Inventor · disambiguated record
Philip J. Spletter
Also filed as: SPLETTER PHILIP J
11 granted patents·397 citations·filing 1988–2013
93Inventor score
Top patents by PatentIndex Score
11 records- 0193US5272309ABonding metal members with multiple laser beamsMICROELECTRONICS & COMPUTER·Filed 1992·Granted Dec 21, 1993·89 cites·51 claims
- 0292US7424136B2Finger sensing with enhanced mounting and associated methodsAUTHENTEC INC·Filed 2006·Granted Sep 9, 2008·32 cites·30 claims
- 0391US8085998B2Finger sensor including enhanced ESD protection and associated methodsSETLAK DALE R·Filed 2006·Granted Dec 27, 2011·29 cites·30 claims
- 0486US8358816B2Thinned finger sensor and associated methodsAUTHENTEC INC·Filed 2009·Granted Jan 22, 2013·21 cites·32 claims
- 0586US5083007ABonding metal electrical members with a frequency doubled pulsed laser beamMICROELECTRONICS & COMPUTER·Filed 1990·Granted Jan 21, 1992·49 cites·36 claims
- 0682US7894643B2Finger sensor including flexible circuit and associated methodsAUTHENTEC INC·Filed 2006·Granted Feb 22, 2011·12 cites·28 claims
- 0777US7599532B2Finger sensing with enhanced mounting and associated methodsAUTHENTEC INC·Filed 2008·Granted Oct 6, 2009·8 cites·21 claims
- 0877US5049718AMethod of laser bonding for gold, gold coated and gold alloy coated electrical membersMICROELECTRONICS & COMPUTER·Filed 1990·Granted Sep 17, 1991·63 cites·21 claims
- 0976US4845335ALaser Bonding apparatus and methodMICROELECTRONICS & COMPUTER·Filed 1988·Granted Jul 4, 1989·45 cites·9 claims
- 1073US8971594B2Thinned finger sensor and associated methodsAUTHENTEC INC·Filed 2013·Granted Mar 3, 2015·4 cites·29 claims
- 1169US5164566AMethod and apparatus for fluxless solder reflowMICROELECTRONICS & COMPUTER·Filed 1990·Granted Nov 17, 1992·45 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →