Inventor · disambiguated record
Osamu Koike
Also filed as: KOIKE OSAMU
14 granted patents·5 pending applications·77 citations·filing 1983–2025
90Inventor score
Files withLAPIS SEMICONDUCTOR CO LTD4TAIWAN SEMICONDUCTOR MFG CO LTD3KOIKE OSAMU2LAPIS SEMICONDUTOR CO LTD2OKI ELECTRIC IND CO LTD2
Top patents by PatentIndex Score
19 records- 0185US2025266299A1Semiconductor device having a dummy section and method for manufacturing the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2025·Application pending·0 cites
- 0283US12300543B2Method for manufacturing a semiconductor device having a dummy sectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted May 13, 2025·0 cites·20 claims
- 0382US4603941APolarization-maintaining fiber system and method of manufacturing the sameAGENCY IND SCIENCE TECHN·Filed 1983·Granted Aug 5, 1986·31 cites·13 claims
- 0478US6726799B2Plasma etching apparatus with focus ring and plasma etching methodSEMICONDUCTOR LEADING EDGE TEC·Filed 2001·Granted Apr 27, 2004·22 cites·6 claims
- 0576US8008195B2Method for manufacturing semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2010·Granted Aug 30, 2011·5 cites·6 claims
- 0675US9892968B2Semiconductor device having a dummy portion, method for manufacturing the semiconductor device, method for manufacturing a semiconductor package having the semiconductor deviceKOIKE OSAMU·Filed 2009·Granted Feb 13, 2018·4 cites·6 claims
- 0775US8183147B2Method of fabricating a conductive post on an electrodeKOIKE OSAMU·Filed 2011·Granted May 22, 2012·5 cites·10 claims
- 0873US11798847B2Method for manufacturing a semiconductor device having a dummy sectionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Oct 24, 2023·0 cites·20 claims
- 0964US10892189B2Method for manufacturing a semiconductor device having a dummy sectionLAPIS SEMICONDUCTOR CO LTD·Filed 2019·Granted Jan 12, 2021·0 cites·2 claims
- 1062US10957638B2Device with pillar-shaped componentsLAPIS SEMICONDUCTOR CO LTD·Filed 2019·Granted Mar 23, 2021·0 cites·3 claims
- 1159US7544555B2Method of manufacturing semiconductor deviceOKI SEMICONDUCTOR CO LTD·Filed 2007·Granted Jun 9, 2009·2 cites·4 claims
- 1259US2018151434A1Method for manufacturing a semiconductor device having a dummy sectionLAPIS SEMICONDUCTOR CO LTD·Filed 2018·Application pending·0 cites
- 1357US2024071971A1Semiconductor device and manufacturing method of semiconductor deviceLAPIS TECH CO LTD·Filed 2023·Application pending·0 cites
- 1456US10424537B2Device with pillar-shaped componentsLAPIS SEMICONDUCTOR CO LTD·Filed 2017·Granted Sep 24, 2019·0 cites·16 claims
- 1556US6548845B1Semiconductor device and method of fabricating the sameOKI ELECTRIC IND CO LTD·Filed 2000·Granted Apr 15, 2003·8 cites·14 claims
- 1649US9293402B2Device with pillar-shaped componentsLAPIS SEMICONDUTOR CO LTD·Filed 2013·Granted Mar 22, 2016·0 cites·14 claims
- 1748US9721879B2Device with pillar-shaped componentsLAPIS SEMICONDUTOR CO LTD·Filed 2015·Granted Aug 1, 2017·0 cites·6 claims
- 1843US2008111192A1High-voltage-withstanding semiconductor device and fabrication method thereofOKI ELECTRIC IND CO LTD·Filed 2007·Application pending·0 cites
- 1932US2005148191A1Method of manufacturing semiconductor deviceFiled 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →