Inventor · disambiguated record
Pei-Pei Ding
Also filed as: DING PEI · DING PEI-PEI
7 granted patents·5 pending applications·67 citations·filing 2003–2020
82Inventor score
Top patents by PatentIndex Score
12 records- 0187US7110258B2Heat dissipating microdeviceASIA VITAL COMPONENTS CO LTD·Filed 2003·Granted Sep 19, 2006·47 cites·19 claims
- 0268US7464463B2Method for making a heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted Dec 16, 2008·5 cites·2 claims
- 0368US7461450B2Method for making a heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted Dec 9, 2008·4 cites·3 claims
- 0461US7469740B2Heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted Dec 30, 2008·2 cites·8 claims
- 0559US7721439B2Manufacturing system for making a heat dissipating deviceASIA VITAL COMPONENTS CO LTD·Filed 2005·Granted May 25, 2010·2 cites·11 claims
- 0657US7267755B2Method of making a microstructure using a circuit boardSENTELIC CORP·Filed 2003·Granted Sep 11, 2007·7 cites·6 claims
- 0750US11289878B2Nanolaser based on depth-subwavelength graphene-dielectric hyperbolic dispersive cavityUNIV ZHENGZHOU AERONAUTICS·Filed 2020·Granted Mar 29, 2022·0 cites·7 claims
- 0846US2006225908A1Method of making a heat dissipating microdeviceSENTELIC CORP·Filed 2006·Application pending·0 cites
- 0944US2007261243A1Method for making plate type heat pipeYANG HSIU-WEI·Filed 2006·Application pending·0 cites
- 1043US2008080133A1Flat type heat pipe device and method of fabrication thereofYANG HSIU-WEI·Filed 2006·Application pending·0 cites
- 1135US2007294892A1Method for making a plate type heat pipeASIA VITAL COMPONENTS CO LTD·Filed 2006·Application pending·0 cites
- 1234US2011186268A1Flat type heat pipe deviceASIA VITAL COMPONENTS CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →