Inventor · disambiguated record
Paolo Crema
Also filed as: CREMA PAOLO
17 granted patents·15 pending applications·76 citations·filing 1995–2025
91Inventor score
Top patents by PatentIndex Score
32 records- 0183US9822001B2Process for manufacturing a lid for an electronic device package, and lid for an electronic device packageST MICROELECTRONICS SRL·Filed 2013·Granted Nov 21, 2017·7 cites·25 claims
- 0280US11011476B2Lead frame surface finishingST MICROELECTRONICS INT NV·Filed 2019·Granted May 18, 2021·3 cites·19 claims
- 0378US10408952B2Radiation scintillator detector, detector package and manufacturing process thereofST MICROELECTRONICS SRL·Filed 2018·Granted Sep 10, 2019·2 cites·19 claims
- 0477US11977190B2Scintillator radiation detector and corresponding dosimeterST MICROELECTRONICS SRL·Filed 2020·Granted May 7, 2024·1 cites·20 claims
- 0574US12125803B2Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor deviceST MICROELECTRONICS SRL·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 0674US2024395680A1Anti-whisker counter measure using a method for multiple layer plating of a lead frameST MICROELECTRONICS SRL·Filed 2024·Application pending·0 cites
- 0765US12368055B2Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor deviceST MICROELECTRONICS SRL·Filed 2024·Granted Jul 22, 2025·0 cites·18 claims
- 0865US11610849B2Method of manufacturing semiconductor devices, corresponding apparatus and semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Mar 21, 2023·0 cites·24 claims
- 0964US11756899B2Lead frame surface finishingST MICROELECTRONICS SRL·Filed 2021·Granted Sep 12, 2023·0 cites·20 claims
- 1063US6468356B1Method for removing molding residues in the fabrication of plastic packages for semiconductor devicesST MICROELECTRONICS SRL·Filed 2000·Granted Oct 22, 2002·12 cites·42 claims
- 1163US2025146159A1Method of processing articles and corresponding apparatusST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1262US2023096480A1Anti-whisker counter measure using a method for multiple layer plating of a lead frameST MICROELECTRONICS SRL·Filed 2021·Application pending·0 cites
- 1361US9461011B2Method and apparatus for manufacturing lead framesST MICROELECTRONICS SRL·Filed 2013·Granted Oct 4, 2016·1 cites·21 claims
- 1460US11869832B2Leadframe package using selectively pre-plated leadframeST MICROELECTRONICS SRL·Filed 2020·Granted Jan 9, 2024·0 cites·19 claims
- 1559US6221696B1Process for improving the adhesion between metal and plastic in containment structures for electronic semiconductor devicesST MICROELECTRONICS SRL·Filed 1999·Granted Apr 24, 2001·28 cites·16 claims
- 1658US2024332106A1Semiconductor device, corresponding manufacturing method and substrate for use thereinST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1756US2023002924A1Method for inhibiting tin whisker growthST MICROELECTRONICS SRL·Filed 2021·Application pending·0 cites
- 1856US2025372488A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 1955US11640931B2Die attachment method and material between a semiconductor device and die pad of a leadframeST MICROELECTRONICS SRL·Filed 2020·Granted May 2, 2023·0 cites·20 claims
- 2054US2024179847A1Palladium plating catalyst layer by laser induced forward transferST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2154US2023170283A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 2253US10763195B2Leadframe package using selectively pre-plated leadframeST MICROELECTRONICS SRL·Filed 2018·Granted Sep 1, 2020·0 cites·20 claims
- 2351US11948806B2Method of manufacturing multi-die semiconductor devices and corresponding multi-die semiconductor deviceST MICROELECTRONICS SRL·Filed 2021·Granted Apr 2, 2024·0 cites·23 claims
- 2448US5789279AMethod and apparatus for electrically insulating heat sinks in electronic power devicesST MICROELECTRONICS SRL·Filed 1995·Granted Aug 4, 1998·16 cites·34 claims
- 2540US2006060947A1Method and apparatus for removing molding residues from lead-framesST MICROELECTRONICS SRL·Filed 2005·Application pending·0 cites
- 2640US2017122195A1Engine group comprising a mixed fuel engine, and fuel supplying method therofST MICROELECTRONICS SRL·Filed 2016·Application pending·0 cites
- 2736US2018053709A1Method for manufacturing semiconductor devices, and corresponding deviceST MICROELECTRONICS SRL·Filed 2017·Application pending·0 cites
- 2835US6291893B1Power semiconductor device for “flip-chip” connectionsST MICROELECTRONICS SRL·Filed 1999·Granted Sep 18, 2001·6 cites·18 claims
- 2935US2019181076A1Method of manufacturing leadframes of semiconductor devices,corresponding leadframe and semiconductor deviceST MICROELECTRONICS SRL·Filed 2018·Application pending·0 cites
- 3034US2016315059A1Method of producing bumps in electronic components, corresponding component and computer program productST MICROELECTRONICS SRL·Filed 2015·Application pending·0 cites
- 3131US2016099200A1Aluminum alloy lead frame for a semiconductor device and corresponding manufacturing processST MICROELECTRONICS SRL·Filed 2015·Application pending·0 cites
- 3227US2001008139A1Method for removing molding residues in the fabrication of plastic packages for semiconductor devicesFiled 1998·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Paolo Crema files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →