Inventor · disambiguated record
Philip Eugene Rogren
Also filed as: ROGREN PHILIP E · ROGREN PHILIP EUGENE
37 granted patents·8 pending applications·143 citations·filing 1995–2024
96Inventor score
Top patents by PatentIndex Score
45 records- 0197US11489206B2Hybrid solid-state cell with a sealed anode structureSAKUU CORP·Filed 2021·Granted Nov 1, 2022·2 cites·20 claims
- 0297US9604411B2Multi-material three dimensional printerEOPLEX LTD·Filed 2015·Granted Mar 28, 2017·46 cites·33 claims
- 0396US11224917B1Multi-material three-dimensional printer with underlying adjustable binderSAKUU CORP·Filed 2021·Granted Jan 18, 2022·4 cites·14 claims
- 0494US11260581B2Jetted material printer with pressure-assisted fluid extractionSAKUU CORP·Filed 2020·Granted Mar 1, 2022·3 cites·15 claims
- 0592US12489148B2Hybrid solid-state cell with a 3D porous cathode structureSAKUU CORP·Filed 2024·Granted Dec 2, 2025·0 cites·20 claims
- 0691US8525305B1Lead carrier with print-formed package componentsROGREN PHILIP E·Filed 2011·Granted Sep 3, 2013·15 cites·27 claims
- 0790US11504913B2Multi-material three-dimensional printerSAKUU CORP·Filed 2022·Granted Nov 22, 2022·1 cites·21 claims
- 0888US12034126B2Hybrid solid-state cell with a 3D porous cathode structureSAKUU CORP·Filed 2023·Granted Jul 9, 2024·0 cites·9 claims
- 0988US11273608B2Multi-material three-dimensional printerSAKUU CORP·Filed 2018·Granted Mar 15, 2022·3 cites·16 claims
- 1088US11241742B1Multi-material three-dimensional printer with underlying adjustable binderSAKUU CORP·Filed 2021·Granted Feb 8, 2022·1 cites·18 claims
- 1185US11728517B2Hybrid solid-state cell with a 3D porous cathode structureSAKUU CORP·Filed 2022·Granted Aug 15, 2023·0 cites·27 claims
- 1284US12325184B2Method and system of using gradual drying in multi-material 3D printingSAKUU CORP·Filed 2024·Granted Jun 10, 2025·0 cites·17 claims
- 1383US11806937B2Method for creating structures of two or more materials using a multi-material three-dimensional printerSAKUU CORP·Filed 2022·Granted Nov 7, 2023·0 cites·23 claims
- 1482US11453059B1Multi-material three-dimensional printer with underlying adjustable binderSAKUU CORP·Filed 2022·Granted Sep 27, 2022·0 cites·12 claims
- 1581US11813792B2Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional objectSAKUU CORP·Filed 2022·Granted Nov 14, 2023·0 cites·23 claims
- 1680US11699814B2Hybrid solid-state cell with a sealed anode structureSAKUU CORP·Filed 2022·Granted Jul 11, 2023·0 cites·20 claims
- 1780US11527779B2Hybrid solid-state cell with a 3D porous cathode structureSAKUU CORP·Filed 2021·Granted Dec 13, 2022·0 cites·26 claims
- 1879US11616254B2Hybrid solid-state cell with a sealed anode structureSAKUU CORP·Filed 2021·Granted Mar 28, 2023·0 cites·23 claims
- 1978US11165101B2Hybrid solid-state cell with a sealed anode structureSAKUU CORP·Filed 2021·Granted Nov 2, 2021·0 cites·21 claims
- 2078US11063302B2Hybrid solid-state cell with a sealed anode structureSAKUU CORP·Filed 2021·Granted Jul 13, 2021·0 cites·18 claims
- 2178US10679954B2Integrated circuit system with carrier construction configuration and method of manufacture thereofEOPLEX LTD·Filed 2018·Granted Jun 9, 2020·2 cites·20 claims
- 2276US12005640B2Method and system of using gradual drying in multi-material 3D printingSAKUU CORP·Filed 2022·Granted Jun 11, 2024·0 cites·15 claims
- 2376US11440249B2Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional objectSAKUU CORP·Filed 2021·Granted Sep 13, 2022·0 cites·9 claims
- 2475US10971760B2Hybrid solid-state cell with a sealed anode structureKERACEL INC·Filed 2020·Granted Apr 6, 2021·0 cites·20 claims
- 2574US11298875B2Jetted material printer with pressure-assisted fluid extractionSAKUU CORP·Filed 2021·Granted Apr 12, 2022·0 cites·17 claims
- 2673US11167480B2Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional objectSAKUU CORP·Filed 2020·Granted Nov 9, 2021·0 cites·23 claims
- 2770US10535900B2Hybrid solid-state cell with a sealed anode structureKERACEL INC·Filed 2019·Granted Jan 14, 2020·0 cites·12 claims
- 2870US5620129ADevice and method for forming and attaching an array of conductive ballsFiled 1995·Granted Apr 15, 1997·43 cites·23 claims
- 2968US11583927B2Multi-material three-dimensional printer with underlying adjustable binderSAKUU CORP·Filed 2022·Granted Feb 21, 2023·0 cites·16 claims
- 3066US2020106135A1Hybrid solid-state cell with a sealed anode structureKERACEL INC·Filed 2019·Application pending·0 cites
- 3165US11084220B2Electrophotographic multi-material 3D printerKERACEL INC·Filed 2019·Granted Aug 10, 2021·0 cites·19 claims
- 3256US10581111B2Ceramic lithium retention deviceKERACEL INC·Filed 2018·Granted Mar 3, 2020·0 cites·17 claims
- 3356US5625228AHigh performance semiconductor package with area array leadsFiled 1995·Granted Apr 29, 1997·23 cites·9 claims
- 3455US10974453B2Three-dimensional, additive manufacturing system, and a method of manufacturing a three-dimensional objectKERACEL INC·Filed 2019·Granted Apr 13, 2021·0 cites·24 claims
- 3551US8865524B2Lead carrier with print-formed package componentsEOPLEX LTD·Filed 2013·Granted Oct 21, 2014·0 cites·9 claims
- 3651US2020220209A1Hybrid ceramic electrochemical cell structureKERACEL INC·Filed 2019·Application pending·0 cites
- 3746US2013001761A1Lead carrier with thermally fused package componentsROGREN PHILIP E·Filed 2012·Application pending·0 cites
- 3845US2016190078A1Integrated circuit system with carrier construction configuration and method of manufacture thereofEOPLEX LTD·Filed 2015·Application pending·0 cites
- 3944US9184114B2Lead carrier with print-formed terminal padsEOPLEX LTD·Filed 2013·Granted Nov 10, 2015·0 cites·22 claims
- 4044US2015194322A1Lead carrier with thermally fused package componentsEOPLEX LTD·Filed 2015·Application pending·0 cites
- 4140US8749035B2Lead carrier with multi-material print formed package componentsROGREN PHILIP E·Filed 2012·Granted Jun 10, 2014·0 cites·16 claims
- 4239US2018034038A1Lead carrier structure and packages formed therefrom without die attach padsROGREN PHILIP E·Filed 2016·Application pending·0 cites
- 4335US10612751B2Electrical system with lighting configuration and method of manufacture thereofEOPLEX LTD·Filed 2015·Granted Apr 7, 2020·0 cites·18 claims
- 4435US2018047588A1Lead carrier structure and packages formed therefrom without die attach padsEOPLEX LTD·Filed 2016·Application pending·0 cites
- 4533US2018047589A1Lead carrier with print formed package components and conductive path redistribution structuresROGREN PHILIP E·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →