Inventor · disambiguated record
Pin-Chuan Chen
Also filed as: CHEN PIN-CHUAN
66 granted patents·40 pending applications·99 citations·filing 2007–2019
98Inventor score
Files withADVANCED OPTOELECTRONIC TECH72CHEN PIN-CHUAN9LIN HSIN-CHIANG6CHEN LUNG-HSIN3CHEN SHYANG-YIH2
Top patents by PatentIndex Score
106 records- 0196US9431591B1LED package with reflecting cupADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Aug 30, 2016·8 cites·15 claims
- 0292US8089089B2Side-emitting LED package and manufacturing method of the sameKUO CHESTER·Filed 2010·Granted Jan 3, 2012·22 cites·20 claims
- 0388US9543486B1LED package with reflecting cupADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Jan 10, 2017·6 cites·17 claims
- 0480US8569080B2Method for packaging light emitting diodeCHEN LI-HSIANG·Filed 2012·Granted Oct 29, 2013·6 cites·12 claims
- 0576US8373189B2Light emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2011·Granted Feb 12, 2013·4 cites·13 claims
- 0674US8546160B2Method for packaging light emitting diodesCHEN PIN-CHUAN·Filed 2012·Granted Oct 1, 2013·4 cites·8 claims
- 0773US9147809B1Flip chip light emitting diode packaging structureADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Sep 29, 2015·2 cites·13 claims
- 0873US9048394B2Light emitting diode package with oxidation-resistant metal coating layerADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 2, 2015·3 cites·20 claims
- 0973US8945959B2LED with thin package struture and method for manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 3, 2015·3 cites·11 claims
- 1072US8748200B2Method for manufacturing LED packageADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 10, 2014·1 cites·3 claims
- 1171US8455274B2Method for manufacturing light emitting diodeCHEN PIN-CHUAN·Filed 2011·Granted Jun 4, 2013·3 cites·17 claims
- 1269US7863717B2Package structure of integrated circuit device and manufacturing method thereofADVANCED OPTOELECTRONIC TECH·Filed 2009·Granted Jan 4, 2011·4 cites·20 claims
- 1366US8476089B2Method for manufacturing light emitting diode packageCHEN PIN-CHUAN·Filed 2012·Granted Jul 2, 2013·2 cites·17 claims
- 1465US9012248B2Method for packaging light emitting diodeCHEN LUNG-HSIN·Filed 2012·Granted Apr 21, 2015·2 cites·8 claims
- 1565US8298861B2Package structure of compound semiconductor device and fabricating method thereofCHEN PIN CHUAN·Filed 2010·Granted Oct 30, 2012·2 cites·3 claims
- 1664US10890802B2Optical lens, backlight module and display device using sameADVANCED OPTOELECTRONIC TECH·Filed 2019·Granted Jan 12, 2021·0 cites·14 claims
- 1764US9039222B2Backlight module with light-guiding portionsADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted May 26, 2015·2 cites·16 claims
- 1863US9324702B2Photoelectric deviceADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Apr 26, 2016·1 cites·14 claims
- 1962USD763206SLight emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Aug 9, 2016·9 cites·1 claims
- 2062US9184358B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Nov 10, 2015·1 cites·12 claims
- 2162US8569791B2LED and method for manufacturing the sameCHEN PIN-CHUAN·Filed 2011·Granted Oct 29, 2013·1 cites·10 claims
- 2262US8455275B2Method for making light emitting diode packageHONG MENG-HSIEN·Filed 2011·Granted Jun 4, 2013·2 cites·3 claims
- 2362US8356003B2Automated integration of events for a surveillance systemCHUNGHWA TELECOM CO LTD·Filed 2009·Granted Jan 15, 2013·3 cites·10 claims
- 2461US9065028B2Flip-chip light emitting diode package with moisture barrier layerADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Jun 23, 2015·1 cites·18 claims
- 2561US9040321B2Method for manufacturing light emitting diode packagesZHONGSHAN INNOCLOUD IP SERVICES CO LTD·Filed 2014·Granted May 26, 2015·1 cites·19 claims
- 2660US8981419B2LedADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·0 cites·1 claims
- 2760US8735933B2Light emitting diode package and method of manufacturing the sameLIN HSIN-CHIANG·Filed 2012·Granted May 27, 2014·1 cites·4 claims
- 2858US7893528B2Package structure of compound semiconductor device and fabricating method thereofADVANCED OPTOELECTRONIC TECH·Filed 2009·Granted Feb 22, 2011·1 cites·1 claims
- 2958US2009138252A1Method and system of evaluating disease severityINST INFORMATION INDUSTRY·Filed 2007·Application pending·0 cites
- 3057US8733115B2Method for controlling freezing capacity of a variable-frequency freezing AC ice-water systemCHEN SHYANG-YIH·Filed 2010·Granted May 27, 2014·1 cites·10 claims
- 3156US8513695B2LED package and method for making the sameLIN HSIN-CHIANG·Filed 2011·Granted Aug 20, 2013·0 cites·7 claims
- 3256US8492180B2LED and method for manufacturing the sameLIN HSIN-CHIANG·Filed 2011·Granted Jul 23, 2013·0 cites·8 claims
- 3355US9437585B2Photoelectric device and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Sep 6, 2016·0 cites·12 claims
- 3455US2011023503A1Performance detection methodCHUNGHWA TELECOM CO LTD·Filed 2009·Application pending·0 cites
- 3554US8835198B2Method for manufacturing LEDADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Sep 16, 2014·0 cites·8 claims
- 3654US2015003080A1Light emitting diode moduleADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 3752US9899587B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Feb 20, 2018·0 cites·4 claims
- 3852US9842968B2LED packageADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Dec 12, 2017·0 cites·12 claims
- 3952US8960955B2LED lamp having a large illumination angleADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Feb 24, 2015·0 cites·20 claims
- 4052US8633507B2LED with versatile mounting waysLIN HSIN-CHIANG·Filed 2012·Granted Jan 21, 2014·0 cites·17 claims
- 4152US2010059785A1Light emitting device and method of fabricating the sameADVANCED OPTOELECTRONIC TECH·Filed 2009·Application pending·0 cites
- 4251US9666568B2Photoelectric device and method of manufacturing the sameADVANCED OPTOELECTRONIC TECH·Filed 2016·Granted May 30, 2017·0 cites·7 claims
- 4350US10133133B1Liquid crystal display baseADVANCED OPTOELECTRONIC TECH·Filed 2017·Granted Nov 20, 2018·0 cites·10 claims
- 4450US9620692B2Lead frame and light emitting diode package having the sameADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted Apr 11, 2017·0 cites·11 claims
- 4550US8981447B2Light emitting diode packageADVANCED OPTOELECTRONIC TECH·Filed 2013·Granted Mar 17, 2015·0 cites·6 claims
- 4650US2015009680A1Lens and light emitting element using the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Application pending·0 cites
- 4749US9660144B2LED package and LED dieADVANCED OPTOELECTRONIC TECH·Filed 2015·Granted May 23, 2017·0 cites·13 claims
- 4849US9465205B2Optical lens and backlight module incorporating the sameADVANCED OPTOELECTRONIC TECH·Filed 2014·Granted Oct 11, 2016·0 cites·10 claims
- 4949US8906715B2Light emitting diode package having fluorescent film directly coated on light emitting diode die and method for manufacturing the sameCHEN LUNG-HSIN·Filed 2012·Granted Dec 9, 2014·0 cites·10 claims
- 5049US8535960B2Method for packaging light emitting diode having fluorescent material directly coated on LED die thereofCHEN PIN-CHUAN·Filed 2012·Granted Sep 17, 2013·0 cites·10 claims
Showing the top 50 of 106 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →