Inventor · disambiguated record
Peter Huebler
Also filed as: HUEBLER PETER
6 granted patents·3 pending applications·22 citations·filing 2002–2008
77Inventor score
Top patents by PatentIndex Score
9 records- 0179US7416992B2Method of patterning a low-k dielectric using a hard maskADVANCED MICRO DEVICES INC·Filed 2005·Granted Aug 26, 2008·7 cites·20 claims
- 0255US8097542B2Etch stop layer of reduced thickness for patterning a dielectric material in a contact level of closely spaced transistorsWIECZOREK KARSTEN·Filed 2008·Granted Jan 17, 2012·2 cites·20 claims
- 0354US7183629B2Metal line having an increased resistance to electromigration along an interface of a dielectric barrier layer by implanting material into the metal lineADVANCED MICRO DEVICES INC·Filed 2004·Granted Feb 27, 2007·8 cites·12 claims
- 0449US8039395B2Technique for forming embedded metal lines having increased resistance against stress-induced material transportGLOBALFOUNDRIES INC·Filed 2004·Granted Oct 18, 2011·5 cites·27 claims
- 0541US7063091B2Method for cleaning the surface of a substrateADVANCED MICRO DEVICES INC·Filed 2005·Granted Jun 20, 2006·0 cites·34 claims
- 0640US2006267207A1Method of forming electrically conductive lines in an integrated circuitFEUSTEL FRANK·Filed 2006·Application pending·0 cites
- 0739US2006267201A1Technique for forming copper-containing lines embedded in a low-k dielectric by providing a stiffening layerHUEBLER PETER·Filed 2005·Application pending·0 cites
- 0836US2003072695A1Method of removing oxidized portions at an interface of a metal surface and capping layer in a semiconductor metallization layerFiled 2002·Application pending·0 cites
- 0932US8698312B2Semiconductor device including a hybrid metallization layer stack for enhanced mechanical strength during and after packagingWERKING JAMES·Filed 2005·Granted Apr 15, 2014·0 cites·19 claims
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