Inventor · disambiguated record
Peipei Dong
Also filed as: DONG PEIPEI
7 granted patents·4 pending applications·1 citations·filing 2014–2024
71Inventor score
Files withSUZHOU SHINHAO MAT LLC5NINGBO RONBAY NEW ENERGY TECH CO LTD2SHINHAO MAT LLC2UMICORE SUZHOU SEMICONDUCTOR MAT CO LTD1ZHANG YUN1
Top patents by PatentIndex Score
11 records- 0177US9551081B2Leveling composition and method for electrodeposition of metals in microelectronicsZHANG YUN·Filed 2014·Granted Jan 24, 2017·1 cites·36 claims
- 0274US2025105284A1High-nickel ternary positive electrode material having cobalt gradient, preparation method therefor, and lithium-ion batteryNINGBO RONBAY NEW ENERGY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0374US2025125375A1Composite coating agent for positive electrode material, high-nickel single-crystal positive electrode material, and batteryNINGBO RONBAY NEW ENERGY TECH CO LTD·Filed 2024·Application pending·0 cites
- 0473US11802345B2Metal material with thermodynamic anisotropy and a method of preparing the sameSUZHOU SHINHAO MAT LLC·Filed 2022·Granted Oct 31, 2023·0 cites·4 claims
- 0569US11242607B2Metal material with thermodynamic anisotropy and a method of preparing the sameSUZHOU SHINHAO MAT LLC·Filed 2019·Granted Feb 8, 2022·0 cites·4 claims
- 0667US2024328023A1Method of electroplating stress-free copper filmSUZHOU SHINHAO MAT LLC·Filed 2024·Application pending·0 cites
- 0764US10683275B2Leveler, leveler composition and method for electrodeposition of metals in microelectronicsSHINHAO MAT LLC·Filed 2019·Granted Jun 16, 2020·0 cites·3 claims
- 0861US9920023B2Leveling composition and method for electrodeposition of metals in microelectronicsSUZHOU SHINHAO MAT LLC·Filed 2016·Granted Mar 20, 2018·0 cites·16 claims
- 0955US10323015B2Leveler, leveler composition and method for electrodeposition of metals in microelectronicsSHINHAO MAT LLC·Filed 2016·Granted Jun 18, 2019·0 cites·9 claims
- 1053US12281403B2Method for electroplating nanograined copperUMICORE SUZHOU SEMICONDUCTOR MAT CO LTD·Filed 2022·Granted Apr 22, 2025·0 cites·7 claims
- 1153US2022064813A1Method of electroplating stress-free copper filmSUZHOU SHINHAO MAT LLC·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →