Inventor · disambiguated record
Paul A. Silvestri
Also filed as: SILVESTRI PAUL · SILVESTRI PAUL A
35 granted patents·3 pending applications·397 citations·filing 2001–2021
98Inventor score
Top patents by PatentIndex Score
38 records- 0196US8937309B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Jan 20, 2015·48 cites·13 claims
- 0296US8552567B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationENGLAND LUKE G·Filed 2011·Granted Oct 8, 2013·36 cites·22 claims
- 0395US9379091B2Semiconductor die assemblies and semiconductor devices including sameMICRON TECHNOLOGY INC·Filed 2014·Granted Jun 28, 2016·15 cites·22 claims
- 0494US7327592B2Self-identifying stacked die semiconductor componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Feb 5, 2008·25 cites·28 claims
- 0592US9153520B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsGROOTHUIS STEVEN K·Filed 2012·Granted Oct 6, 2015·17 cites·21 claims
- 0691US6385129B1Delay locked loop monitor test modeMICRON TECHNOLOGY INC·Filed 2001·Granted May 7, 2002·65 cites·47 claims
- 0790US9711494B2Methods of fabricating semiconductor die assembliesMICRON TECHNOLOGY INC·Filed 2015·Granted Jul 18, 2017·7 cites·16 claims
- 0890US7489587B2Semiconductor memory device capable of controlling clock cycle time for reduced power consumptionMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 10, 2009·14 cites·14 claims
- 0988US8245176B2Integrated circuit apparatus, systems, and methodsSILVESTRI PAUL A·Filed 2011·Granted Aug 14, 2012·7 cites·21 claims
- 1085US7075856B2Apparatus for latency specific duty cycle correctionMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 11, 2006·12 cites·30 claims
- 1183US10170389B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2015·Granted Jan 1, 2019·3 cites·16 claims
- 1282US8828798B2Semiconductor die assemblies, semiconductor devices including same, and methods of fabricationMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 9, 2014·4 cites·18 claims
- 1382US8001513B2Integrated circuit apparatus, systems, and methodsMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 16, 2011·7 cites·23 claims
- 1482US7319728B2Delay locked loop with frequency controlMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 15, 2008·23 cites·39 claims
- 1582US7262637B2Output buffer and method having a supply voltage insensitive slew rateMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 28, 2007·9 cites·69 claims
- 1681US6768697B2Method and apparatus for latency specific duty cycle correctionMICRON TECHNOLOGY INC·Filed 2002·Granted Jul 27, 2004·25 cites·46 claims
- 1778US6900685B2Tunable delay circuitMICRON TECHNOLOGY INC·Filed 2002·Granted May 31, 2005·16 cites·25 claims
- 1877US7729197B2Memory device having a delay locked loop with frequency controlMICRON TECHNOLOGY INC·Filed 2009·Granted Jun 1, 2010·6 cites·20 claims
- 1975US10741468B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2018·Granted Aug 11, 2020·1 cites·11 claims
- 2073US7332946B2Power supply voltage detection circuitry and methods for use of the sameMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 19, 2008·7 cites·13 claims
- 2171US11594462B2Stacked semiconductor die assemblies with multiple thermal paths and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2020·Granted Feb 28, 2023·0 cites·15 claims
- 2271US7148742B2Power supply voltage detection circuitry and methods for use of the sameMICRON TECHNOLOGY INC·Filed 2004·Granted Dec 12, 2006·15 cites·39 claims
- 2368US9735136B2Method for embedding silicon die into a stacked packageSILVESTRI PAUL·Filed 2009·Granted Aug 15, 2017·3 cites·19 claims
- 2467US8144497B2Self-identifying stacked die semiconductor componentsSILVESTRI PAUL·Filed 2009·Granted Mar 27, 2012·4 cites·26 claims
- 2566US8499271B2Integrated circuit apparatus, systems, and methodsSILVESTRI PAUL A·Filed 2012·Granted Jul 30, 2013·1 cites·21 claims
- 2666US8472232B2Self-identifying stacked die semiconductor componentsSILVESTRI PAUL·Filed 2012·Granted Jun 25, 2013·2 cites·51 claims
- 2766US6920081B2Apparatus for latency specific duty cycle correctionMICRON TECHNOLOGY INC·Filed 2004·Granted Jul 19, 2005·11 cites·9 claims
- 2865US2021202461A1Method for embedding silicon die into a stacked packageMICRON TECHNOLOGY INC·Filed 2021·Application pending·0 cites
- 2964US7408822B2Alignment of memory read data and clockingMICRON TECHNOLOGY INC·Filed 2007·Granted Aug 5, 2008·4 cites·8 claims
- 3057US7573733B2Self-identifying stacked die semiconductor componentsMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 11, 2009·2 cites·37 claims
- 3156US8832631B2Integrated circuit apparatus, systems, and methodsMICRON TECHNOLOGY INC·Filed 2013·Granted Sep 9, 2014·0 cites·20 claims
- 3252US2017309607A1Method for embedding silicon die into a stacked packageMICRON TECHNOLOGY INC·Filed 2017·Application pending·0 cites
- 3351US7184329B2Alignment of memory read data and clockingMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 27, 2007·5 cites·31 claims
- 3447US7795903B2Output buffer and method having a supply voltage insensitive slew rateMICRON TECHNOLOGY INC·Filed 2009·Granted Sep 14, 2010·0 cites·11 claims
- 3547US7142032B2Tunable delay circuitSILVESTRI PAUL A·Filed 2004·Granted Nov 28, 2006·3 cites·63 claims
- 3645US7898901B2Method for controlling clock cycle time for reduced power consumption in a semiconductor memory deviceMICRON TECHNOLOGY INC·Filed 2010·Granted Mar 1, 2011·0 cites·22 claims
- 3745US7528624B2Output buffer and method having a supply voltage insensitive slew rateMICRON TECHNOLOGY INC·Filed 2007·Granted May 5, 2009·0 cites·15 claims
- 3833US2002130691A1Method and apparatus for fast lock of delay lock loopFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →