Inventor · disambiguated record
Pak Leung
Also filed as: LEUNG PAK · LEUNG PAK Y
6 granted patents·64 citations·filing 1995–2011
82Inventor score
Files withINFINEON TECHNOLOGIES AG2IBM1LINIGER ERIC G1UNITED MICROELECTRONICS CORP1VICTORY CONCEPT IND LTD1
Top patents by PatentIndex Score
6 records- 0194US7790601B1Forming interconnects with air gapsIBM·Filed 2009·Granted Sep 7, 2010·26 cites·18 claims
- 0278US9018089B2Multiple step anneal method and semiconductor formed by multiple step annealLINIGER ERIC G·Filed 2011·Granted Apr 28, 2015·6 cites·21 claims
- 0375USD369163STelephone setVICTORY CONCEPT IND LTD·Filed 1995·Granted Apr 23, 1996·26 cites·1 claims
- 0464US7875544B2Method of producing a semiconductor interconnect architecture including generation of metal holes by via mutationINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 25, 2011·2 cites·7 claims
- 0552US7188321B2Generation of metal holes by via mutationUNITED MICROELECTRONICS CORP·Filed 2003·Granted Mar 6, 2007·4 cites·9 claims
- 0649US8378493B2Generation of metal holes by via mutationINFINEON TECHNOLOGIES AG·Filed 2010·Granted Feb 19, 2013·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →