Inventor · disambiguated record
Paul B. Fischer
Also filed as: FISCHER PAUL · FISCHER PAUL B
110 granted patents·37 pending applications·292 citations·filing 1994–2025
99Inventor score
Top patents by PatentIndex Score
147 records- 0198US11594524B2Fabrication and use of through silicon vias on double sided interconnect deviceINTEL CORP·Filed 2022·Granted Feb 28, 2023·6 cites·20 claims
- 0297US10797139B2Methods of forming backside self-aligned vias and structures formed therebyINTEL CORP·Filed 2019·Granted Oct 6, 2020·22 cites·20 claims
- 0396US10872820B2Integrated circuit structuresINTEL CORP·Filed 2017·Granted Dec 22, 2020·22 cites·11 claims
- 0495US12176323B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Dec 24, 2024·2 cites·12 claims
- 0594US5595526AMethod and apparatus for endpoint detection in a chemical/mechanical process for polishing a substrateINTEL CORP·Filed 1994·Granted Jan 21, 1997·91 cites·14 claims
- 0692US10367070B2Methods of forming backside self-aligned vias and structures formed therebyINTEL CORP·Filed 2015·Granted Jul 30, 2019·8 cites·21 claims
- 0791US11251156B2Fabrication and use of through silicon vias on double sided interconnect deviceINTEL CORP·Filed 2015·Granted Feb 15, 2022·8 cites·20 claims
- 0889US9921640B2Integrated voltage regulators with magnetically enhanced inductorsINTEL CORP·Filed 2012·Granted Mar 20, 2018·12 cites·24 claims
- 0988US11043627B2Techniques for monolithic co-integration of thin-film bulk acoustic resonator devices and III-N semiconductor transistor devicesINTEL CORP·Filed 2016·Granted Jun 22, 2021·5 cites·20 claims
- 1088US10396045B2Metal on both sides of the transistor integrated with magnetic inductorsINTEL CORP·Filed 2015·Granted Aug 27, 2019·6 cites·20 claims
- 1186US11037817B2Apparatus with multi-wafer based device and method for forming suchINTEL CORP·Filed 2017·Granted Jun 15, 2021·4 cites·16 claims
- 1285US11948831B2Apparatus with multi-wafer based device and method for forming suchINTEL CORP·Filed 2021·Granted Apr 2, 2024·1 cites·25 claims
- 1384US11348897B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted May 31, 2022·3 cites·7 claims
- 1482US11430873B2Self aligned gate connected plates for group III-Nitride devices and methods of fabricationINTEL CORP·Filed 2018·Granted Aug 30, 2022·3 cites·20 claims
- 1582US9786559B2Process and material for preventing deleterious expansion of high aspect ratio copper filled through silicon vias (TSVs)INTEL CORP·Filed 2016·Granted Oct 10, 2017·3 cites·12 claims
- 1681US11380679B2FET capacitor circuit architectures for tunable load and input matchingINTEL CORP·Filed 2018·Granted Jul 5, 2022·3 cites·17 claims
- 1781US10979012B2Single-flipped resonator devices with 2DEG bottom electrodeINTEL CORP·Filed 2016·Granted Apr 13, 2021·3 cites·20 claims
- 1881US2025070083A1Microelectronic assembliesINTEL CORP·Filed 2024·Application pending·0 cites
- 1980US11515407B2High breakdown voltage structure for high performance GaN-based HEMT and MOS devices to enable GaN C-MOSINTEL CORP·Filed 2018·Granted Nov 29, 2022·2 cites·23 claims
- 2080US10720345B1Wafer to wafer bonding with low wafer distortionINTEL CORP·Filed 2018·Granted Jul 21, 2020·3 cites·13 claims
- 2179US11387329B2Tri-gate architecture multi-nanowire confined transistorINTEL CORP·Filed 2018·Granted Jul 12, 2022·2 cites·20 claims
- 2279US11335777B2Integrated circuit components with substrate cavitiesINTEL CORP·Filed 2017·Granted May 17, 2022·2 cites·22 claims
- 2378US11588037B2Planar transistors with wrap-around gates and wrap-around source and drain contactsINTEL CORP·Filed 2019·Granted Feb 21, 2023·2 cites·20 claims
- 2478US11538804B2Stacked integration of III-N transistors and thin-film transistorsINTEL CORP·Filed 2019·Granted Dec 27, 2022·2 cites·18 claims
- 2578US11502124B2Filter-centric III-N films enabling RF filter integration with III-N transistorsINTEL CORP·Filed 2019·Granted Nov 15, 2022·2 cites·20 claims
- 2677US11393777B2Microelectronic assembliesINTEL CORP·Filed 2017·Granted Jul 19, 2022·2 cites·18 claims
- 2777US11056532B2Techniques for monolithic co-integration of polycrystalline thin-film bulk acoustic resonator devices and monocrystalline III-N semiconductor transistor devicesINTEL CORP·Filed 2016·Granted Jul 6, 2021·2 cites·18 claims
- 2877US10658475B2Transistors with vertically opposed source and drain metal interconnect layersINTEL CORP·Filed 2016·Granted May 19, 2020·2 cites·20 claims
- 2976US2024194533A1Integrated circuit device structures and double-sided electrical testingINTEL CORP·Filed 2023·Application pending·0 cites
- 3075US11557667B2Group III-nitride devices with improved RF performance and their methods of fabricationINTEL CORP·Filed 2017·Granted Jan 17, 2023·2 cites·17 claims
- 3175US10672884B2Schottky diodes on semipolar planes of group III-N material structuresINTEL CORP·Filed 2016·Granted Jun 2, 2020·2 cites·20 claims
- 3274US10453679B2Methods and devices integrating III-N transistor circuitry with Si transistor circuitryINTEL CORP·Filed 2015·Granted Oct 22, 2019·2 cites·16 claims
- 3374US7476974B2Method to fabricate interconnect structuresINTEL CORP·Filed 2006·Granted Jan 13, 2009·4 cites·12 claims
- 3474US7105925B2Differential planarizationINTEL CORP·Filed 2005·Granted Sep 12, 2006·6 cites·9 claims
- 3574US2025040231A1Gallium nitride (gan) three-dimensional integrated circuit technologyINTEL CORP·Filed 2024·Application pending·0 cites
- 3673US12080763B2Silicide for group III-nitride devices and methods of fabricationINTEL CORP·Filed 2022·Granted Sep 3, 2024·0 cites·20 claims
- 3773US10840341B2Semiconductor devices, radio frequency devices and methods for forming semiconductor devicesINTEL CORP·Filed 2018·Granted Nov 17, 2020·1 cites·25 claims
- 3872US11881511B2Superlattice FINFET with tunable drive current capabilityINTEL CORP·Filed 2018·Granted Jan 23, 2024·1 cites·14 claims
- 3972US11594452B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2020·Granted Feb 28, 2023·0 cites·24 claims
- 4072US2025231358A1Gallium nitride (gan) integrated circuit technology with optical communicationINTEL CORP·Filed 2025·Application pending·0 cites
- 4171US11721649B2Microelectronic assembliesINTEL CORP·Filed 2022·Granted Aug 8, 2023·0 cites·11 claims
- 4270US11854894B2Integrated circuit device structures and double-sided electrical testingINTEL CORP·Filed 2020·Granted Dec 26, 2023·0 cites·8 claims
- 4370US11670637B2Logic circuit with indium nitride quantum wellINTEL CORP·Filed 2019·Granted Jun 6, 2023·1 cites·26 claims
- 4469US10673405B2Film bulk acoustic resonator (FBAR) devices with 2DEG bottom electrodeINTEL CORP·Filed 2016·Granted Jun 2, 2020·1 cites·20 claims
- 4569US10490449B2Techniques for revealing a backside of an integrated circuit device, and associated configurationsINTEL CORP·Filed 2015·Granted Nov 26, 2019·1 cites·9 claims
- 4669US9177831B2Die assembly on thin dielectric sheetCHIU CHIA-PIN·Filed 2013·Granted Nov 3, 2015·2 cites·15 claims
- 4769US8513966B2Probes formed from semiconductor region viasMA QING·Filed 2010·Granted Aug 20, 2013·2 cites·10 claims
- 4869US7087517B2Method to fabricate interconnect structuresINTEL CORP·Filed 2003·Granted Aug 8, 2006·11 cites·11 claims
- 4968US11037916B2Apparatus with multi-wafer based device comprising embedded active devices and method for forming suchINTEL CORP·Filed 2017·Granted Jun 15, 2021·1 cites·18 claims
- 5067US11671075B2Film bulk acoustic resonator (FBAR) devices for high frequency RF filtersINTEL CORP·Filed 2020·Granted Jun 6, 2023·0 cites·18 claims
Showing the top 50 of 147 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →