Inventor · disambiguated record
Ping-Jung Yang
Also filed as: YANG PING · YANG PING-JUNG
20 granted patents·9 pending applications·224 citations·filing 2010–2025
93Inventor score
Files withYANG PING JUNG12ADVANCED MICRO FABRICATION EQUIPMENT INC SHANGHAI4ICOMETRUE CO LTD4LIN MOU-SHIUNG2NAT INST METROLOGY CHINA2
Top patents by PatentIndex Score
29 records- 0198US8456856B2Integrated circuit chip using top post-passivation technology and bottom structure technologyLIN MOU-SHIUNG·Filed 2010·Granted Jun 4, 2013·138 cites·20 claims
- 0295US9617633B2Coating packaged chamber parts for semiconductor plasma apparatusADVANCED MICRO-FABRICATION EQUIPMENT INC SHANGHAI·Filed 2013·Granted Apr 11, 2017·28 cites·12 claims
- 0394US12062618B2Chip packageYANG PING JUNG·Filed 2023·Granted Aug 13, 2024·2 cites·20 claims
- 0494US11894306B2Chip packageYANG PING JUNG·Filed 2022·Granted Feb 6, 2024·2 cites·27 claims
- 0593US11538763B2Chip packageYANG PING JUNG·Filed 2021·Granted Dec 27, 2022·4 cites·23 claims
- 0693US9612615B2Integrated circuit chip using top post-passivation technology and bottom structure technologyMEGICA CORP·Filed 2013·Granted Apr 4, 2017·15 cites·20 claims
- 0791US10622310B2Method for fabricating glass substrate packageYANG PING JUNG·Filed 2016·Granted Apr 14, 2020·5 cites·20 claims
- 0890US9615453B2Method for fabricating glass substrate packageYANG PING-JUNG·Filed 2013·Granted Apr 4, 2017·12 cites·20 claims
- 0989US12176278B23D chip package based on vertical-through-via connectorICOMETRUE CO LTD·Filed 2022·Granted Dec 24, 2024·1 cites·27 claims
- 1087US2025132260A1Chip packageYANG PING JUNG·Filed 2024·Application pending·0 cites
- 1185US2024379566A1Chip packageYANG PING JUNG·Filed 2024·Application pending·0 cites
- 1283US8837872B2Waveguide structures for signal and/or power transmission in a semiconductor deviceYANG PING-JUNG·Filed 2011·Granted Sep 16, 2014·8 cites·20 claims
- 1382US8431977B2Wafer level processing method and structure to manufacture semiconductor chipYANG PING-JUNG·Filed 2011·Granted Apr 30, 2013·8 cites·20 claims
- 1477US2025125241A13d chip package based on vertical-through-via connectorICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 1569US11107768B2Chip packageYANG PING JUNG·Filed 2020·Granted Aug 31, 2021·0 cites·28 claims
- 1667US10096565B2Method for fabricating glass substrate packageYANG PING JUNG·Filed 2017·Granted Oct 9, 2018·1 cites·20 claims
- 1767US9951435B2Coating packaged chamber parts for semiconductor plasma apparatusADVANCED MICRO FABRICATION EQUIPMENT INC SHANGHAI·Filed 2017·Granted Apr 24, 2018·0 cites·18 claims
- 1863US2025105238A13D Multichip PackageICOMETRUE CO LTD·Filed 2024·Application pending·0 cites
- 1958US12467942B2On-site reciprocity calibration method for piezoelectric accelerometerNAT INST METROLOGY CHINA·Filed 2023·Granted Nov 11, 2025·0 cites·1 claims
- 2055US10453819B2Method for fabricating glass substrate packageYANG PING JUNG·Filed 2018·Granted Oct 22, 2019·0 cites·20 claims
- 2155US2025336907A1Field programmable multichip package comprising fpga ic chip and nvm ic chipICOMETRUE CO LTD·Filed 2025·Application pending·0 cites
- 2250US11816844B2Method for measuring angular velocity and angular acceleration based on monocular visionUNIV GUIZHOU·Filed 2021·Granted Nov 14, 2023·0 cites·5 claims
- 2350US10583580B2Sand aerated concrete panel embedded with wire box and wire conduit and method for preparing sameSHAANXI NITYA NEW MATERIALS TECH CO LTD·Filed 2018·Granted Mar 10, 2020·0 cites·7 claims
- 2449US11754595B2Method for calibrating linear vibration and angular vibration based on monocular visionNAT INST METROLOGY CHINA·Filed 2021·Granted Sep 12, 2023·0 cites·4 claims
- 2542US9841214B2Passive organic working fluid ejector refrigeration methodUNIV SHANGHAI JIAOTONG·Filed 2015·Granted Dec 12, 2017·0 cites·8 claims
- 2641US2014117120A1Coating packaged showerhead performance enhancement for semiconductor apparatusADVANCED MICRO FABRICATION EQUIPMENT INC SHANGHAI·Filed 2013·Application pending·0 cites
- 2739US2012193785A1Multichip PackagesLIN MOU-SHIUNG·Filed 2012·Application pending·0 cites
- 2837US2018273894A1Method for preparing a degradable materialTIANJIN INST IND BIOTECHNOLOGY CAS·Filed 2017·Application pending·0 cites
- 2936US2017154780A1Substrate processing method and apparatus thereofADVANCED MICRO-FABRICATION EQUIPMENT INC SHANGHAI·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →