Inventor · disambiguated record
Pei-Chang Huang
Also filed as: HUANG PEI C · Huang pei-chang
16 granted patents·3 pending applications·30 citations·filing 1990–2022
86Inventor score
Top patents by PatentIndex Score
19 records- 0167US5169073AProcess for separating and recovering lead, rubber and copper wires from waste cablesCONSIGLIO NAZIONALE RICERCHE·Filed 1990·Granted Dec 8, 1992·28 cites·10 claims
- 0266US9159713B1Opto-electronic circuit board and method for assembling the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Oct 13, 2015·2 cites·14 claims
- 0362US11445596B2Circuit board having heat-dissipation block and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted Sep 13, 2022·0 cites·9 claims
- 0457US11997785B2Circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2022·Granted May 28, 2024·0 cites·10 claims
- 0557US2016097130A1Preparation method of conductive sponge having effect of shielding electromagnetic waveUNIMICRON TECHNOLOGY CORP·Filed 2014·Application pending·0 cites
- 0655US9377596B2Optical-electro circuit board, optical component and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted Jun 28, 2016·0 cites·4 claims
- 0752US9739963B2Manufacturing method of optical componentUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Aug 22, 2017·0 cites·3 claims
- 0851US10881006B2Package carrier and package structureUNIMICRON TECHNOLOGY CORP·Filed 2020·Granted Dec 29, 2020·0 cites·14 claims
- 0951US9581774B2Optical-electro circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2016·Granted Feb 28, 2017·0 cites·6 claims
- 1050US9335470B2Opto-electronic circuit board and method for assembling the sameUNIMICRON TECHNOLOGY CORP·Filed 2014·Granted May 10, 2016·0 cites·10 claims
- 1150US9288917B2Manufacturing method for multi-layer circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 15, 2016·0 cites·14 claims
- 1250US9095083B2Manufacturing method for multi-layer circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Jul 28, 2015·0 cites·14 claims
- 1350US8979372B2Circuit board and manufacturing method thereof and electro-optic apparatus having the circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·0 cites·15 claims
- 1449US9198303B2Manufacturing method for multi-layer circuit boardUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Nov 24, 2015·0 cites·16 claims
- 1545US11373927B2Package substrate and manufacturing method having a mesh gas-permeable structure disposed in the through holeUNIMICRON TECHNOLOGY CORP·Filed 2019·Granted Jun 28, 2022·0 cites·20 claims
- 1644US11641720B2Circuit board and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2021·Granted May 2, 2023·0 cites·16 claims
- 1742US10515870B1Package carrier having a mesh gas-permeable structure disposed in the through holeUNIMICRON TECHNOLOGY CORP·Filed 2018·Granted Dec 24, 2019·0 cites·10 claims
- 1840US2020214120A1Circuit board having heat-dissipation block and method of manufacturing the sameUNIMICRON TECHNOLOGY CORP·Filed 2019·Application pending·0 cites
- 1938US2017129454A1Safety system and method for preventing living body from being locked in vehicleUNIMICRON TECHNOLOGY CORP·Filed 2015·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Pei-Chang Huang files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →