating of tin-bismuth solderLUCENT TECHNOLOGIES INC·Filed 2002·Granted Apr 27, 2004·8 cites·9 claims
- 1271US12388042B2Solder material and method for die attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Granted Aug 12, 2025·0 cites·15 claims
- 1371US8304062B2Electrical conductors and methods of making and using themKHASELEV OSCAR·Filed 2008·Granted Nov 6, 2012·3 cites·4 claims
- 1470US11699632B2Methods for attachment and devices produced using the methodsALPHA ASSEMBLY SOLUTIONS INC·Filed 2021·Granted Jul 11, 2023·0 cites·28 claims
- 1564US11390054B2Composite and multilayered silver films for joining electrical and mechanical componentsALPHA ASSEMBLY SOLUTIONS INC·Filed 2020·Granted Jul 19, 2022·0 cites·19 claims
- 1664US7678255B2Mask and method for electrokinetic deposition and patterning process on substratesFRY METALS INC·Filed 2006·Granted Mar 16, 2010·2 cites·16 claims
- 1761US2014186524A1Solvent systems for metals and inksALPHA METALS·Filed 2013·Application pending·0 cites
- 1860US8597548B2Solvent systems for metals and inksKHASELEV OSCAR·Filed 2007·Granted Dec 3, 2013·1 cites·26 claims
- 1959US8252417B2Metallic particles for electrokinetic or electrostatic depositionKHASELEV OSCAR·Filed 2008·Granted Aug 28, 2012·0 cites·18 claims
- 2057US10462908B2Conductive patterns and methods of using themALPHA ASSEMBLY SOLUTIONS INC·Filed 2017·Granted Oct 29, 2019·0 cites·6 claims
- 2157US2018072573A1Production of GrapheneALPHA METALS·Filed 2016·Application pending·0 cites
- 2256US8312623B2Methods for producing electrical conductorsKHASELEV OSCAR·Filed 2008·Granted Nov 20, 2012·1 cites·11 claims
- 2353US10905041B2Methods for attachment and devices produced using the methodsALPHA ASSEMBLY SOLUTIONS INC·Filed 2013·Granted Jan 26, 2021·0 cites·22 claims
- 2453US9615463B2Method for producing a high-aspect ratio conductive pattern on a substrateKHASELEV OSCAR·Filed 2007·Granted Apr 4, 2017·0 cites·19 claims
- 2553US9362424B2Electrical contactsKHASELEV OSCAR·Filed 2008·Granted Jun 7, 2016·0 cites·16 claims
- 2651US12438121B2Sintering materials and attachment methods using sameALPHA ASSEMBLY SOLUTIONS INC·Filed 2016·Granted Oct 7, 2025·0 cites·15 claims
- 2750US12246376B2Sinter-ready silver filmsALPHA ASSEMBLY SOLUTIONS INC·Filed 2020·Granted Mar 11, 2025·0 cites·7 claims
- 2850US2025201741A1Sinter ready multilayer wire/ribbon bond pads and method for die top attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2023·Application pending·0 cites
- 2949US11842974B2Solder material and method for die attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2018·Granted Dec 12, 2023·0 cites·13 claims
- 3042US2022371089A1Sintering compositionALPHA ASSEMBLY SOLUTIONS INC·Filed 2020·Application pending·0 cites
- 3138US2005249968A1Whisker inhibition in tin surfaces of electronic componentsENTHONE·Filed 2004·Application pending·0 cites
- 3237US10465295B2Jettable inks for solar cell and semiconductor fabricationALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Nov 5, 2019·0 cites·7 claims
- 3336US2008261071A1Preserving Solderability and Inhibiting Whisker Growth in Tin Surfaces of Electronic ComponentsXU CHEN·Filed 2005·Application pending·0 cites
- 3435US2005249969A1Preserving solderability and inhibiting whisker growth in tin surfaces of electronic componentsENTHONE·Filed 2004·Application pending·0 cites
- 3531US11289447B2Method for die and clip attachmentALPHA ASSEMBLY SOLUTIONS INC·Filed 2015·Granted Mar 29, 2022·0 cites·19 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →