Inventor · disambiguated record
Peng-Hsin Lee
Also filed as: LEE PENG · LEE PENG-HSIN
18 granted patents·2 pending applications·33 citations·filing 2013–2020
89Inventor score
Top patents by PatentIndex Score
20 records- 0190US9177957B1Embedded packaging deviceDELTA ELECTRONICS INC·Filed 2014·Granted Nov 3, 2015·13 cites·19 claims
- 0286US9385070B2Semiconductor component having a lateral semiconductor device and a vertical semiconductor deviceDELTA ELECTRONICS INC·Filed 2013·Granted Jul 5, 2016·9 cites·20 claims
- 0377US9431327B2Semiconductor deviceDELTA ELECTRONICS INC·Filed 2014·Granted Aug 30, 2016·4 cites·19 claims
- 0468US8912663B1Embedded package structure and method for manufacturing thereofDELTA ELECTRONICS INC·Filed 2013·Granted Dec 16, 2014·2 cites·20 claims
- 0563US10685904B2Packaging device and manufacturing method thereofDELTA ELECTRONICS INC·Filed 2014·Granted Jun 16, 2020·1 cites·12 claims
- 0662US11049796B2Manufacturing method of packaging deviceDELTA ELECTRONICS INC·Filed 2020·Granted Jun 29, 2021·0 cites·7 claims
- 0762US9209164B2Interconnection structure of package structure and method of forming the sameDELTA ELECTRONICS INC·Filed 2013·Granted Dec 8, 2015·1 cites·10 claims
- 0860US9905439B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2016·Granted Feb 27, 2018·0 cites·2 claims
- 0958US8764052B2Airbag deviceCALSONIC KANSEI CORP·Filed 2013·Granted Jul 1, 2014·3 cites·4 claims
- 1053US11315857B2Package structuresDELTA ELECTRONICS INC·Filed 2020·Granted Apr 26, 2022·0 cites·20 claims
- 1150US11189555B2Chip packaging with multilayer conductive circuitDELTA ELECTRONICS INC·Filed 2020·Granted Nov 30, 2021·0 cites·14 claims
- 1249US10424508B2Interconnection structure having a via structure and fabrication thereofDELTA ELECTRONICS INC·Filed 2015·Granted Sep 24, 2019·0 cites·12 claims
- 1349US9275982B2Method of forming interconnection structure of package structureDELTA ELECTRONICS INC·Filed 2015·Granted Mar 1, 2016·0 cites·10 claims
- 1446US9865531B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2016·Granted Jan 9, 2018·0 cites·14 claims
- 1545US2021249339A1Package structuresDELTA ELECTRONICS INC·Filed 2020·Application pending·0 cites
- 1644US9748165B2Packaging structureDELTA ELECTRONICS INC·Filed 2016·Granted Aug 29, 2017·0 cites·20 claims
- 1742US2020243430A1Package structure and forming method of the sameDELTA ELECTRONICS INC·Filed 2019·Application pending·0 cites
- 1841US10056319B2Power module package having patterned insulation metal substrateDELTA ELECTRONICS INC·Filed 2017·Granted Aug 21, 2018·0 cites·17 claims
- 1938US10892210B2Package structuresDELTA ELECTRONICS INC·Filed 2016·Granted Jan 12, 2021·0 cites·16 claims
- 2035US9847312B2Package structureDELTA ELECTRONICS INC·Filed 2016·Granted Dec 19, 2017·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →