Inventor · disambiguated record
Phillip W. Palmatier
Also filed as: PALMATIER PHILLIP W
16 granted patents·1 pending application·83 citations·filing 1997–2019
90Inventor score
Top patents by PatentIndex Score
17 records- 0184US9278401B2Fill head interface with combination vacuum pressure chamberIBM·Filed 2013·Granted Mar 8, 2016·5 cites·16 claims
- 0279US10718062B2Prevent and remove organics from reservoir wellsIBM·Filed 2019·Granted Jul 21, 2020·0 cites·12 claims
- 0379US7833897B2Process for making interconnect solder Pb-free bumps free from organo-tin/tin deposits on the wafer surfaceIBM·Filed 2007·Granted Nov 16, 2010·7 cites·6 claims
- 0478US10450667B2System for treating solution for use in electroplating application and method for treating solution for use in electroplating applicationIBM·Filed 2014·Granted Oct 22, 2019·1 cites·14 claims
- 0576US10895017B2Prevent and remove organics from reservoir wellsIBM·Filed 2018·Granted Jan 19, 2021·0 cites·18 claims
- 0676US10392720B2Prevent and remove organics from reservoir wellsIBM·Filed 2018·Granted Aug 27, 2019·0 cites·12 claims
- 0773US11053604B2System for treating solution for use in electroplating application and method for treating solution for use in electroplating applicationIBM·Filed 2019·Granted Jul 6, 2021·0 cites·15 claims
- 0872US10087546B2Prevent and remove organics from reservoir wellsIBM·Filed 2014·Granted Oct 2, 2018·0 cites·8 claims
- 0969US10053794B2Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solutionGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 21, 2018·0 cites·12 claims
- 1068US9777388B2Electroplating system and method of using electroplating system for controlling concentration of organic additives in electroplating solutionGLOBALFOUNDRIES INC·Filed 2014·Granted Oct 3, 2017·0 cites·11 claims
- 1166US6080289AElectroplating apparatus with self-cleaning contactsIBM·Filed 1998·Granted Jun 27, 2000·19 cites·18 claims
- 1266US5869139AApparatus and method for plating pin grid array packaging modulesIBM·Filed 1997·Granted Feb 9, 1999·40 cites·8 claims
- 1357US6077405AMethod and apparatus for making electrical contact to a substrate during electroplatingIBM·Filed 1998·Granted Jun 20, 2000·11 cites·17 claims
- 1451US9428841B2Apparatuses, systems and methods that allow for selective removal of a specific metal from a multi-metal plating solutionIBM·Filed 2014·Granted Aug 30, 2016·0 cites·11 claims
- 1547US9498837B2Vacuum transition for solder bump mold fillingGARANT JOHN J·Filed 2009·Granted Nov 22, 2016·0 cites·9 claims
- 1645US6241868B1Method for electroplating a film onto a substrateIBM·Filed 2000·Granted Jun 5, 2001·0 cites·14 claims
- 1745US2009242614A1Method and tool for repositioning solder fill headIBM·Filed 2008·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →