Inventor · disambiguated record
Peter Delia
Also filed as: DELIA PETER
6 granted patents·4 pending applications·1 citations·filing 2022–2024
65Inventor score
Technology areasH10P
Files withTOKYO ELECTRON LTD10
Top patents by PatentIndex Score
10 records- 0187US12100598B2Methods for planarizing a substrate using a combined wet etch and chemical mechanical polishing (CMP) processTOKYO ELECTRON LTD·Filed 2022·Granted Sep 24, 2024·1 cites·21 claims
- 0259US12148624B2Wet etch process and method to control fin height and channel area in a fin field effect transistor (FinFET)TOKYO ELECTRON LTD·Filed 2022·Granted Nov 19, 2024·0 cites·20 claims
- 0358US12243749B2Methods to provide uniform wet etching of material within high aspect ratio features provided on a patterned substrateTOKYO ELECTRON LTD·Filed 2022·Granted Mar 4, 2025·0 cites·20 claims
- 0458US12100599B2Wet etch process and method to provide uniform etching of material formed within features having different critical dimension (CD)TOKYO ELECTRON LTD·Filed 2022·Granted Sep 24, 2024·0 cites·20 claims
- 0558US2025357099A1Wafer cleaning method and systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0658US2025323035A1Wafer cleaning method and system using heated functional plateTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0757US12148625B2Methods to prevent surface charge induced cd-dependent etching of material formed within features on a patterned substrateTOKYO ELECTRON LTD·Filed 2022·Granted Nov 19, 2024·0 cites·22 claims
- 0857US2025308950A1Wafer processing method and system using heated functional plateTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 0957US2025379045A1Wafer cleaning method and systemTOKYO ELECTRON LTD·Filed 2024·Application pending·0 cites
- 1055US12482702B2Wet etch process and methods to form air gaps between metal interconnectsTOKYO ELECTRON LTD·Filed 2022·Granted Nov 25, 2025·0 cites·24 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →