Inventor · disambiguated record
Ottmar Geitner
Also filed as: GEITNER OTTMAR
9 granted patents·1 pending application·198 citations·filing 2008–2017
88Inventor score
Technology areasH10W
Top patents by PatentIndex Score
10 records- 0198US8952521B2Semiconductor packages with integrated antenna and method of forming thereofINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 10, 2015·90 cites·28 claims
- 0295US7759163B2Semiconductor moduleINFINEON TECHNOLOGIES AG·Filed 2008·Granted Jul 20, 2010·49 cites·17 claims
- 0393US9275926B2Power module with cooling structure on bonding substrate for cooling an attached semiconductor chipINFINEON TECHNOLOGIES AG·Filed 2013·Granted Mar 1, 2016·22 cites·15 claims
- 0490US8669655B2Chip package and a method for manufacturing a chip packageGEITNER OTTMAR·Filed 2012·Granted Mar 11, 2014·26 cites·24 claims
- 0582US9589922B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Mar 7, 2017·5 cites·5 claims
- 0670US9532459B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 27, 2016·2 cites·12 claims
- 0767US11574889B2Power module comprising two substrates and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 7, 2023·2 cites·12 claims
- 0866US9585241B2Substrate, chip arrangement, and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2013·Granted Feb 28, 2017·2 cites·17 claims
- 0953US9847274B2Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2016·Granted Dec 19, 2017·0 cites·20 claims
- 1047US2017154835A1Electronic module and method of manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →