Inventor · disambiguated record
Ping-Yin Liu
Also filed as: LIU PING · LIU PING-YIN
115 granted patents·12 pending applications·2,031 citations·filing 1997–2025
99Inventor score
Top patents by PatentIndex Score
127 records- 0199US9711555B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jul 18, 2017·31 cites·20 claims
- 0299US9257399B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 9, 2016·232 cites·19 claims
- 0399US8802538B1Methods for hybrid wafer bondingTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Aug 12, 2014·269 cites·20 claims
- 0499US8377798B2Method and structure for wafer to wafer bonding in semiconductor packagingTAIWAN SEMICONDUCTOR MFG·Filed 2010·Granted Feb 19, 2013·222 cites·23 claims
- 0598USD1073527SRing coverLIU PING·Filed 2025·Granted May 6, 2025·8 cites·1 claims
- 0698US11189515B2Method for alignment, process tool and method for wafer-level alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 30, 2021·5 cites·20 claims
- 0798US10103122B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Oct 16, 2018·26 cites·20 claims
- 0898US9443796B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 13, 2016·221 cites·20 claims
- 0998US9142517B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG·Filed 2012·Granted Sep 22, 2015·247 cites·17 claims
- 1098US8809123B2Three dimensional integrated circuit structures and hybrid bonding methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Aug 19, 2014·238 cites·20 claims
- 1197USD1083657SRing coverLIU PING·Filed 2025·Granted Jul 15, 2025·5 cites·1 claims
- 1297US9960129B2Hybrid bonding mechanisms for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted May 1, 2018·22 cites·17 claims
- 1397US9834435B1Structure and formation method of semiconductor device structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Dec 5, 2017·20 cites·20 claims
- 1497US9725310B2Micro electromechanical system sensor and method of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·14 cites·20 claims
- 1597US9425155B2Wafer bonding process and structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Aug 23, 2016·28 cites·20 claims
- 1696US11550812B2Processing a federated query via data serializationIBM·Filed 2021·Granted Jan 10, 2023·7 cites·20 claims
- 1796US10790189B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·9 cites·20 claims
- 1896US10665449B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 26, 2020·5 cites·20 claims
- 1996US9490158B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Nov 8, 2016·15 cites·20 claims
- 2096US9048283B2Hybrid bonding systems and methods for semiconductor wafersLIU PING-YIN·Filed 2012·Granted Jun 2, 2015·22 cites·20 claims
- 2196US8629524B2Apparatus for vertically integrated backside illuminated image sensorsWANG TZU-JUI·Filed 2012·Granted Jan 14, 2014·26 cites·12 claims
- 2295USD1088944SRing coverLIU PING·Filed 2025·Granted Aug 19, 2025·3 cites·1 claims
- 2395US11932534B2MEMS device having a metallization structure embedded in a dielectric structure with laterally offset sidewalls of a first portion and a second portionTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Mar 19, 2024·2 cites·20 claims
- 2495US9728453B2Methods for hybrid wafer bonding integrated with CMOS processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 8, 2017·21 cites·19 claims
- 2595US9646860B2Alignment systems and wafer bonding systems and methodsTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted May 9, 2017·19 cites·20 claims
- 2695US9331032B2Hybrid bonding and apparatus for performing the sameTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted May 3, 2016·24 cites·20 claims
- 2795US9136302B2Apparatus for vertically integrated backside illuminated image sensorsTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Sep 15, 2015·11 cites·20 claims
- 2894US10354972B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 16, 2019·7 cites·20 claims
- 2994US9576827B2Apparatus and method for wafer level bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Feb 21, 2017·15 cites·20 claims
- 3093US10497667B2Apparatus for bond wave propagation controlTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 3, 2019·3 cites·20 claims
- 3192USD974886SMagnetic hookSHENZHEN HUASHITAI TECH CO LTD·Filed 2022·Granted Jan 10, 2023·17 cites·1 claims
- 3292US11037978B2Dual facing BSI image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Jun 15, 2021·2 cites·20 claims
- 3392US8478912B2Magnetic connector for data and power transferLIU PING·Filed 2011·Granted Jul 2, 2013·31 cites·15 claims
- 3491USD1061309SRing coverLIU PING·Filed 2024·Granted Feb 11, 2025·11 cites·1 claims
- 3591US9446467B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Sep 20, 2016·9 cites·19 claims
- 3691US9412725B2Method and apparatus for image sensor packagingCHEN SZU-YING·Filed 2012·Granted Aug 9, 2016·12 cites·23 claims
- 3790USD966872SMagnetic hookSHENZHEN HUASHITAI TECH CO LTD·Filed 2022·Granted Oct 18, 2022·14 cites·1 claims
- 3890US9748198B2Hybrid bonding systems and methods for semiconductor wafersTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Aug 29, 2017·5 cites·20 claims
- 3990US8905293B2Self-removal anti-stiction coating for bonding processLIU PING-YIN·Filed 2010·Granted Dec 9, 2014·12 cites·19 claims
- 4090US8580594B2Method of fabricating a semiconductor device having recessed bonding siteHUANG HSIN-TING·Filed 2011·Granted Nov 12, 2013·13 cites·18 claims
- 4189US9786628B2Air trench in packages incorporating hybrid bondingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 10, 2017·4 cites·20 claims
- 4288US10280076B2Semiconductor structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted May 7, 2019·3 cites·20 claims
- 4388US9754813B2Bond chuck, methods of bonding, and tool including bond chuckTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 5, 2017·5 cites·20 claims
- 4488US9406711B2Apparatus and method for backside illuminated image sensorsCHEN SZU-YING·Filed 2012·Granted Aug 2, 2016·5 cites·20 claims
- 4587US9054121B2MEMS structures and methods for forming the sameLIU PING-YIN·Filed 2011·Granted Jun 9, 2015·5 cites·20 claims
- 4687US2024178263A1Dual facing bsi image sensors with wafer level stackingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2024·Application pending·0 cites
- 4786US12255062B2Integrate rinse module in hybrid bonding platformTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2023·Granted Mar 18, 2025·0 cites·20 claims
- 4886US10636688B2Method for alignment, process tool and method for wafer-level alignmentTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 28, 2020·3 cites·20 claims
- 4986US10510597B2Methods for hybrid wafer bonding integrated with CMOS processingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 17, 2019·4 cites·20 claims
- 5086US10090196B23D integrated circuit and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 2, 2018·3 cites·20 claims
Showing the top 50 of 127 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →