Inventor · disambiguated record
Peng Chen
Also filed as: CHEN PENG · CHEN PENG-SHIU
22 granted patents·23 pending applications·34 citations·filing 2001–2024
91Inventor score
Files withYANGTZE MEMORY TECH CO LTD32CHINA ENERGY CAS TECH CO LTD3BEIJING ZHONG KE SAN HUAN HI-TECH CO LTD1IND TECH RES INST1LI GUANGJIN1
Top patents by PatentIndex Score
45 records- 0194US11133290B2Chip package structure with stacked chips and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Sep 28, 2021·8 cites·18 claims
- 0283US11688721B2Chip package structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jun 27, 2023·1 cites·20 claims
- 0383US2025010402A1Laser system for dicing semiconductor structure and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0483US2025010403A1Laser system for dicing semiconductor structure and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0577US2025022850A1Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0677US2025096220A1Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0777US2025022851A1Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0876US12205940B2Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jan 21, 2025·0 cites·19 claims
- 0975US12125827B2Chip package structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Oct 22, 2024·0 cites·20 claims
- 1075US11339849B2Three-dimensional isolator with adaptive stiffness propertyUNIV TONGJI·Filed 2018·Granted May 24, 2022·2 cites·5 claims
- 1173US6455615B2Flexible polymer modified cement-based waterproofing materials and their making processTIANJIN BUILDING MATERIALS SCI·Filed 2001·Granted Sep 24, 2002·23 cites·20 claims
- 1272US12121995B2Laser system for dicing semiconductor structure and operation method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 22, 2024·0 cites·20 claims
- 1370US12489066B2Electromagnetic interference shielding package structures and fabricating methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2022·Granted Dec 2, 2025·0 cites·17 claims
- 1470US12334361B2Substrate structure, and fabrication and packaging methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Granted Jun 17, 2025·0 cites·20 claims
- 1566US12166012B2Flip-chip stacking structures and methods for forming the sameYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Dec 10, 2024·0 cites·14 claims
- 1666US11866332B2Carbon nanoparticle-porous skeleton composite material, its composite with lithium metal, and their preparation methods and useCHINA ENERGY CAS TECH CO LTD·Filed 2022·Granted Jan 9, 2024·0 cites·16 claims
- 1766US11721686B2Semiconductor package structure and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Aug 8, 2023·0 cites·16 claims
- 1866US11694918B2Method and device for wafer tapingYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·15 claims
- 1962US12234398B2Metal organic framework (MOF) glass composite comprising metal halide perovskiteUNIV QUEENSLAND·Filed 2022·Granted Feb 25, 2025·0 cites·20 claims
- 2060US11694904B2Substrate structure, and fabrication and packaging methods thereofYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Jul 4, 2023·0 cites·18 claims
- 2160US2022013471A1Ic packageYANGTZE MEMORY TECH CO LTD·Filed 2021·Application pending·0 cites
- 2259US2025054905A1Semiconductor device, chip and fabrication method thereof, memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2358US11232969B2Method and device for wafer tapingYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Jan 25, 2022·0 cites·11 claims
- 2457US11476173B2Manufacturing method of integrated circuit packaging structureYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 2557US2025038063A1Chip packaging structure, semiconductor structure, and fabricating method thereofYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2657US2025233060A1Semiconductor package structure with glass substrate and packaging method thereofYANGTZE MEMORY TECH CO LTD·Filed 2024·Application pending·0 cites
- 2756US2024379473A1Package structure and fabrication method thereof, memory system and electronic apparatusYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2855US2024290727A1Chip package structure and manufacturing methods for the sameYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 2955US2024312925A1Semiconductor device, fabricating method, memory device and device systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 3054US2024332152A1Integrated package device, fabrication method thereof and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 3154US2024332269A1Semiconductor package structure, fabrication method and memory systemYANGTZE MEMORY TECH CO LTD·Filed 2023·Application pending·0 cites
- 3253US12224366B2Manufacturing method and manufacturing apparatus for interconnection memberLONGI SOLAR TECH TAIZHOU CO LTD·Filed 2020·Granted Feb 11, 2025·0 cites·6 claims
- 3353US12131924B2Method for processing semiconductor wafersYANGTZE MEMORY TECH CO LTD·Filed 2020·Granted Oct 29, 2024·0 cites·15 claims
- 3453US2020123008A1Carbon nanoparticle-porous skeleton composite material, its composite with lithium metal, and their preparation methods and useCHINA ENERGY CAS TECH CO LTD·Filed 2017·Application pending·0 cites
- 3552US12106985B2Laser dicing system and method for dicing semiconductor structure including cutting streetYANGTZE MEMORY TECH CO LTD·Filed 2021·Granted Oct 1, 2024·0 cites·20 claims
- 3650US11469153B2Electronic component comprising substrate with thermal indicatorYANGTZE MEMORY TECH CO LTD·Filed 2019·Granted Oct 11, 2022·0 cites·14 claims
- 3750US2020135656A1Ic packageYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 3850US2020235023A1Integrated circuit packaging structure and manufacturing method thereofYANGTZE MEMORY TECH CO LTD·Filed 2019·Application pending·0 cites
- 3944US2021197260A1System and method for fabrication of bulk nanocrystal alloyUNIV SHENZHEN·Filed 2017·Application pending·0 cites
- 4044US2015276323A1Heat pipe and process for manufacturing the sameOSRAM GMBH·Filed 2013·Application pending·0 cites
- 4143US11462741B2Metallic lithium-skeleton carbon composite material having a hydrophobic cladding layer, preparation method and use thereofCHINA ENERGY CAS TECH CO LTD·Filed 2017·Granted Oct 4, 2022·0 cites·19 claims
- 4238US2005082567A1Structure of a relaxed Si/Ge epitaxial layer and fabricating method thereofIND TECH RES INST·Filed 2004·Application pending·0 cites
- 4337US2006258136A1Method of forming a metal traceLI GUANGJIN·Filed 2005·Application pending·0 cites
- 4437US2007059910A1Semiconductor structure and method for manufacturing the samePEI ZING-WAY·Filed 2006·Application pending·0 cites
- 4537US2017335478A1Electro-deposition process, electro-deposition bath, and method for preparing rare earth permanent magnetic material through electro-depositionBEIJING ZHONG KE SAN HUAN HI-TECH CO LTD·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →