Inventor · disambiguated record
Ping Ha Yeung
Also filed as: YEUNG PING HA
3 granted patents·5 pending applications·8 citations·filing 2008–2015
61Inventor score
Files withHERAEUS MATERIALS TECH GMBH2BALASUBRAMANIAM VENKATARAMANAN1CABOT MICROELECTRONICS CORP1HERAEUS DEUTSCHLAND GMBH & CO KG1HERAEUS MAT TECH GMBH & CO KG1
Top patents by PatentIndex Score
8 records- 0167US9589694B2Alloyed 2N copper wires for bonding in microelectronics devicesHERAEUS MAT TECH GMBH & CO KG·Filed 2012·Granted Mar 7, 2017·4 cites·8 claims
- 0256US7922926B2Composition and method for polishing nickel-phosphorous-coated aluminum hard disksCABOT MICROELECTRONICS CORP·Filed 2008·Granted Apr 12, 2011·1 cites·22 claims
- 0353US8247326B2Method of polishing nickel-phosphorousBALASUBRAMANIAM VENKATARAMANAN·Filed 2008·Granted Aug 21, 2012·3 cites·16 claims
- 0439US2013142568A13n copper wires with trace additions for bonding in microelectronics devicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 0538US2016078980A1Copper bond wire and method of making the sameHERAEUS MATERIALS SINGAPORE PTE LTD·Filed 2014·Application pending·0 cites
- 0635US2013140068A1Secondary Alloyed 1N Copper Wires for Bonding in Microelectronics DevicesHERAEUS MATERIALS TECH GMBH·Filed 2012·Application pending·0 cites
- 0734US2013142567A1Doped 4n copper wires for bonding in microelectronics devicesHeraeus Materials Technology GmbH & Co·Filed 2012·Application pending·0 cites
- 0830US2017154863A1Copper bonding wire with angstrom (å) thick surface oxide layerHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →