Inventor · disambiguated record
Peiqi Wang
Also filed as: WANG PEIQI
6 granted patents·21 pending applications·0 citations·filing 2019–2025
65Inventor score
Top patents by PatentIndex Score
27 records- 0178US2024368754A1Methods for forming low resistivity tungsten featuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0277US2024229230A1Gas delivery for tungsten-containing layerAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 0375US12037682B2Methods for forming low resistivity tungsten featuresAPPLIED MATERIALS INC·Filed 2022·Granted Jul 16, 2024·0 cites·20 claims
- 0472US11939668B2Gas delivery for tungsten-containing layerAPPLIED MATERIALS INC·Filed 2022·Granted Mar 26, 2024·0 cites·20 claims
- 0564US2024352588A1Enable cvd chamber process wafers at different temperaturesAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 0664US2025297358A1Self-planarizing selective carbon gapfill depositionAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0763US12094773B2Methods for low resistivity and stress tungsten gap fillAPPLIED MATERIALS INC·Filed 2022·Granted Sep 17, 2024·0 cites·8 claims
- 0860US11798845B2Methods and apparatus for low resistivity and stress tungsten gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Oct 24, 2023·0 cites·13 claims
- 0953US2025316476A1Densification of carbon gapfill using low frequency radio frequency (lfrf) treatmentAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 1053US2023369113A1Methods for forming multi-tier tungsten featuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1153US2025246482A1Growth suppression deposition for cvd tungsten gap fill with thermal treatmentAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 1252US2024047268A1Methods for forming multi-tier tungsten featuresAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1351US11657733B2Training method for evaluating bonding accuracy of orthodontic bracketsUNIV SICHUAN·Filed 2021·Granted May 23, 2023·0 cites·7 claims
- 1451US2024274407A1Processing system and methods to co-strike plasma to enhance tungsten growth incubation delayAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 1551US2023357929A1Apparatus and methods to promote wafer edge temperature uniformityAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1650US12315746B2Bottom cover plate to reduce wafer planar nonuniformityAPPLIED MATERIALS INC·Filed 2021·Granted May 27, 2025·0 cites·20 claims
- 1749US2024162089A1Surface depassivation with thermal etch after nitrogen radical treatmentAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1849US2023317458A1Gap fill enhancement with thermal etchAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 1949US2025253144A1Coetaneous deposition-etching for bottom-up carbon gapfillAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2049US2023374660A1Hardware to uniformly distribute active species for semiconductor film processingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2148US2024209500A1Processing system and methods for forming void-free and seam-free tungsten featuresAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2248US2024222128A1Methods to improve productivity of advanced cvd w gapfill processAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2347US2022359279A1Methods of forming void and seam free metal featuresAPPLIED MATERIALS INC·Filed 2021·Application pending·0 cites
- 2445US2021335586A1Methods and apparatus for cleaning a showerheadAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 2545US2024127123A1Federated learning model training method and apparatus, and electronic deviceJINGDONG TECH HOLDING CO LTD·Filed 2021·Application pending·0 cites
- 2643US2024177057A1Federated learning method and apparatus, electronic device, and storage mediumJINGDONG TECH HOLDING CO LTD·Filed 2022·Application pending·0 cites
- 2743US2019390949A1Methods, apparatuses and systems for conductive film layer thickness measurementsAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →