Method of making a heat dissipating microdevice

Abstract

A heat dissipating microdevice is made from comprising the steps of: a board including an insulator layer having a first and facing second surfaces and a conductor layer on the first surface by forming in the layer a hole that extends between the surfaces to form a fluid microsystem including: first and second micro-channel structures disposed respectively in first and second areas of the board and bounded by the layer, and first and second micro-conduit structures that permit fluid communication between the micro-channel structures. The first micro-conduit structure has a first end in fluid communication with the second micro-channel structure and a second end section in fluid communication with the first micro-channel structure. The second micro-conduit structure has a first end section in fluid communication with the first micro-channel structure and a second end section in fluid communication with the second micro-channel structure. A cover is put on the second surface.

1 .- 20 . (canceled)  
   
   
       21 . A method of making a heat dissipating microdevice, the device being made from a board that includes an insulator layer having a first surface and a second surface facing the first surface, and a conductor layer formed on the first surface of the insulator layer; comprising the steps of: 
 (a) forming a hole unit in said insulator layer, so the hole unit extends from the first surface to the second surface of the insulator layer to result in a fluid microsystem including:    first and second micro-channel structures disposed respectively in first and second areas of the board and bounded by the conductor layer, and first and second micro-conduit structures that permit fluid communication between the first and second micro-channel structures, the first micro-conduit structure including a first end section in fluid communication with the second micro-channel structure and a second end section extending to and in fluid communication with the first micro-channel structure, the second micro-conduit structure including a first end section in fluid communication with the first micro-channel structure and a second end section extending to and in fluid communication with the second micro-channel structure; and    (b) disposing a cover member on the second surface of the insulator layer.    
   
   
       22 . The method of  claim 21 , further comprising the step of filling the fluid microsystem with a coolant.  
   
   
       23 . The method of  claim 21 , wherein the board further includes a photo-resist layer coated on the second surface of the insulator layer, and step (a) includes: 
 (a1) patterning the photo-resist layer to expose portions of the second surface of the insulator layer, and    (a2) forming the hole unit in the exposed portions of the second surface of the insulator layer.    
   
   
       24 . The method of  claim 21 , further comprising the step of disposing a metallic grid microstructure in the hole unit prior to step (b).  
   
   
       25 . The method of  claim 21 , further comprising the step of mounting of a micro-driving member on said board after step (b) so the micro-driving member is in fluid communication with the fluid microsystem.  
   
   
       26 . The method of  claim 21 , wherein the hole unit is formed in the insulator layer by laser ablation.  
   
   
       27 . The method of  claim 22 , wherein the coolant is one of air, methanol, acetone, and water.