Inventor · disambiguated record
Paul M. Enquist
Also filed as: ENQUIST PAUL · ENQUIST PAUL M
86 granted patents·8 pending applications·5,860 citations·filing 1992–2025
99Inventor score
Files withZIPTRONIX INC36INVENSAS BONDING TECH INC23ADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC14ZIPTRONIX8RES TRIANGLE INST6
Top patents by PatentIndex Score
94 records- 0199US12113056B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Oct 8, 2024·6 cites·53 claims
- 0299US11916054B2Stacked devices and methods of fabricationADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Feb 27, 2024·6 cites·18 claims
- 0399US11837596B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Dec 5, 2023·10 cites·35 claims
- 0499US11658173B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted May 23, 2023·19 cites·27 claims
- 0599US11276676B2Stacked devices and methods of fabricationINVENSAS BONDING TECH INC·Filed 2019·Granted Mar 15, 2022·156 cites·15 claims
- 0699US10204893B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2016·Granted Feb 12, 2019·203 cites·30 claims
- 0799US10147641B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 4, 2018·47 cites·24 claims
- 0899US9953941B2Conductive barrier direct hybrid bondingINVENSAS BONDING TECH INC·Filed 2015·Granted Apr 24, 2018·251 cites·15 claims
- 0999US9391143B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2015·Granted Jul 12, 2016·117 cites·33 claims
- 1099US9331149B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2015·Granted May 3, 2016·185 cites·60 claims
- 1199US9184125B2Heterogeneous annealing method and deviceZIPTRONIX INC·Filed 2013·Granted Nov 10, 2015·205 cites·23 claims
- 1299US9171756B23D IC method and deviceZIPTRONIX INC·Filed 2014·Granted Oct 27, 2015·232 cites·33 claims
- 1399US7485968B23D IC method and deviceZIPTRONIX INC·Filed 2005·Granted Feb 3, 2009·433 cites·41 claims
- 1499US7126212B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2001·Granted Oct 24, 2006·247 cites·56 claims
- 1599US6902987B1Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2000·Granted Jun 7, 2005·227 cites·147 claims
- 1699US6867073B1Single mask via method and deviceZIPTRONIX INC·Filed 2003·Granted Mar 15, 2005·216 cites·48 claims
- 1798US12266650B2Stacked dies and methods for forming bonded structuresADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Apr 1, 2025·3 cites·19 claims
- 1898US12199069B2Heterogeneous annealing method and deviceADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2022·Granted Jan 14, 2025·3 cites·21 claims
- 1998US11631586B2Heterogeneous annealing methodADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2020·Granted Apr 18, 2023·4 cites·22 claims
- 2098US10879226B2Stacked dies and methods for forming bonded structuresINVENSAS BONDING TECH INC·Filed 2019·Granted Dec 29, 2020·21 cites·24 claims
- 2198US10522499B2Bonded structuresINVENSAS BONDING TECH INC·Filed 2017·Granted Dec 31, 2019·137 cites·28 claims
- 2298US10446532B2Systems and methods for efficient transfer of semiconductor elementsINVENSAS BONDING TECH INC·Filed 2016·Granted Oct 15, 2019·161 cites·23 claims
- 2398US10269708B2Increased contact alignment tolerance for direct bondingINVENSAS BONDING TECH INC·Filed 2017·Granted Apr 23, 2019·49 cites·20 claims
- 2498US10262963B2Conductive barrier direct hybrid bondingINVENSAS BONDING TECH INC·Filed 2018·Granted Apr 16, 2019·19 cites·14 claims
- 2598US9852988B2Increased contact alignment tolerance for direct bondingINVENSAS BONDING TECH INC·Filed 2016·Granted Dec 26, 2017·218 cites·20 claims
- 2698US9716033B23D IC method and deviceZIPTRONIX INC·Filed 2015·Granted Jul 25, 2017·29 cites·22 claims
- 2798US9564414B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2015·Granted Feb 7, 2017·37 cites·22 claims
- 2898US9431368B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2016·Granted Aug 30, 2016·194 cites·19 claims
- 2998US9385024B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2014·Granted Jul 5, 2016·211 cites·16 claims
- 3098US8524533B2Room temperature metal direct bondingTONG QIN-YI·Filed 2010·Granted Sep 3, 2013·217 cites·25 claims
- 3198US7041178B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2003·Granted May 9, 2006·129 cites·44 claims
- 3298US6962835B2Method for room temperature metal direct bondingZIPTRONIX INC·Filed 2003·Granted Nov 8, 2005·235 cites·176 claims
- 3398US6500694B1Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2000·Granted Dec 31, 2002·156 cites·37 claims
- 3497US9082627B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2014·Granted Jul 14, 2015·20 cites·47 claims
- 3597US8153505B2Method for low temperature bonding and bonded structureTONG QIN-YI·Filed 2010·Granted Apr 10, 2012·27 cites·230 claims
- 3697US7807549B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2007·Granted Oct 5, 2010·41 cites·112 claims
- 3797US7553744B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2007·Granted Jun 30, 2009·35 cites·51 claims
- 3897US6984571B1Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 1999·Granted Jan 10, 2006·162 cites·80 claims
- 3997US6864585B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2002·Granted Mar 8, 2005·114 cites·99 claims
- 4097US6822326B2Wafer bonding hermetic encapsulationZIPTRONIX·Filed 2002·Granted Nov 23, 2004·175 cites·39 claims
- 4196US11289372B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2021·Granted Mar 29, 2022·2 cites·30 claims
- 4296US8735219B2Heterogeneous annealing method and deviceENQUIST PAUL M·Filed 2012·Granted May 27, 2014·23 cites·33 claims
- 4396US7602070B2Room temperature metal direct bondingZIPTRONIX INC·Filed 2005·Granted Oct 13, 2009·33 cites·110 claims
- 4496US7387944B2Method for low temperature bonding and bonded structureZIPTRONIX INC·Filed 2004·Granted Jun 17, 2008·68 cites·96 claims
- 4595US12347820B2Stacked devices and methods of fabricationADEIA SEMICONDUCTOR BONDING TECHNOLOGIES INC·Filed 2023·Granted Jul 1, 2025·1 cites·13 claims
- 4695US8709938B23D IC method and deviceZIPTRONIX INC·Filed 2013·Granted Apr 29, 2014·13 cites·19 claims
- 4795US6627531B2Three dimensional device integration method and integrated deviceZIPTRONIX INC·Filed 2001·Granted Sep 30, 2003·73 cites·118 claims
- 4894US11011418B23D IC method and deviceINVENSAS BONDING TECH INC·Filed 2018·Granted May 18, 2021·5 cites·36 claims
- 4994US9698126B2Heterogeneous annealing method and deviceZIPTRONIX INC·Filed 2015·Granted Jul 4, 2017·7 cites·9 claims
- 5094US7622324B2Wafer bonding hermetic encapsulationZIPTRONIX·Filed 2004·Granted Nov 24, 2009·85 cites·95 claims
Showing the top 50 of 94 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Paul M. Enquist files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →