Inventor · disambiguated record

Po-Hao Tsai

Also filed as: TSAI PO-HAO

231 granted patents·41 pending applications·3,207 citations·filing 2002–2025

99Inventor score

Technology areasH10W H10P H01L B81C G01P

Files withTAIWAN SEMICONDUCTOR MFG CO LTD238 TAIWAN SEMICONDUCTOR MFG16 LIN JING-CHENG5 IND TECH RES INST4 YU CHEN-HUA2

Top patents by PatentIndex Score

272 records

0199US11488843B2Underfill between a first package and a second packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Nov 1, 2022·6 cites·20 claims
0299US10170341B1Release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Jan 1, 2019·37 cites·20 claims
0399US9048222B2Method of fabricating interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 2, 2015·1.1k cites·20 claims
0499US8877554B2Packaged semiconductor devices, methods of packaging semiconductor devices, and PoP devicesTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Nov 4, 2014·621 cites·20 claims
0598US11935866B2Semiconductor device having reduced bump height variationTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Mar 19, 2024·4 cites·20 claims
0698US11527474B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Dec 13, 2022·8 cites·20 claims
0798US11380666B2Fan-out package with cavity substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 5, 2022·5 cites·20 claims
0898US9842826B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Dec 12, 2017·20 cites·20 claims
0998US9460987B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Oct 4, 2016·22 cites·20 claims
1098US9159678B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Oct 13, 2015·42 cites·18 claims
1198US9111914B2Fan out package, semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2014·Granted Aug 18, 2015·40 cites·20 claims
1298US8952544B2Semiconductor device and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Feb 10, 2015·42 cites·17 claims
1398US8778738B1Packaged semiconductor devices and packaging devices and methodsTAIWAN SEMICONDUCTOR MANFACTURING COMPANY LTD·Filed 2013·Granted Jul 15, 2014·615 cites·20 claims
1497US11908790B2Chip structure with conductive via structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 20, 2024·5 cites·20 claims
1597US11610854B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 21, 2023·4 cites·20 claims
1697US9922903B2Interconnect structure for package-on-package devices and a method of fabricatingTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Mar 20, 2018·12 cites·20 claims
1797US9425121B2Integrated fan-out structure with guiding trenches in buffer layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Aug 23, 2016·25 cites·20 claims
1896US11817437B2Method of forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Nov 14, 2023·2 cites·20 claims
1996US11075151B2Fan-out package with controllable standoffTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Jul 27, 2021·12 cites·20 claims
2096US10790162B2Integrated circuit package and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 29, 2020·14 cites·20 claims
2196US10763132B2Release film as isolation film in packageTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Sep 1, 2020·11 cites·19 claims
2296US10515827B2Method for forming chip package with recessed interposer substrateTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·12 cites·20 claims
2396US10269778B2Package on package (PoP) bonding structuresTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 23, 2019·14 cites·20 claims
2496US10163872B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 25, 2018·10 cites·20 claims
2596US10157888B1Integrated fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Dec 18, 2018·24 cites·20 claims
2696US9583420B2Semiconductor device and method of manufacturesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2015·Granted Feb 28, 2017·14 cites·20 claims
2795US11901302B2InFO-POP structures with TIVs having cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Feb 13, 2024·2 cites·20 claims
2895US11855028B2Hybrid micro-bump integration with redistribution layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·3 cites·20 claims
2995US11855017B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Dec 26, 2023·4 cites·20 claims
3095US11756802B2Thermally conductive material in the recess of an encapsulant and sidewall of an integrated circuit deviceTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2022·Granted Sep 12, 2023·2 cites·20 claims
3195US11600575B2Method for forming chip package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Mar 7, 2023·2 cites·20 claims
3295US10103125B2Chip package structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Oct 16, 2018·10 cites·20 claims
3395US9761566B1Multi-die structure and method of forming sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Sep 12, 2017·11 cites·20 claims
3495US9553059B2Backside redistribution layer (RDL) structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Jan 24, 2017·17 cites·20 claims
3595US9543170B2Semiconductor packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2014·Granted Jan 10, 2017·17 cites·20 claims
3695US9368438B2Package on package (PoP) bonding structuresTAIWAN SEMICONDUCTOR MFG·Filed 2013·Granted Jun 14, 2016·18 cites·20 claims
3795US9252065B2Mechanisms for forming package structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2013·Granted Feb 2, 2016·18 cites·15 claims
3895US8664760B2Connector design for packaging integrated circuitsYU CHEN-HUA·Filed 2012·Granted Mar 4, 2014·18 cites·11 claims
3994US11955423B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Apr 9, 2024·3 cites·20 claims
4094US11322447B2Dual-sided routing in 3D SiP structureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted May 3, 2022·3 cites·20 claims
4194US11101214B2Package structure with dam structure and method for forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Aug 24, 2021·8 cites·20 claims
4294US10515901B2InFO-POP structures with TIVs having cavitiesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Dec 24, 2019·8 cites·20 claims
4394US10269685B2Interconnect structure for package-on-package devicesTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2018·Granted Apr 23, 2019·6 cites·20 claims
4494US9929128B1Chip package structure with adhesive layerTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Mar 27, 2018·9 cites·20 claims
4594US9355977B2Bump structures for semiconductor packageTAIWAN SEMICONDUCTOR MFG·Filed 2015·Granted May 31, 2016·10 cites·20 claims
4693US11862588B2Semiconductor device and methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2021·Granted Jan 2, 2024·2 cites·20 claims
4793US11393770B2Semiconductor device and method of manufactureTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2020·Granted Jul 19, 2022·2 cites·20 claims
4893US11164754B2Fan-out packages and methods of forming the sameTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2019·Granted Nov 2, 2021·9 cites·20 claims
4993US10636775B2Package structure and manufacturing method thereofTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2017·Granted Apr 28, 2020·6 cites·20 claims
5093US9818697B2Semiconductor package manufacturing methodTAIWAN SEMICONDUCTOR MFG CO LTD·Filed 2016·Granted Nov 14, 2017·6 cites·20 claims

Showing the top 50 of 272 patent records by PatentIndex Score.

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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →