Inventor · disambiguated record
Philip A. Stupar
Also filed as: STUPAR PHILIP · STUPAR PHILIP A · STUPAR PHILIP ANTHONY
31 granted patents·7 pending applications·337 citations·filing 2001–2024
97Inventor score
Files withTELEDYNE SCIENT & IMAGING LLC15TELEDYNE LICENSING LLC7DENATALE JEFFREY F6ROCKWELL SCIENT LICENSING LLC2STUPAR PHILIP A2
Top patents by PatentIndex Score
38 records- 0192US8319156B2System for heating a vapor cellBORWICK III ROBERT L·Filed 2009·Granted Nov 27, 2012·46 cites·20 claims
- 0292US8258884B2System for charging a vapor cellBORWICK ROBERT L III·Filed 2009·Granted Sep 4, 2012·62 cites·17 claims
- 0392US7303935B2High temperature microelectromechanical (MEM) devices and fabrication methodTELEDYNE LICENSING LLC·Filed 2005·Granted Dec 4, 2007·20 cites·4 claims
- 0491US9409768B2MEMS device with integrated temperature stabilizationTELEDYNE SCIENT & IMAGING LLC·Filed 2013·Granted Aug 9, 2016·8 cites·19 claims
- 0591US7619485B2Compact optical assembly for chip-scale atomic clockTELEDYNE SCIENT & IMAGING LLC·Filed 2007·Granted Nov 17, 2009·24 cites·37 claims
- 0688US10613319B2Compact, high-performance MEMS-based optical shutterTELEDYNE SCIENT & IMAGING LLC·Filed 2018·Granted Apr 7, 2020·8 cites·37 claims
- 0787US8080736B2Non-planar microcircuit structure and method of fabricating sameDENATALE JEFFREY F·Filed 2009·Granted Dec 20, 2011·15 cites·29 claims
- 0887US7987714B2Disc resonator gyroscope with improved frequency coincidence and method of manufactureBOEING CO·Filed 2007·Granted Aug 2, 2011·21 cites·17 claims
- 0986US7328604B2Microelectromechanical (MEM) fluid health sensing device and fabrication methodTELEDYNE LICENSING LLC·Filed 2005·Granted Feb 12, 2008·10 cites·47 claims
- 1085US8826514B2Microfabricated inductors with through-wafer viasPAPAVASILIOU ALEXANDROS·Filed 2011·Granted Sep 9, 2014·10 cites·16 claims
- 1183US7810379B2High temperature microelectromechanical (MEM) devicesROCKWELL SCIENT LICENSING LLC·Filed 2007·Granted Oct 12, 2010·8 cites·20 claims
- 1282US10325707B2Integrated field coil for compact atomic devicesTELEDYNE SCIENT & IMAGING LLC·Filed 2017·Granted Jun 18, 2019·2 cites·20 claims
- 1382US7346981B2Method for fabricating microelectromechanical system (MEMS) devicesTELEDYNE LICENSING LLC·Filed 2003·Granted Mar 25, 2008·25 cites·29 claims
- 1481US9029259B2Self-aligning hybridization methodTELEDYNE SCIENT & IMAGING LLC·Filed 2012·Granted May 12, 2015·6 cites·22 claims
- 1581US8327684B2Method for adjusting resonance frequencies of a vibrating microelectromechanical deviceDENATALE JEFFREY F·Filed 2008·Granted Dec 11, 2012·8 cites·14 claims
- 1681US8088667B2Method of fabricating vertical capacitors in through-substrate viasDENATALE JEFFREY F·Filed 2008·Granted Jan 3, 2012·10 cites·40 claims
- 1781US7538032B2Low temperature method for fabricating high-aspect ratio vias and devices fabricated by said methodTELEDYNE SCIENT & IMAGING LLC·Filed 2005·Granted May 26, 2009·12 cites·20 claims
- 1880US7287415B2Microelectromechanical system (MEMS) viscosity sensor for fluid health monitoringTELEDYNE LICENSING LLC·Filed 2004·Granted Oct 30, 2007·17 cites·24 claims
- 1977US7329932B2Microelectromechanical (MEM) viscosity sensor and methodTELEDYNE LICENSING LLC·Filed 2005·Granted Feb 12, 2008·5 cites·43 claims
- 2075US8937513B2Micro-scale system to provide thermal isolation and electrical communication between substratesTELEDYNE SCIENT & IMAGING LLC·Filed 2013·Granted Jan 20, 2015·1 cites·17 claims
- 2169US7735362B2Thermomechanical sensor for fluid diagnosticsTELEDYNE LICENSING LLC·Filed 2006·Granted Jun 15, 2010·2 cites·9 claims
- 2265US8456249B2Micro-scale system to provide thermal isolation and electrical communication between substratesDENATALE JEFFREY F·Filed 2011·Granted Jun 4, 2013·1 cites·24 claims
- 2365US7261430B1Thermal and intrinsic stress compensated micromirror apparatus and methodTELEDYNE LICENSING LLC·Filed 2006·Granted Aug 28, 2007·3 cites·22 claims
- 2462US2025033954A13D Heterogeneously Integrated Power Electronic Building BlocksTELEDYNE SCIENT & IMAGING LLC·Filed 2024·Application pending·0 cites
- 2561US8995800B2Method of fabricating silicon waveguides with embedded active circuitrySTUPAR PHILIP A·Filed 2012·Granted Mar 31, 2015·1 cites·16 claims
- 2660US8847409B1Compliant micro-socket hybridization methodTELEDYNE SCIENT & IMAGING LLC·Filed 2013·Granted Sep 30, 2014·1 cites·42 claims
- 2760US6771081B2Liquid-medium immersed MEMs devicesROCKWELL SCIENT LICENSING LLC·Filed 2002·Granted Aug 3, 2004·10 cites·17 claims
- 2856US10416246B2Physics package for compact atomic deviceTELEDYNE SCIENT & IMAGING LLC·Filed 2017·Granted Sep 17, 2019·0 cites·21 claims
- 2956US8187972B2Through-substrate vias with polymer fill and method of fabricating sameSTUPAR PHILIP A·Filed 2011·Granted May 29, 2012·1 cites·17 claims
- 3052US2010225436A1Microfabricated inductors with through-wafer viasTELEDYNE SCIENT & IMAGING LLC·Filed 2009·Application pending·0 cites
- 3152US2023133753A1Single-axis inertial sensor module with interposerTELEDYNE SCIENT & IMAGING LLC·Filed 2021·Application pending·0 cites
- 3251US8505357B2Method for adjusting resonance frequencies of a vibrating microelectromechanical deviceDENATALE JEFFREY F·Filed 2011·Granted Aug 13, 2013·0 cites·16 claims
- 3350US2015185416A1Silicon waveguides with embedded active circuitryTELEDYNE SCIENT & IMAGING LLC·Filed 2015·Application pending·0 cites
- 3449US8505358B2Method for adjusting resonance frequencies of a vibrating microelectromechanical deviceDENATALE JEFFREY F·Filed 2011·Granted Aug 13, 2013·0 cites·15 claims
- 3546US9607748B2Micro-fabricated integrated coil and magnetic circuit and method of manufacturing thereofTELEDYNE SCIENT & IMAGING LLC·Filed 2014·Granted Mar 28, 2017·0 cites·16 claims
- 3645US2010001378A1Through-substrate vias and method of fabricating sameTELEDYNE SCIENT & IMAGING LLC·Filed 2008·Application pending·0 cites
- 3740US2003078549A1Microfabricated surgical devices and methods of making the sameFiled 2002·Application pending·0 cites
- 3839US2002188310A1Microfabricated surgical deviceFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →