Inventor · disambiguated record
Pawel Czubarow
Also filed as: CZUBAROW PAWEL
22 granted patents·15 pending applications·275 citations·filing 1994–2022
95Inventor score
Top patents by PatentIndex Score
37 records- 0195US5455000AMethod for preparation of a functionally gradient materialMASSACHUSETTS INST TECHNOLOGY·Filed 1994·Granted Oct 3, 1995·90 cites·59 claims
- 0287US10141090B2Resin composition, paste for forming a varistor element, and varistor elementNAMICS CORP·Filed 2018·Granted Nov 27, 2018·3 cites·11 claims
- 0386US8470936B2Liquid epoxy resin composition for semiconductor encapsulationCZUBAROW PAWEL·Filed 2011·Granted Jun 25, 2013·4 cites·10 claims
- 0486US6663704B2Pearlescent inks, writing instruments, and methodsBEROL CORP·Filed 2001·Granted Dec 16, 2003·28 cites·39 claims
- 0586US6599353B2Shear-thinning writing compositions, writing instruments, and methodsBEROL CORP·Filed 2001·Granted Jul 29, 2003·24 cites·47 claims
- 0682US5720859AMethod of forming an electrode on a substrateRAYCHEM CORP·Filed 1997·Granted Feb 24, 1998·37 cites·26 claims
- 0781US7476339B2Highly filled thermoplastic compositesSAINT GOBAIN CERAMICS·Filed 2006·Granted Jan 13, 2009·9 cites·14 claims
- 0880US6749676B2Erasable inks, writing instruments, and methodsBEROL CORP·Filed 2001·Granted Jun 15, 2004·14 cites·30 claims
- 0977US11700770B1Semiconductor with coaxial P-type and N-type materialCZUBAROW PAWEL·Filed 2022·Granted Jul 11, 2023·0 cites·5 claims
- 1076US7906373B1Thermally enhanced electrically insulative adhesive pasteCZUBAROW PAWEL·Filed 2008·Granted Mar 15, 2011·3 cites·26 claims
- 1175US12096694B2Precursor derived semiconductor devices having PN junctionsCZUBAROW PAWEL·Filed 2022·Granted Sep 17, 2024·0 cites·2 claims
- 1270US11935673B2Varistor forming paste, cured product thereof, and varistorNAMICS CORP·Filed 2020·Granted Mar 19, 2024·0 cites·13 claims
- 1370US8865996B2Thermoelectric generator including nanofibersCZUBAROW PAWEL·Filed 2008·Granted Oct 21, 2014·1 cites·9 claims
- 1468US6030681AMagnetic disk comprising a substrate with a cermet layer on a porcelainRAYCHEM CORP·Filed 1997·Granted Feb 29, 2000·27 cites·22 claims
- 1566US8309645B2Thermally stable composite material formed of polyimideSWEI GWO S·Filed 2007·Granted Nov 13, 2012·1 cites·26 claims
- 1666US6986809B2Erasable inks, writing instruments, and methodsBEROL CORP·Filed 2004·Granted Jan 17, 2006·5 cites·22 claims
- 1765US5863468APreparation of calcined ceramic powdersRAYCHEM CORP·Filed 1997·Granted Jan 26, 1999·19 cites·24 claims
- 1864US12304818B2Porous carbon and resin compositionNAMICS CORP·Filed 2020·Granted May 20, 2025·0 cites·11 claims
- 1958US11527695B2Fiber based thermoelectric deviceEM TECH·Filed 2020·Granted Dec 13, 2022·0 cites·8 claims
- 2056US2015211152A1Method of making ceramic nanofibersCZUBAROW PAWEL·Filed 2014·Application pending·0 cites
- 2155US9670377B2Underfill composition for encapsulating a bond lineNAMICS CORP·Filed 2014·Granted Jun 6, 2017·0 cites·19 claims
- 2250US2009257816A1Erasable ink for porous tip writing instrumentsCZUBAROW PAWEL·Filed 2008·Application pending·0 cites
- 2348US6020447ASonichemical synthesis of silicon carbide precursors and methods for preparation thereofMASSACHUSETTS INST TECHNOLOGY·Filed 1997·Granted Feb 1, 2000·10 cites·8 claims
- 2448US2008224366A1Water resistant composite materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2007·Application pending·0 cites
- 2547US8344523B2Conductive compositionDIEMAT INC·Filed 2009·Granted Jan 1, 2013·0 cites·45 claims
- 2647US2005197436A1Flame resistant thermal interface materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2004·Application pending·0 cites
- 2747US2007154717A1Thermally stable composite materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2005·Application pending·0 cites
- 2846US2007155949A1Thermally stable composite materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2005·Application pending·0 cites
- 2946US2012009005A1Erasable ink for porous tip writing instrumentsCZUBAROW PAWEL·Filed 2011·Application pending·0 cites
- 3045US2022144993A1Photocurable resin composition and cured product obtained by curing the sameNAMICS CORP·Filed 2020·Application pending·0 cites
- 3144US2023229079A1Photosensitive resin composition, cured product thereof, and wiring structure containing cured productNAMICS CORP·Filed 2021·Application pending·0 cites
- 3241US2007152195A1Electrostatic dissipative composite materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2005·Application pending·0 cites
- 3340US2006228542A1Thermal interface material having spheroidal particulate fillerSAINT GOBAIN PERFORMANCE PLAST·Filed 2005·Application pending·0 cites
- 3439US2007154716A1Composite materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2005·Application pending·0 cites
- 3538US2013026660A1Liquid epoxy resin composition for semiconductor encapsulation, and semiconductor device using the sameNAMICS CORP·Filed 2011·Application pending·0 cites
- 3637US2012172495A1Underfill for high density interconnect flip chipsCZUBAROW PAWEL·Filed 2010·Application pending·0 cites
- 3731US2005072334A1Thermal interface materialSAINT GOBAIN PERFORMANCE PLAST·Filed 2003·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →