Inventor · disambiguated record
Paul J. Clawson
Also filed as: CLAWSON PAUL · CLAWSON PAUL J
5 granted patents·33 citations·filing 2007–2017
78Inventor score
Technology areasH10P
Top patents by PatentIndex Score
5 records- 0191US8053279B2Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 8, 2011·18 cites·26 claims
- 0289US8597074B2Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpiecesFARNWORTH WARREN M·Filed 2011·Granted Dec 3, 2013·9 cites·16 claims
- 0379US9579825B2Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpiecesMICRON TECHNOLOGY INC·Filed 2013·Granted Feb 28, 2017·3 cites·22 claims
- 0466US7825010B2Die singulation methodsMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 2, 2010·3 cites·30 claims
- 0556US11450577B2Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpiecesMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 20, 2022·0 cites·33 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →