Inventor · disambiguated record
Pierangelo Magni
Also filed as: MAGNI PIERANGELO
22 granted patents·5 pending applications·289 citations·filing 1992–2024
94Inventor score
Files withST MICROELECTRONICS SRL19SGS THOMSON MICROELECTRONICS5MAGNI PIERANGELO1ST MICROELECTRONICS INT NV1Xiong hui jun1
Top patents by PatentIndex Score
27 records- 0193US6281566B1Plastic package for electronic devicesSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Aug 28, 2001·187 cites·25 claims
- 0277US12381121B2Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS SRL·Filed 2024·Granted Aug 5, 2025·0 cites·18 claims
- 0369US11842954B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Granted Dec 12, 2023·0 cites·13 claims
- 0468US6002173ASemiconductor device package with metal-polymer joint of controlled roughnessSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Dec 14, 1999·40 cites·19 claims
- 0566US11901250B2Method of manufacturing semiconductor devices and corresponding deviceST MICROELECTRONICS SRL·Filed 2021·Granted Feb 13, 2024·0 cites·24 claims
- 0666US2022406703A1Method of manufacturing leadframes for semiconductor devices, corresponding leadframe and semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 0764US8808641B2Assembly of a microfluidic device for analysis of biological materialMAGNI PIERANGELO·Filed 2008·Granted Aug 19, 2014·2 cites·32 claims
- 0863US11462465B2Method of manufacturing leadframes for semiconductor devices, corresponding leadframe and semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Oct 4, 2022·0 cites·20 claims
- 0962US9324639B2Electronic device comprising an improved lead frameST MICROELECTRONICS SRL·Filed 2015·Granted Apr 26, 2016·1 cites·12 claims
- 1061US11417590B2Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Aug 16, 2022·0 cites·21 claims
- 1160US7061697B2Method for fixing a lens of an optic group with respect to an optical sensor inside an electronic device able to acquire images and corresponding deviceST MICROELECTRONICS SRL·Filed 2004·Granted Jun 13, 2006·10 cites·39 claims
- 1259US6811738B2Manufacturing method of an electronic device packageST MICROELECTRONICS SRL·Filed 2001·Granted Nov 2, 2004·8 cites·8 claims
- 1359US2025015038A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS INT NV·Filed 2024·Application pending·0 cites
- 1454US5735449AMethod and apparatus for bonding semiconductor electronic devicesSGS THOMSON MICROELECTRONICS·Filed 1997·Granted Apr 7, 1998·18 cites·10 claims
- 1554US2023143539A1Method of manufacturing semiconductor devices and corresponding semiconductor deviceST MICROELECTRONICS SRL·Filed 2022·Application pending·0 cites
- 1652US11552024B2Method of manufacturing quad flat no-lead semiconductor devices and corresponding quad flat no-lead semiconductor deviceST MICROELECTRONICS SRL·Filed 2020·Granted Jan 10, 2023·0 cites·20 claims
- 1751US6842300B2Optical device with objective slidable engaged with support structureST MICROELECTRONICS SRL·Filed 2002·Granted Jan 11, 2005·2 cites·27 claims
- 1849US7238014B2Manufacturing method of an electronic device packageST MICROELECTRONICS SRL·Filed 2004·Granted Jul 3, 2007·3 cites·7 claims
- 1948US10879143B2Method of manufacturing semiconductor devices, corresponding device and circuitST MICROELECTRONICS SRL·Filed 2018·Granted Dec 29, 2020·0 cites·19 claims
- 2047US9324627B2Electronic assembly for mounting on electronic boardST MICROELECTRONICS SRL·Filed 2014·Granted Apr 26, 2016·0 cites·18 claims
- 2146US10141240B2Semiconductor device, corresponding circuit and methodST MICROELECTRONICS SRL·Filed 2017·Granted Nov 27, 2018·0 cites·19 claims
- 2243US2022059369A1Method of manufacturing semiconductor devices, and corresponding toolST MICROELECTRONICS SRL·Filed 2021·Application pending·0 cites
- 2340US5660316AMethod and apparatus for bonding semiconductor electronic devicesSGS THOMSON MICROELECTRONICS·Filed 1995·Granted Aug 26, 1997·8 cites·28 claims
- 2439US5445995AMethod for manufacturing plastic-encapsulated semiconductor devices with exposed metal heat sinkSGS THOMSON MICROELECTRONICS·Filed 1992·Granted Aug 29, 1995·10 cites·20 claims
- 2536US8736038B2Lead frame having increased stability due to reinforced die pads and packaging method using such lead frameXiong hui jun·Filed 2012·Granted May 27, 2014·0 cites·12 claims
- 2634US10522504B2Semiconductor device and corresponding methodST MICROELECTRONICS SRL·Filed 2016·Granted Dec 31, 2019·0 cites·10 claims
- 2734US2016315059A1Method of producing bumps in electronic components, corresponding component and computer program productST MICROELECTRONICS SRL·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →