Inventor · disambiguated record
Po-Wen Su
Also filed as: SU PO-WEN
30 granted patents·4 pending applications·77 citations·filing 2012–2025
95Inventor score
Top patents by PatentIndex Score
34 records- 0195US12040393B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 16, 2024·1 cites·10 claims
- 0294US12245424B2One-time programmable memory capacitor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 4, 2025·2 cites·8 claims
- 0394US8853015B1Method of forming a FinFET structureUNITED MICROELECTRONICS CORP·Filed 2013·Granted Oct 7, 2014·18 cites·15 claims
- 0492US11810786B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2021·Granted Nov 7, 2023·6 cites·10 claims
- 0592US10199260B1Contact hole structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2017·Granted Feb 5, 2019·13 cites·4 claims
- 0692US9117909B2Non-planar transistorUNITED MICROELECTRONICS CORP·Filed 2014·Granted Aug 25, 2015·13 cites·6 claims
- 0789US12356654B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Jul 8, 2025·0 cites·9 claims
- 0889US12324181B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2024·Granted Jun 3, 2025·0 cites·11 claims
- 0987US10505007B1Semiconductor device having asymmetric work function metal layerUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 10, 2019·4 cites·14 claims
- 1087US9755057B1Method of fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Sep 5, 2017·4 cites·8 claims
- 1187US2025301688A1High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1285US2025267887A1High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 1384US9443741B1Etching method for reducing microloading effectUNITED MICROELECTRONICS CORP·Filed 2015·Granted Sep 13, 2016·5 cites·10 claims
- 1483US12274081B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2023·Granted Apr 8, 2025·0 cites·10 claims
- 1582US12040392B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2022·Granted Jul 16, 2024·0 cites·12 claims
- 1681US9899491B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Feb 20, 2018·3 cites·5 claims
- 1781US2025107130A1Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 1876US10483158B2Contact hole structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 19, 2019·2 cites·10 claims
- 1976US10026827B2Method for fabricating semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2016·Granted Jul 17, 2018·2 cites·14 claims
- 2072US12218229B2Semiconductor structure and method for forming the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Feb 4, 2025·0 cites·5 claims
- 2172US9117904B2Semiconductor structure having trimming spacersUNITED MICROELECTRONICS CORP·Filed 2015·Granted Aug 25, 2015·2 cites·1 claims
- 2271US11552187B2High electron mobility transistor and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2020·Granted Jan 10, 2023·0 cites·8 claims
- 2371US10522652B1Method for fabricating semiconductor device with reduced wafer edge defectsUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 31, 2019·1 cites·9 claims
- 2469US11881518B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Jan 23, 2024·0 cites·5 claims
- 2568US11929418B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2021·Granted Mar 12, 2024·0 cites·17 claims
- 2666US2025176175A1One-time programmable memory capacitor structure and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2025·Application pending·0 cites
- 2758US11205705B2Metal gate structure and method of fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Dec 21, 2021·0 cites·7 claims
- 2854US10177245B2Method of fabricating a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2017·Granted Jan 8, 2019·0 cites·8 claims
- 2953US11205710B2Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2019·Granted Dec 21, 2021·0 cites·7 claims
- 3052US8975673B2Method of trimming spacers and semiconductor structure thereofCHOU SHYAN-LIANG·Filed 2012·Granted Mar 10, 2015·1 cites·2 claims
- 3151US10043882B2Method of forming semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2018·Granted Aug 7, 2018·0 cites·5 claims
- 3249US11145733B1Method of manufacturing a semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2020·Granted Oct 12, 2021·0 cites·19 claims
- 3348US10283616B2Fabricating method of semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2016·Granted May 7, 2019·0 cites·9 claims
- 3445US9711368B2Sidewall image transfer processUNITED MICROELECTRONICS CORP·Filed 2013·Granted Jul 18, 2017·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →