Inventor · disambiguated record
Petteri Palm
Also filed as: PALM PETTERI
84 granted patents·13 pending applications·364 citations·filing 2004–2024
99Inventor score
Files withINFINEON TECHNOLOGIES AG41INFINEON TECHNOLOGIES AUSTRIA AG18TUOMINEN RISTO12PALM PETTERI7IMBERA ELECTRONICS OY6
Top patents by PatentIndex Score
97 records- 0198US9363898B2Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2015·Granted Jun 7, 2016·35 cites·14 claims
- 0298US8704359B2Method for manufacturing an electronic module and an electronic moduleTUOMINEN RISTO·Filed 2011·Granted Apr 22, 2014·43 cites·22 claims
- 0397US9530752B2Method for forming electronic componentsINFINEON TECHNOLOGIES AG·Filed 2013·Granted Dec 27, 2016·37 cites·26 claims
- 0496US11791255B2Die package and method of forming a die packageINFINEON TECHNOLOGIES AG·Filed 2022·Granted Oct 17, 2023·2 cites·24 claims
- 0596US7609527B2Electronic moduleIMBERA ELECTRONICS OY·Filed 2007·Granted Oct 27, 2009·27 cites·27 claims
- 0695US11373944B2Die package and method of forming a die packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jun 28, 2022·3 cites·19 claims
- 0791US11978693B2Semiconductor device package comprising side walls connected with contact pads of a semiconductor dieINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 7, 2024·2 cites·12 claims
- 0891US7673387B2Manufacture of a layer including a componentIMBERA ELECTRONICS OY·Filed 2005·Granted Mar 9, 2010·22 cites·20 claims
- 0990US8581109B2Method for manufacturing a circuit board structureTUOMINEN RISTO·Filed 2006·Granted Nov 12, 2013·14 cites·19 claims
- 1089US12033909B2Die package and method of manufacturing a die packageINFINEON TECHNOLOGIES AG·Filed 2020·Granted Jul 9, 2024·2 cites·16 claims
- 1189US10903180B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jan 26, 2021·4 cites·14 claims
- 1288US12431450B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2024·Granted Sep 30, 2025·0 cites·20 claims
- 1387US11043409B2Method of forming contacts to an embedded semiconductor die and related semiconductor packagesINFINEON TECHNOLOGIES AG·Filed 2018·Granted Jun 22, 2021·5 cites·17 claims
- 1487US7663215B2Electronic module with a conductive-pattern layer and a method of manufacturing sameIMBERA ELECTRONICS OY·Filed 2004·Granted Feb 16, 2010·41 cites·14 claims
- 1585US11469164B2Space efficient and low parasitic half bridgeINFINEON TECHNOLOGIES AG·Filed 2020·Granted Oct 11, 2022·2 cites·18 claims
- 1685US7299546B2Method for manufacturing an electronic moduleIMBERA ELECTRONICS OY·Filed 2004·Granted Nov 27, 2007·24 cites·19 claims
- 1784US8240032B2Method for manufacturing an electronics module comprising a component electrically connected to a conductor-pattern layerIIHOLA ANTTI·Filed 2005·Granted Aug 14, 2012·13 cites·20 claims
- 1883US9768037B2Electronic device package including metal blocksINFINEON TECHNOLOGIES AG·Filed 2014·Granted Sep 19, 2017·6 cites·7 claims
- 1983US8699233B2Circuit module and method of manufacturing the samePALM PETTERI·Filed 2009·Granted Apr 15, 2014·8 cites·35 claims
- 2083US8238113B2Electronic module with vertical connector between conductor patternsIIHOLA ANTTI·Filed 2010·Granted Aug 7, 2012·7 cites·21 claims
- 2182US11502012B2Semiconductor packages and methods of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2020·Granted Nov 15, 2022·1 cites·8 claims
- 2282US10818646B2Power stage device with carrier frame for power stage module and integrated inductorINFINEON TECHNOLOGIES AG·Filed 2019·Granted Oct 27, 2020·3 cites·20 claims
- 2382US2023225055A1Electronic moduleIMBERATEK LLC·Filed 2023·Application pending·0 cites
- 2481US12176283B2Die package and method of forming a die packageINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 2581US12027481B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2023·Granted Jul 2, 2024·0 cites·22 claims
- 2681US10692803B2Die embeddingINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2018·Granted Jun 23, 2020·3 cites·25 claims
- 2781US10056348B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2017·Granted Aug 21, 2018·2 cites·15 claims
- 2880US8956918B2Method of manufacturing a chip arrangement comprising disposing a metal structure over a carrierINFINEON TECHNOLOGIES AG·Filed 2012·Granted Feb 17, 2015·4 cites·25 claims
- 2979US11996771B2Power semiconductor system having an inductor module attached to a power stage moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted May 28, 2024·0 cites·14 claims
- 3079US11302610B2Semiconductor package and method of fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2019·Granted Apr 12, 2022·2 cites·8 claims
- 3179US8240033B2Method for manufacturing a circuit boardTUOMINEN RISTO·Filed 2006·Granted Aug 14, 2012·8 cites·21 claims
- 3278US2025087581A1Method for fabricating a semiconductor packageINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 3378US2024332099A1Semiconductor package having an electrically insulating core with exposed glass fibresINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 3477US12218098B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2022·Granted Feb 4, 2025·0 cites·20 claims
- 3576US8735735B2Electronic module with embedded jumper conductorPALM PETTERI·Filed 2010·Granted May 27, 2014·4 cites·15 claims
- 3676US8487194B2Circuit board including an embedded componentTUOMINEN RISTO·Filed 2010·Granted Jul 16, 2013·4 cites·20 claims
- 3776US8076586B2Heat conduction from an embedded componentTUOMINEN RISTO·Filed 2005·Granted Dec 13, 2011·7 cites·19 claims
- 3876US8034658B2Electronic module with a conductive-pattern layer and a method of manufacturing sameIMBERA ELECTRONICS OY·Filed 2009·Granted Oct 11, 2011·5 cites·26 claims
- 3975US12014964B2Semiconductor package having an electrically insulating core with exposed glass fibresINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jun 18, 2024·0 cites·11 claims
- 4075US9941229B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2013·Granted Apr 10, 2018·2 cites·17 claims
- 4175US2021321520A1Electronic moduleIMBERATEK LLC·Filed 2021·Application pending·0 cites
- 4275US2024339371A1Die Package and Method of Manufacturing a Die PackageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 4374US12159829B2Semiconductor package with non-uniformly distributed viasINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2022·Granted Dec 3, 2024·0 cites·23 claims
- 4474US12009290B2Semiconductor module having a multi-branch switch node connectorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Jun 11, 2024·0 cites·20 claims
- 4574US11792941B2Circuit board structure and method for manufacturing a circuit board structureIMBERATEK LLC·Filed 2021·Granted Oct 17, 2023·0 cites·17 claims
- 4674US11569186B2Device including semiconductor chips and method for producing such deviceINFINEON TECHNOLOGIES AG·Filed 2021·Granted Jan 31, 2023·0 cites·22 claims
- 4774US11071207B2Electronic moduleIMBERATEK LLC·Filed 2020·Granted Jul 20, 2021·0 cites·6 claims
- 4873US10085347B2Manufacture of a circuit board and circuit board containing a componentGE EMBEDDED ELECTRONICS OY·Filed 2015·Granted Sep 25, 2018·2 cites·8 claims
- 4972US11539291B2Method of manufacturing a power semiconductor systemINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2020·Granted Dec 27, 2022·0 cites·6 claims
- 5072US11309277B2Chip assembling on adhesion layer or dielectric layer, extending beyond chip, on substrateINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 19, 2022·0 cites·20 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →