Inventor · disambiguated record
Paul R. Hoffman
Also filed as: HOFFMAN PAUL · HOFFMAN PAUL R · HOFFMAN PAUL ROBERT · ZOBA DAVID ALBERT
65 granted patents·27 pending applications·3,732 citations·filing 1975–2025
99Inventor score
Top patents by PatentIndex Score
92 records- 0199US6737750B1Structures for improving heat dissipation in stacked semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2001·Granted May 18, 2004·310 cites·31 claims
- 0298US6919631B1Structures for improving heat dissipation in stacked semiconductor packagesAMKOR TECHNOLOGY INC·Filed 2004·Granted Jul 19, 2005·154 cites·24 claims
- 0398US6759266B1Quick sealing glass-lidded package fabrication methodAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 6, 2004·220 cites·27 claims
- 0498US6603183B1Quick sealing glass-lidded packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Aug 5, 2003·217 cites·31 claims
- 0596US11828795B1Test system with a thermal head comprising a plurality of adapters for independent thermal control of zonesAEM HOLDINGS LTD·Filed 2022·Granted Nov 28, 2023·10 cites·31 claims
- 0696US11796589B1Thermal head for independent control of zonesAEM HOLDINGS LTD·Filed 2022·Granted Oct 24, 2023·4 cites·30 claims
- 0796US11693051B1Thermal head for independent control of zonesAEM HOLDINGS LTD·Filed 2022·Granted Jul 4, 2023·7 cites·30 claims
- 0896US11656272B1Test system with a thermal head comprising a plurality of adapters and one or more cold plates for independent control of zonesAEM HOLDINGS LTD·Filed 2022·Granted May 23, 2023·11 cites·25 claims
- 0995US5578869AComponents for housing an integrated circuit deviceOLIN CORP·Filed 1994·Granted Nov 26, 1996·278 cites·34 claims
- 1094US12205881B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2023·Granted Jan 21, 2025·2 cites·30 claims
- 1194US7045883B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2005·Granted May 16, 2006·44 cites·22 claims
- 1293US6614102B1Shielded semiconductor leadframe packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Sep 2, 2003·128 cites·40 claims
- 1393US6597059B1Thermally enhanced chip scale lead on chip semiconductor packageAMKOR TECHNOLOGY INC·Filed 2001·Granted Jul 22, 2003·91 cites·17 claims
- 1493US6414396B1Package for stacked integrated circuitsAMKOR TECHNOLOGY INC·Filed 2000·Granted Jul 2, 2002·85 cites·23 claims
- 1593US4005435ALiquid jet droplet generatorBURROUGHS CORP·Filed 1975·Granted Jan 25, 1977·127 cites·16 claims
- 1692US6707168B1Shielded semiconductor package with single-sided substrate and method for making the sameAMKOR TECHNOLOGY INC·Filed 2001·Granted Mar 16, 2004·115 cites·21 claims
- 1792US5629835AMetal ball grid array package with improved thermal conductivityOLIN CORP·Filed 1994·Granted May 13, 1997·138 cites·13 claims
- 1892US4534562APlaying card coding system and apparatus for dealing coded cardsTYLER GRIFFIN COMPANY·Filed 1983·Granted Aug 13, 1985·476 cites·6 claims
- 1991US12424527B2Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·1 cites·27 claims
- 2090US6462274B1Chip-scale semiconductor package of the fan-out type and method of manufacturing such packagesAMKOR TECHNOLOGY INC·Filed 1999·Granted Oct 8, 2002·127 cites·43 claims
- 2188US5189363AIntegrated circuit testing system having a cantilevered contact lead probe pattern mounted on a flexible tape for interconnecting an integrated circuit to a testerIBM·Filed 1990·Granted Feb 23, 1993·66 cites·38 claims
- 2288US2025391814A1Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 2387US6873032B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2003·Granted Mar 29, 2005·44 cites·17 claims
- 2487US6632997B2Personalized circuit module package and method for packaging circuit modulesAMKOR TECHNOLOGY INC·Filed 2001·Granted Oct 14, 2003·38 cites·20 claims
- 2586US6630661B1Sensor module with integrated discrete components mounted on a windowAMKOR TECHNOLOGY INC·Filed 2001·Granted Oct 7, 2003·39 cites·20 claims
- 2686US6262477B1Ball grid array electronic packageADVANCED INTERCONNECT TECH LTD·Filed 1993·Granted Jul 17, 2001·88 cites·28 claims
- 2786US3972051AAir turbulence control of inflight ink droplets in non-impact recordersBURROUGHS CORP·Filed 1975·Granted Jul 27, 1976·31 cites·14 claims
- 2885US6028354AMicroelectronic device package having a heat sink structure for increasing the thermal conductivity of the packageAMKOR TECHNOLOGY INC·Filed 1997·Granted Feb 22, 2000·72 cites·36 claims
- 2985US5477008APolymer plug for electronic packagesOLIN CORP·Filed 1993·Granted Dec 19, 1995·95 cites·10 claims
- 3084US5399805AMetal electronic package with reduced seal widthOLIN CORP·Filed 1993·Granted Mar 21, 1995·66 cites·19 claims
- 3183US2025336888A1Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 3282US6576998B1Thin semiconductor package with semiconductor chip and electronic discrete deviceAMKOR TECHNOLOGY INC·Filed 2002·Granted Jun 10, 2003·32 cites·32 claims
- 3381US12362322B2Method of making a fan-out semiconductor assembly with an intermediate carrierDECA TECH USA INC·Filed 2024·Granted Jul 15, 2025·0 cites·21 claims
- 3481US6300673B1Edge connectable metal packageADVANCED INTERCONNECT TECH LTD·Filed 1995·Granted Oct 9, 2001·56 cites·17 claims
- 3580US12259427B2Thermal head comprising a plurality of adapters for independent thermal control of zonesAEM SINGAPORE PTE LTD·Filed 2023·Granted Mar 25, 2025·0 cites·22 claims
- 3680US5506446AElectronic package having improved wire bonding capabilityOLIN CORP·Filed 1995·Granted Apr 9, 1996·67 cites·34 claims
- 3780US2024329120A1Thermal head comprising a plurality of adapters for independent thermal control of zonesAEM SINGAPORE PTE LTD·Filed 2024·Application pending·0 cites
- 3879US5805427ABall grid array electronic package standoff designOLIN CORP·Filed 1996·Granted Sep 8, 1998·62 cites·26 claims
- 3976US12469776B2Semiconductor assembly comprising a 3D block and method of making the sameDECA TECH USA INC·Filed 2025·Granted Nov 11, 2025·0 cites·20 claims
- 4076US4359763AFloppy disc driveEXXON RESEARCH ENGINEERING CO·Filed 1980·Granted Nov 16, 1982·19 cites·12 claims
- 4175US5324888AMetal electronic package with reduced seal widthOLIN CORP·Filed 1992·Granted Jun 28, 1994·45 cites·34 claims
- 4274US12300561B2Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2024·Granted May 13, 2025·0 cites·21 claims
- 4374US7064009B1Thermally enhanced chip scale lead on chip semiconductor package and method of making sameAMKOR TECHNOLOGY INC·Filed 2004·Granted Jun 20, 2006·22 cites·17 claims
- 4473US5455386AChamfered electronic package componentOLIN CORP·Filed 1994·Granted Oct 3, 1995·50 cites·17 claims
- 4573US2025372395A1EMBEDDED COMPONENT INTERPOSER OR SUBSTRATE COMPRISING DISPLACEMENT COMPENSATION TRACES (DCTs) AND METHOD OF MAKING THE SAMEDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 4673US2024421051A1Multi-chip or multi-chiplet fan-out device for laminate and leadframe packagesDECA TECH USA INC·Filed 2024·Application pending·0 cites
- 4772US2025273526A1Fully molded structure with multi-height components comprising backside conductive material and method for making the sameDECA TECH USA INC·Filed 2025·Application pending·0 cites
- 4870US12424450B2Embedded component interposer or substrate comprising displacement compensation traces (DCTs) and method of making the sameDECA TECH USA INC·Filed 2024·Granted Sep 23, 2025·0 cites·24 claims
- 4970US5360942AMulti-chip electronic package module utilizing an adhesive sheetOLIN CORP·Filed 1993·Granted Nov 1, 1994·41 cites·23 claims
- 5070US5266107APearlscent pigment and process for producing the sameMERCK PATENT GMBH·Filed 1992·Granted Nov 30, 1993·19 cites·10 claims
Showing the top 50 of 92 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →