Electronic module

Abstract

The present invention relates to an electronic module. In particular, to an electronic module which includes one or more components embedded in an installation base. The electronic module can be a module like a circuit board, which includes several components, which are connected to each other electrically, through conducting structures manufactured in the module. The components can be passive components, microcircuits, semiconductor components, or other similar components. Components that are typically connected to a circuit board form one group of components. Another important group of components are components that are typically packaged for connection to a circuit board. The electronic modules to which the invention relates can, of course, also include other types of components.

1 . An electronic module, comprising:
 a first conductive-pattern layer and a second conductive-pattern layer disposed on the first conductive-pattern layer, the second conductive-pattern layer having a first surface;   an insulating-material layer disposed on the first surface of the second conductive-pattern layer;   a component disposed inside the insulating-material layer, the component comprising contact zones comprising aluminum; and   contact bumps disposed on the contact zones and electrically connected thereto,   wherein:
 at least one of the contact bumps is electrically connected to the second conductive-pattern layer; and 
 the contact bumps comprise at least three metal layers whose materials are different from each other. 
   
     
     
         2 . The electronic module of  claim 1 , wherein the contact bumps comprise copper. 
     
     
         3 . The electronic module of  claim 1 , wherein the contact bumps comprise an alloy including tin. 
     
     
         4 . The electronic module of  claim 1 , wherein:
 the insulating-material layer has a first surface facing the second conductive-pattern layer and a second surface opposite the first surface; and   the electronic module further comprises a third conductive-pattern layer disposed on the second surface of the insulating-material layer.   
     
     
         5 . An electronic module, comprising:
 a first conductive-pattern layer and a second conductive-pattern layer disposed on the first conductive-pattern layer, the second conductive-pattern layer having a first surface;   an adhesive layer disposed on the first surface of the second conductive-pattern layer;   an insulating-material layer disposed on the adhesive layer;   a component disposed inside the insulating-material layer, the component comprising contact zones comprising aluminum; and   contact bumps disposed on the contact zones and electrically connected thereto,   wherein:
 at least one of the contact bumps is electrically connected to the second conductive-pattern layer; and 
 the contact bumps comprise at least two metal layers whose compositions are different from each other. 
   
     
     
         6 . The electronic module of  claim 5 , wherein the contact bumps comprise copper. 
     
     
         7 . The electronic module of  claim 5 , wherein the contact bumps comprise an alloy including tin. 
     
     
         8 . The electronic module of  claim 5 , wherein:
 the insulating-material layer has a first surface facing the second conductive-pattern layer and a second surface opposite the first surface; and   the electronic module further comprises a third conductive-pattern layer disposed on the second surface of the insulating-material layer.   
     
     
         9 . An electronic module, comprising:
 a first conductive-pattern layer and a second conductive-pattern layer disposed on the first conductive-pattern layer, the second conductive-pattern layer having a first surface;   an insulating-material layer disposed on the first surface of the second conductive-pattern layer;   a component disposed inside the insulating-material layer, the component comprising contact zones comprising aluminum;   first contact bumps disposed on the first surface of the second conductive-pattern layer and electrically connected thereto; and   second contact bumps disposed on the contact zones and electrically connected thereto,   wherein:
 at least one of the first contact bumps and the second contact bumps are electronically connected; 
 the second contact bumps comprise at least two layers of at least two different materials; and 
 a material of the first contact bumps is different from the at least two different materials of the second contact bumps and the material of the second conductive-pattern layer. 
   
     
     
         10 . The electronic module of  claim 9 , wherein the second contact bumps comprise copper. 
     
     
         11 . The electronic module of  claim 9 , wherein the first contact bumps comprise an alloy including tin. 
     
     
         12 . The electronic module of  claim 9 , wherein:
 the insulating-material layer has a first surface facing the second conductive-pattern layer and a second surface opposite the first surface; and   the electronic module further comprises a third conductive-pattern layer disposed on the second surface of the insulating-material layer.