Inventor · disambiguated record
Pil-Kyu Kang
Also filed as: KANG PIL G · KANG PIL-KYU
56 granted patents·15 pending applications·1,524 citations·filing 2006–2024
98Inventor score
Top patents by PatentIndex Score
71 records- 0199US8343851B2Wafer temporary bonding method using silicon direct bondingSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 1, 2013·239 cites·16 claims
- 0298US9941243B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 10, 2018·237 cites·20 claims
- 0398US9461007B2Wafer-to-wafer bonding structureSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Oct 4, 2016·239 cites·20 claims
- 0498US8354308B2Conductive layer buried-type substrate, method of forming the conductive layer buried-type substrate, and method of fabricating semiconductor device using the conductive layer buried-type substrateSAMSUNG ELECTRONICS CO LTD·Filed 2011·Granted Jan 15, 2013·230 cites·13 claims
- 0598US8053829B2Methods of fabricating nonvolatile memory devicesSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Nov 8, 2011·208 cites·3 claims
- 0697US8866187B2Photodetector structures including cross-sectional waveguide boundariesSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 21, 2014·29 cites·14 claims
- 0796US11121080B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Sep 14, 2021·4 cites·20 claims
- 0896US9865581B2Method of fabricating multi-substrate semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Jan 9, 2018·25 cites·20 claims
- 0996US9520361B2Semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 13, 2016·28 cites·20 claims
- 1095US8163616B2Methods of manufacturing nonvolatile memory devicesKANG PIL-KYU·Filed 2011·Granted Apr 24, 2012·31 cites·5 claims
- 1194US9935037B2Multi-stacked device having TSV structureSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Apr 3, 2018·13 cites·20 claims
- 1294US8390120B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2010·Granted Mar 5, 2013·29 cites·29 claims
- 1393US10639875B2Wafer bonding apparatus and wafer bonding system including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted May 5, 2020·6 cites·20 claims
- 1493US9530706B2Semiconductor devices having hybrid stacking structures and methods of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Dec 27, 2016·13 cites·17 claims
- 1593US8791405B2Optical waveguide and coupler apparatus and method of manufacturing the sameJI HO-CHUL·Filed 2010·Granted Jul 29, 2014·21 cites·20 claims
- 1692US10468400B2Method of manufacturing substrate structureSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Nov 5, 2019·8 cites·19 claims
- 1792US8952543B2Via connection structures, semiconductor devices having the same, and methods of fabricating the structures and devicesLEE HO-JIN·Filed 2012·Granted Feb 10, 2015·15 cites·25 claims
- 1892US8728850B2Photodetector structure and method of manufacturing the sameJI HO-CHUL·Filed 2011·Granted May 20, 2014·10 cites·10 claims
- 1991US8963336B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2014·Granted Feb 24, 2015·12 cites·20 claims
- 2090US9070748B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 30, 2015·10 cites·14 claims
- 2189US9653430B2Semiconductor devices having stacked structures and methods for fabricating the sameKIM TAEYEONG·Filed 2015·Granted May 16, 2017·14 cites·20 claims
- 2289US8842942B2Optical modulator formed on bulk-silicon substrateSHIN DONG-JAE·Filed 2011·Granted Sep 23, 2014·7 cites·18 claims
- 2389US8129833B2Stacked integrated circuit packages that include monolithic conductive viasKANG PIL-KYU·Filed 2009·Granted Mar 6, 2012·13 cites·10 claims
- 2488US8927426B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 6, 2015·10 cites·14 claims
- 2587US8941216B2Semiconductor devices having through-vias and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 27, 2015·7 cites·7 claims
- 2686US12136602B2Method of fabricating a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Nov 5, 2024·1 cites·16 claims
- 2786US9064941B2Semiconductor packages, methods of manufacturing the same, and semiconductor package structures including the sameJUNG DEOK-YOUNG·Filed 2015·Granted Jun 23, 2015·5 cites·11 claims
- 2884US8873901B2Buried-type optical input/output devices and methods of manufacturing the sameKANG PIL-KYU·Filed 2012·Granted Oct 28, 2014·6 cites·20 claims
- 2983US9236349B2Semiconductor device including through via structures and redistribution structuresSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jan 12, 2016·6 cites·20 claims
- 3083US9171753B2Semiconductor devices having conductive via structures and methods for fabricating the sameLEE HO-JIN·Filed 2013·Granted Oct 27, 2015·7 cites·19 claims
- 3181US9103974B2Semiconductor devices having optical transceiverKANG PIL-KYU·Filed 2012·Granted Aug 11, 2015·5 cites·13 claims
- 3280US11152317B2Semiconductor device including interconnection structure including copper and tin and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Oct 19, 2021·2 cites·17 claims
- 3379US8422845B2Optical input/output device for photo-electric integrated circuit device and method of fabricating sameKANG PIL-KYU·Filed 2010·Granted Apr 16, 2013·4 cites·8 claims
- 3479US2025022823A1Semiconductor device and semiconductor package including the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3578US9847276B2Semiconductor devices having through-electrodes and methods for fabricating the sameKANG PIL-KYU·Filed 2014·Granted Dec 19, 2017·5 cites·14 claims
- 3677US9773660B2Wafer processing methodsSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Sep 26, 2017·3 cites·20 claims
- 3777US9287251B2Method of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 3877US8564139B2Semiconductor devices including protected barrier layersLEE HO-JIN·Filed 2012·Granted Oct 22, 2013·4 cites·18 claims
- 3977US8319329B2Stacked integrated circuit package having recessed sidewallsKANG PIL-KYU·Filed 2012·Granted Nov 27, 2012·3 cites·18 claims
- 4073US9312171B2Semiconductor devices having through-electrodes and methods for fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 12, 2016·3 cites·20 claims
- 4172US8293613B2Gettering structures and methods and their applicationPARK YOUNG-SOO·Filed 2010·Granted Oct 23, 2012·2 cites·14 claims
- 4268US8048784B2Methods of manufacturing semiconductor devices including a doped silicon layerSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Nov 1, 2011·2 cites·21 claims
- 4367US11610838B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 21, 2023·0 cites·20 claims
- 4467US9530726B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2013·Granted Dec 27, 2016·2 cites·16 claims
- 4564US8867882B2Optical input/output device for photo-electric integrated circuit device and method of fabricating sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Oct 21, 2014·1 cites·15 claims
- 4663US9831164B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 28, 2017·1 cites·15 claims
- 4761US11283235B2Semiconductor laser deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 4861US7470603B2Methods of fabricating semiconductor devices having laser-formed single crystalline active structuresSAMSUNG ELECTRONICS CO LTD·Filed 2007·Granted Dec 30, 2008·1 cites·27 claims
- 4960US2024379639A1Semiconductor packageSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 5058US8901694B2Optical input/output device and method of fabricating the sameKANG PIL-KYU·Filed 2012·Granted Dec 2, 2014·0 cites·17 claims
Showing the top 50 of 71 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →