Inventor · disambiguated record
Qingyuan Han
Also filed as: HAN QINGYUAN
14 granted patents·4 pending applications·3,494 citations·filing 1999–2005
96Inventor score
Technology areasH10P
Top patents by PatentIndex Score
18 records- 0198US6756085B2Ultraviolet curing processes for advanced low-k materialsAXCELIS TECH INC·Filed 2003·Granted Jun 29, 2004·685 cites·58 claims
- 0298US6576300B1High modulus, low dielectric constant coatingsDOW CORNING·Filed 2000·Granted Jun 10, 2003·588 cites·19 claims
- 0398US6558755B2Plasma curing process for porous silica thin filmDOW CORNING·Filed 2001·Granted May 6, 2003·563 cites·13 claims
- 0495US6913796B2Plasma curing process for porous low-k materialsDOW CORNING·Filed 2001·Granted Jul 5, 2005·527 cites·34 claims
- 0595US6759098B2Plasma curing of MSQ-based porous low-k film materialsAXCELIS TECH INC·Filed 2001·Granted Jul 6, 2004·580 cites·19 claims
- 0694US7629272B2Ultraviolet assisted porogen removal and/or curing processes for forming porous low k dielectricsAXCELIS TECH INC·Filed 2005·Granted Dec 8, 2009·26 cites·16 claims
- 0794US6281135B1Oxygen free plasma stripping processAXCELIS TECH INC·Filed 1999·Granted Aug 28, 2001·309 cites·23 claims
- 0892US6548416B2Plasma ashing processAXCELIS TECHNOLGOIES INC·Filed 2001·Granted Apr 15, 2003·93 cites·4 claims
- 0989US6630406B2Plasma ashing processAXCELIS TECHNOLOGIES·Filed 2001·Granted Oct 7, 2003·50 cites·45 claims
- 1085US6951823B2Plasma ashing processAXCELIS TECH INC·Filed 2003·Granted Oct 4, 2005·35 cites·40 claims
- 1177US6406836B1Method of stripping photoresist using re-coating materialAXCELIS TECH INC·Filed 2000·Granted Jun 18, 2002·21 cites·4 claims
- 1267US6759133B2High modulus, low dielectric constant coatingsDOW CORNING·Filed 2003·Granted Jul 6, 2004·8 cites·36 claims
- 1358US7011868B2Fluorine-free plasma curing process for porous low-k materialsAXCELIS TECH INC·Filed 2003·Granted Mar 14, 2006·6 cites·21 claims
- 1452US7078161B2Plasma ashing process for removing photoresist and residues during ferroelectric device fabricationINTEL CORP·Filed 2003·Granted Jul 18, 2006·3 cites·22 claims
- 1541US2003175535A1Plasma curing process for porous silica thin filmFiled 2003·Application pending·0 cites
- 1637US2003157267A1Fluorine-free plasma curing process for porous low-k materialsFiled 2003·Application pending·0 cites
- 1735US2004058090A1Low temperature UV pretreating of porous low-k materialsFiled 2003·Application pending·0 cites
- 1832US2003054115A1Ultraviolet curing process for porous low-K materialsFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →