Inventor · disambiguated record
Pierre Bar
Also filed as: BAR PIERRE
26 granted patents·8 pending applications·63 citations·filing 2010–2025
93Inventor score
Files withST MICROELECTRONICS SA16BAR PIERRE6ST MICROELECTRONICS INT NV5JOBLOT SYLVAIN3ST MICROELECTRONICS CROLLES 2 SAS3
Top patents by PatentIndex Score
34 records- 0192US8841748B2Semiconductor device comprising a capacitor and an electrical connection via and fabrication methodJOBLOT SYLVAIN·Filed 2011·Granted Sep 23, 2014·21 cites·17 claims
- 0288US8841749B2Semiconductor device comprising a capacitor and an electrical connection via, and fabrication methodJOBLOT SYLVAIN·Filed 2011·Granted Sep 23, 2014·17 cites·24 claims
- 0381US9638589B2Method for determining a three-dimensional stress field of an object, an integrated structure in particular, and corresponding systemST MICROELECTRONICS SA·Filed 2014·Granted May 2, 2017·6 cites·33 claims
- 0476US8587921B2Method of adjustment on manufacturing of a circuit having a resonant elementBAR PIERRE·Filed 2010·Granted Nov 19, 2013·4 cites·12 claims
- 0575US9240624B2Process for fabricating an integrated circuit comprising at least one coplanar waveguideJOBLOT SYLVAIN·Filed 2012·Granted Jan 19, 2016·3 cites·18 claims
- 0674US8593234B2Bragg mirror and BAW resonator with a high quality factor on the bragg mirrorBAR PIERRE·Filed 2010·Granted Nov 26, 2013·4 cites·19 claims
- 0774US8397360B2Method for manufacturing a monolithic oscillator with bulk acoustic wave (BAW) resonatorsBAR PIERRE·Filed 2010·Granted Mar 19, 2013·4 cites·17 claims
- 0873US8756778B2Method of adjustment during manufacture of a circuit having a capacitorBAR PIERRE·Filed 2011·Granted Jun 24, 2014·3 cites·15 claims
- 0970US12347670B2Etching methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2022·Granted Jul 1, 2025·0 cites·20 claims
- 1063US2025167148A1Manufacturing method of an electronic circuit comprising contact padsST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1161US9418954B2Integrated circuit chip assembled on an interposerST MICROELECTRONICS SA·Filed 2015·Granted Aug 16, 2016·1 cites·21 claims
- 1257US11469095B2Etching methodST MICROELECTRONICS CROLLES 2 SAS·Filed 2019·Granted Oct 11, 2022·0 cites·29 claims
- 1357US2024321639A1Method for dicing a semiconductor waferST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1455US9818646B2Process for fabricating an integrated circuit comprising at least one coplanar waveguideST MICROELECTRONICS SA·Filed 2017·Granted Nov 14, 2017·0 cites·18 claims
- 1554US2025194267A1Image sensor manufacturing methodST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1654US2025324792A1Image sensor and its manufacturing methodST MICROELECTRONICS INT NV·Filed 2025·Application pending·0 cites
- 1753US9673088B2Process for fabricating an integrated circuit comprising at least one coplanar waveguideST MICROELECTRONICS SA·Filed 2015·Granted Jun 6, 2017·0 cites·17 claims
- 1853US9647625B2Method for manufacturing BAW resonators on a semiconductor waferST MICROELECTRONICS SA·Filed 2013·Granted May 9, 2017·0 cites·15 claims
- 1952US9324612B2Shielded coplanar lineST MICROELECTRONICS SA·Filed 2013·Granted Apr 26, 2016·0 cites·18 claims
- 2052US2025212534A1Contact pad processing methodST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 2150US9385424B2Three-dimensional integrated structure comprising an antennaST MICROELECTRONICS SA·Filed 2013·Granted Jul 5, 2016·0 cites·1 claims
- 2248US9455191B2Shielded coplanar lineST MICROELECTRONICS SA·Filed 2016·Granted Sep 27, 2016·0 cites·19 claims
- 2347US9780015B2Integrated circuit chip assembled on an interposerST MICROELECTRONICS SA·Filed 2016·Granted Oct 3, 2017·0 cites·21 claims
- 2446US8994172B2Connection of a chip provided with through viasST MICROELECTRONICS SA·Filed 2013·Granted Mar 31, 2015·0 cites·19 claims
- 2545US2016197048A1Three-dimensional integrated structure comprising an antenna cross reference to related applicationsST MICROELECTRONICS SA·Filed 2016·Application pending·0 cites
- 2645US2011080233A1Method for manufacturing baw resonators on a semiconductor waferST MICROELECTRONICS SA·Filed 2010·Application pending·0 cites
- 2744US10770306B2Method of etching a cavity in a stack of layersST MICROELECTRONICS CROLLES 2 SAS·Filed 2019·Granted Sep 8, 2020·0 cites·16 claims
- 2844US9147725B2Semiconductor device comprising an integrated capacitor and method of fabricationST MICROELECTRONICS SA·Filed 2013·Granted Sep 29, 2015·0 cites·10 claims
- 2942US9165861B2Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structureST MICROELECTRONICS SA·Filed 2014·Granted Oct 20, 2015·0 cites·20 claims
- 3042US8975737B2Transmission line for electronic circuitsBAR PIERRE·Filed 2011·Granted Mar 10, 2015·0 cites·22 claims
- 3142US8704358B2Method for forming an integrated circuitST MICROELECTRONICS SA·Filed 2012·Granted Apr 22, 2014·0 cites·13 claims
- 3241US8988893B2Method for electrical connection between elements of a three-dimensional integrated structure and corresponding deviceBAR PIERRE·Filed 2012·Granted Mar 24, 2015·0 cites·17 claims
- 3335US9646914B2Process for producing a microfluidic circuit within a three-dimensional integrated structure, and corresponding structureST MICROELECTRONICS SA·Filed 2015·Granted May 9, 2017·0 cites·7 claims
- 3435US2012004016A1Filtering circuit with coupled baw resonators and having impedance matching adaptationCARPENTIER JEAN-FRANCOIS·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →