Inventor · disambiguated record
Paul R. Walling
Also filed as: WALLING PAUL R · WALLING PAUL ROBERT
16 granted patents·165 citations·filing 1995–2019
91Inventor score
Top patents by PatentIndex Score
16 records- 0189US6037044ADirect deposit thin film single/multi chip moduleIBM·Filed 1998·Granted Mar 14, 2000·68 cites·24 claims
- 0287US6528735B1Substrate design of a chip using a generic substrate designIBM·Filed 2001·Granted Mar 4, 2003·41 cites·18 claims
- 0381US8927879B2Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structuresCHOI JINWOO·Filed 2010·Granted Jan 6, 2015·4 cites·7 claims
- 0472US6261467B1Direct deposit thin film single/multi chip moduleIBM·Filed 1999·Granted Jul 17, 2001·26 cites·11 claims
- 0569US9955567B2Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structuresIBM·Filed 2014·Granted Apr 24, 2018·1 cites·10 claims
- 0662US10956649B2Semiconductor package metal shadowing checksIBM·Filed 2019·Granted Mar 23, 2021·0 cites·20 claims
- 0762US10949600B2Semiconductor package floating metal checksIBM·Filed 2019·Granted Mar 16, 2021·0 cites·20 claims
- 0857US10423752B2Semiconductor package metal shadowing checksIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 0956US10423751B2Semiconductor package floating metal checksIBM·Filed 2017·Granted Sep 24, 2019·0 cites·20 claims
- 1054US10375820B2Crosstalk reduction between signal layers in a multilayered package by variable-width mesh plane structuresIBM·Filed 2018·Granted Aug 6, 2019·0 cites·7 claims
- 1150US10546096B2Semiconductor package via stack checkingIBM·Filed 2017·Granted Jan 28, 2020·0 cites·19 claims
- 1247US10706204B2Automated generation of surface-mount package designIBM·Filed 2018·Granted Jul 7, 2020·0 cites·17 claims
- 1347US7096451B2Mesh plane generation and file storageIBM·Filed 2003·Granted Aug 22, 2006·5 cites·28 claims
- 1445US5677847AMethod and apparatus for designing a moduleIBM·Filed 1995·Granted Oct 14, 1997·20 cites·8 claims
- 1539US8756546B2Elastic modulus mapping of a chip carrier in a flip chip packageCOHEN ERWIN B·Filed 2012·Granted Jun 17, 2014·0 cites·5 claims
- 1639US7325213B2Nested design approachIBM·Filed 2005·Granted Jan 29, 2008·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →