Inventor · disambiguated record
Po Chen Kuo
Also filed as: KUO PO-CHEN
5 granted patents·2 pending applications·3 citations·filing 2014–2025
65Inventor score
Top patents by PatentIndex Score
7 records- 0176US11171109B2Techniques for forming semiconductor device packages and related packages, intermediate products, and methodsMICRON TECHNOLOGY INC·Filed 2019·Granted Nov 9, 2021·2 cites·15 claims
- 0268US2025373284A1Wireline receiver with improved timing and related marginsM31 TECH CORP·Filed 2025·Application pending·0 cites
- 0361US12062635B2Semiconductor device packages including conductors electrically connecting stacked semiconductor devices by extending along surfaces of the semiconductor devicesMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 13, 2024·0 cites·17 claims
- 0458US9922948B2Semiconductor device with modified pad spacing structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted Mar 20, 2018·1 cites·26 claims
- 0551US11705421B2Apparatus including solder-core connectors and methods of manufacturing the sameMICRON TECHNOLOGY INC·Filed 2021·Granted Jul 18, 2023·0 cites·20 claims
- 0639US2016181127A1Method for coupling circuit element and package structureUNITED MICROELECTRONICS CORP·Filed 2014·Application pending·0 cites
- 0735US9640502B2Stacked semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2015·Granted May 2, 2017·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →