Inventor · disambiguated record
Oscar Van Der Straten
Also filed as: VAN DER STRATEN OSCAR
143 granted patents·52 pending applications·395 citations·filing 2006–2024
99Inventor score
Top patents by PatentIndex Score
195 records- 0198US9741812B1Dual metal interconnect structureIBM·Filed 2016·Granted Aug 22, 2017·28 cites·9 claims
- 0297US9934977B1Salicide bottom contactsIBM·Filed 2017·Granted Apr 3, 2018·14 cites·13 claims
- 0397US9437714B1Selective gate contact fill metallizationIBM·Filed 2015·Granted Sep 6, 2016·23 cites·16 claims
- 0497US7528066B2Structure and method for metal integrationIBM·Filed 2006·Granted May 5, 2009·50 cites·14 claims
- 0596US11793001B2Spin-orbit-torque magnetoresistive random-access memoryIBM·Filed 2021·Granted Oct 17, 2023·3 cites·20 claims
- 0696US10580966B1Faceted sidewall magnetic tunnel junction structureIBM·Filed 2018·Granted Mar 3, 2020·20 cites·9 claims
- 0796US10074727B2Low resistivity wrap-around contactsIBM·Filed 2016·Granted Sep 11, 2018·15 cites·12 claims
- 0895US10461148B1Multilayer buried metal-insultor-metal capacitor structuresIBM·Filed 2018·Granted Oct 29, 2019·10 cites·20 claims
- 0995US10411109B2Bipolar junction transistor (BJT) for liquid flow biosensing applications without a reference electrode and large sensing areaIBM·Filed 2018·Granted Sep 10, 2019·6 cites·20 claims
- 1095US9935051B2Multi-level metallization interconnect structureIBM·Filed 2016·Granted Apr 3, 2018·12 cites·12 claims
- 1194US10090287B1Deep high capacity capacitor for bulk substratesIBM·Filed 2017·Granted Oct 2, 2018·8 cites·10 claims
- 1294US9735165B1Vertically stacked FinFET fuseIBM·Filed 2016·Granted Aug 15, 2017·9 cites·18 claims
- 1394US8664766B2Interconnect structure containing non-damaged dielectric and a via gouging featureYANG CHIH-CHAO·Filed 2009·Granted Mar 4, 2014·23 cites·18 claims
- 1493US11758819B2Magneto-resistive random access memory with laterally-recessed free layerIBM·Filed 2020·Granted Sep 12, 2023·2 cites·8 claims
- 1592US12382840B2Damascene MRAM deviceIBM·Filed 2022·Granted Aug 5, 2025·1 cites·18 claims
- 1692US10269698B1Binary metallization structure for nanoscale dual damascene interconnectsIBM·Filed 2017·Granted Apr 23, 2019·7 cites·10 claims
- 1791US10170419B2Biconvex low resistance metal wireIBM·Filed 2016·Granted Jan 1, 2019·6 cites·10 claims
- 1891US10049980B1Low resistance seed enhancement spacers for voidless interconnect structuresIBM·Filed 2017·Granted Aug 14, 2018·7 cites·16 claims
- 1991US9613899B1Epitaxial semiconductor fuse for FinFET structureIBM·Filed 2015·Granted Apr 4, 2017·7 cites·19 claims
- 2090US10388600B2Binary metallization structure for nanoscale dual damascene interconnectsIBM·Filed 2018·Granted Aug 20, 2019·5 cites·10 claims
- 2190US10056329B1Programmable buried antifuseIBM·Filed 2017·Granted Aug 21, 2018·5 cites·13 claims
- 2289US12250827B2Magneto-resistive random access memory with substitutional bottom electrodeIBM·Filed 2021·Granted Mar 11, 2025·2 cites·20 claims
- 2389US9831254B1Multiple breakdown point low resistance anti-fuse structureIBM·Filed 2016·Granted Nov 28, 2017·6 cites·20 claims
- 2489US9722038B2Metal cap protection layer for gate and contact metallizationIBM·Filed 2015·Granted Aug 1, 2017·7 cites·20 claims
- 2588US9947621B2Structure and method to reduce copper loss during metal cap formationIBM·Filed 2016·Granted Apr 17, 2018·4 cites·12 claims
- 2688US9564310B1Metal-insulator-metal capacitor fabrication with unitary sputtering processIBM·Filed 2015·Granted Feb 7, 2017·4 cites·15 claims
- 2788US7800228B2Reliable via contact interconnect structureIBM·Filed 2006·Granted Sep 21, 2010·12 cites·12 claims
- 2887US11183455B2Interconnects with enlarged contact areaIBM·Filed 2020·Granted Nov 23, 2021·2 cites·7 claims
- 2987US10056391B2Vertically stacked FinFET fuseIBM·Filed 2017·Granted Aug 21, 2018·4 cites·18 claims
- 3087US9812522B2Metal-insulator-metal capacitor fabrication with unitary sputtering processIBM·Filed 2016·Granted Nov 7, 2017·4 cites·6 claims
- 3185US11239414B2Physical unclonable function for MRAM structuresIBM·Filed 2020·Granted Feb 1, 2022·2 cites·20 claims
- 3285US10672611B2Hardmask stress, grain, and structure engineering for advanced memory applicationsIBM·Filed 2018·Granted Jun 2, 2020·3 cites·12 claims
- 3385US9922941B1Thin low defect relaxed silicon germanium layers on bulk silicon substratesIBM·Filed 2016·Granted Mar 20, 2018·3 cites·14 claims
- 3484US10109740B2Programmable bulk FinFET antifusesIBM·Filed 2016·Granted Oct 23, 2018·4 cites·19 claims
- 3584US10038050B2FinFET resistor and method to fabricate sameIBM·Filed 2017·Granted Jul 31, 2018·3 cites·12 claims
- 3684US9876075B2Method of forming dielectric with air gaps for use in semiconductor devicesIBM·Filed 2015·Granted Jan 23, 2018·3 cites·20 claims
- 3784US8835326B2Titanium-nitride removalFITZSIMMONS JOHN A·Filed 2012·Granted Sep 16, 2014·6 cites·22 claims
- 3883US11430690B2Interconnects having air gap spacersIBM·Filed 2020·Granted Aug 30, 2022·1 cites·20 claims
- 3983US10446746B1ReRAM structure formed by a single processIBM·Filed 2018·Granted Oct 15, 2019·3 cites·10 claims
- 4082US10796911B2Hardmask stress, grain, and structure engineering for advanced memory applicationsIBM·Filed 2020·Granted Oct 6, 2020·1 cites·12 claims
- 4182US10340355B2Method of forming a dual metal interconnect structureIBM·Filed 2017·Granted Jul 2, 2019·3 cites·17 claims
- 4282US10312097B2Salicide bottom contactsIBM·Filed 2018·Granted Jun 4, 2019·2 cites·14 claims
- 4382US9954050B1Precise/designable FinFET resistor structureIBM·Filed 2016·Granted Apr 24, 2018·3 cites·11 claims
- 4481US11069854B2Laser anneal for MRAM encapsulation enhancementIBM·Filed 2019·Granted Jul 20, 2021·2 cites·10 claims
- 4581US10541202B2Programmable buried antifuseIBM·Filed 2018·Granted Jan 21, 2020·2 cites·12 claims
- 4681US10361277B2Low resistivity wrap-around contactsIBM·Filed 2018·Granted Jul 23, 2019·2 cites·8 claims
- 4781US10249501B2Single process for liner and metal fillIBM·Filed 2016·Granted Apr 2, 2019·2 cites·12 claims
- 4879US10950493B1Interconnects having air gap spacersIBM·Filed 2019·Granted Mar 16, 2021·2 cites·20 claims
- 4978US10546915B2Buried MIM capacitor structure with landing padsIBM·Filed 2017·Granted Jan 28, 2020·2 cites·14 claims
- 5078US10170360B2Reflow enhancement layer for metallization structuresIBM·Filed 2017·Granted Jan 1, 2019·2 cites·20 claims
Showing the top 50 of 195 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →