Inventor · disambiguated record
Po-Han Wu
Also filed as: WU PO-HAN
9 granted patents·4 pending applications·24 citations·filing 2018–2024
82Inventor score
Files withUNITED MICROELECTRONICS CORP7T MOBILE INNOVATIONS LLC2WINBOND ELECTRONICS CORP2DIRECTION EDTECH INC1LEXTAR ELECTRONICS CORP1
Top patents by PatentIndex Score
13 records- 0193US10475794B1Semiconductor device and method for fabricating the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Nov 12, 2019·17 cites·14 claims
- 0280US10777559B1Semiconductor memory device and manufacturing method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Sep 15, 2020·3 cites·18 claims
- 0378US11233057B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2019·Granted Jan 25, 2022·2 cites·11 claims
- 0476US10529719B2Semiconductor structure and fabrication method thereofUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jan 7, 2020·2 cites·8 claims
- 0575US11770924B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2023·Granted Sep 26, 2023·0 cites·6 claims
- 0671US11631679B2Semiconductor deviceUNITED MICROELECTRONICS CORP·Filed 2022·Granted Apr 18, 2023·0 cites·7 claims
- 0759US2025022854A1Micro light-emitting diode packageLEXTAR ELECTRONICS CORP·Filed 2024·Application pending·0 cites
- 0857US11393826B2Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2018·Granted Jul 19, 2022·0 cites·15 claims
- 0954US2025071515A1Indoor detection by smartphone without using gps information to conserve powerT MOBILE INNOVATIONS LLC·Filed 2023·Application pending·0 cites
- 1054US2025071726A1Altitude detection by smartphone without using gps informationT MOBILE INNOVATIONS LLC·Filed 2023·Application pending·0 cites
- 1152US11991875B2Semiconductor memory structure and the method for forming the sameWINBOND ELECTRONICS CORP·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 1250US2024428358A1School admission prediction system and methodDIRECTION EDTECH INC·Filed 2023·Application pending·0 cites
- 1344US11683926B2Method of manufacturing semiconductor structureWINBOND ELECTRONICS CORP·Filed 2021·Granted Jun 20, 2023·0 cites·14 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →