Inventor · disambiguated record
Qing Ma
Also filed as: MA QING · MA QING-QUAN
154 granted patents·33 pending applications·6,664 citations·filing 1997–2025
99Inventor score
Top patents by PatentIndex Score
187 records- 0199US6902950B2Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2002·Granted Jun 7, 2005·251 cites·16 claims
- 0299US6423570B1Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2000·Granted Jul 23, 2002·352 cites·9 claims
- 0398US9368429B2Interposer for hermetic sealing of sensor chips and for their integration with integrated circuit chipsMA QING·Filed 2012·Granted Jun 14, 2016·86 cites·16 claims
- 0498US6808954B2Vacuum-cavity MEMS resonatorINTEL CORP·Filed 2001·Granted Oct 26, 2004·146 cites·25 claims
- 0598US6713859B1Direct build-up layer on an encapsulated die package having a moisture barrier structureINTEL CORP·Filed 2000·Granted Mar 30, 2004·204 cites·24 claims
- 0698US6562653B1Silicon interposer and multi-chip-module (MCM) with through substrate viasINTEL CORP·Filed 2000·Granted May 13, 2003·266 cites·27 claims
- 0798US6271469B1Direct build-up layer on an encapsulated die packageINTEL CORP·Filed 1999·Granted Aug 7, 2001·711 cites·21 claims
- 0898US6229216B1Silicon interposer and multi-chip-module (MCM) with through substrate viasINTEL CORP·Filed 1999·Granted May 8, 2001·307 cites·15 claims
- 0997US7189596B1Process for forming a direct build-up layer on an encapsulated die packages utilizing intermediate structuresINTEL CORP·Filed 2000·Granted Mar 13, 2007·151 cites·24 claims
- 1097US6964889B2Method to protect an encapsulated die package during back grinding with a solder metallization layer and devices formed therebyINTEL CORP·Filed 2002·Granted Nov 15, 2005·153 cites·16 claims
- 1197US6812814B2Microelectromechanical (MEMS) switching apparatusINTEL CORP·Filed 2003·Granted Nov 2, 2004·82 cites·16 claims
- 1297US6621137B1MEMS device integrated chip package, and method of making sameINTEL CORP·Filed 2000·Granted Sep 16, 2003·110 cites·18 claims
- 1397US6154366AStructures and processes for fabricating moisture resistant chip-on-flex packagesINTEL CORP·Filed 1999·Granted Nov 28, 2000·496 cites·29 claims
- 1496US8633551B1Semiconductor package with mechanical fuseTEH WENG HONG·Filed 2012·Granted Jan 21, 2014·30 cites·30 claims
- 1596US7410763B2Multiplex data collection and analysis in bioanalyte detectionINTEL CORP·Filed 2005·Granted Aug 12, 2008·50 cites·21 claims
- 1696US6709898B1Die-in-heat spreader microelectronic packageINTEL CORP·Filed 2000·Granted Mar 23, 2004·221 cites·17 claims
- 1796US6586822B1Integrated core microelectronic packageINTEL CORP·Filed 2000·Granted Jul 1, 2003·179 cites·19 claims
- 1896US6573822B2Tunable inductor using microelectromechanical switchesINTEL CORP·Filed 2001·Granted Jun 3, 2003·124 cites·17 claims
- 1995US6852926B2Packaging microelectromechanical structuresINTEL CORP·Filed 2002·Granted Feb 8, 2005·120 cites·18 claims
- 2095US6686820B1Microelectromechanical (MEMS) switching apparatusINTEL CORP·Filed 2002·Granted Feb 3, 2004·52 cites·48 claims
- 2195US6586836B1Process for forming microelectronic packages and intermediate structures formed therewithINTEL CORP·Filed 2000·Granted Jul 1, 2003·111 cites·26 claims
- 2294US8207453B2Glass core substrate for integrated circuit devices and methods of making the sameMA QING·Filed 2009·Granted Jun 26, 2012·28 cites·13 claims
- 2394US7871569B2Biosensor utilizing a resonator having a functionalized surfaceINTEL CORP·Filed 2005·Granted Jan 18, 2011·18 cites·16 claims
- 2494US7002436B2Vacuum-cavity MEMS resonatorINTEL CORP·Filed 2004·Granted Feb 21, 2006·68 cites·18 claims
- 2594US6531668B1High-speed MEMS switch with high-resonance-frequency beamINTEL CORP·Filed 2001·Granted Mar 11, 2003·58 cites·20 claims
- 2694US6529093B2Microelectromechanical (MEMS) switch using stepped actuation electrodesINTEL CORP·Filed 2001·Granted Mar 4, 2003·83 cites·27 claims
- 2794US6355534B1Variable tunable range MEMS capacitorINTEL CORP·Filed 2000·Granted Mar 12, 2002·67 cites·32 claims
- 2893US7695681B2Miniature chemical analysis systemINTEL CORP·Filed 2005·Granted Apr 13, 2010·19 cites·18 claims
- 2993US6954020B2Apparatus for adjusting the resonance frequency of a microelectromechanical (MEMS) resonator using tensile/compressive strain and applications thereofINTEL CORP·Filed 2003·Granted Oct 11, 2005·94 cites·38 claims
- 3093US6850133B2Electrode configuration in a MEMS switchINTEL CORP·Filed 2002·Granted Feb 1, 2005·41 cites·20 claims
- 3193US6808955B2Method of fabricating an integrated circuit that seals a MEMS device within a cavityINTEL CORP·Filed 2001·Granted Oct 26, 2004·63 cites·16 claims
- 3293US6621022B1Reliable opposing contact structureINTEL CORP·Filed 2002·Granted Sep 16, 2003·32 cites·38 claims
- 3393US6617682B1Structure for reducing die corner and edge stresses in microelectronic packagesINTEL CORP·Filed 2000·Granted Sep 9, 2003·98 cites·16 claims
- 3493US6445106B1Micro-electromechanical structure resonator, method of making, and method of usingINTEL CORP·Filed 2000·Granted Sep 3, 2002·60 cites·8 claims
- 3592US12186257B1MassagerSHENZHEN ENVISION TECH INNOVATION CO LTD·Filed 2024·Granted Jan 7, 2025·2 cites·9 claims
- 3692US7914740B2Biosensor utilizing a resonator having a functionalized surfaceINTEL CORP·Filed 2005·Granted Mar 29, 2011·12 cites·23 claims
- 3792US6943648B2Methods for forming a frequency bulk acoustic resonator with uniform frequency utilizing multiple trimming layers and structures formed therebyINTEL CORP·Filed 2003·Granted Sep 13, 2005·51 cites·22 claims
- 3892US6903452B2Packaging microelectromechanical structuresINTEL CORP·Filed 2003·Granted Jun 7, 2005·92 cites·10 claims
- 3992US6825063B2Integrated core microelectronic packageINTEL CORP·Filed 2003·Granted Nov 30, 2004·73 cites·21 claims
- 4092US6794223B2Structure and process for reducing die corner and edge stresses in microelectronic packagesINTEL CORP·Filed 2003·Granted Sep 21, 2004·77 cites·12 claims
- 4191US7416918B2Direct build-up layer on an encapsulated die package having a moisture barrier structureINTEL CORP·Filed 2004·Granted Aug 26, 2008·55 cites·13 claims
- 4291US7348928B2Slot antenna having a MEMS varactor for resonance frequency tuningINTEL CORP·Filed 2004·Granted Mar 25, 2008·86 cites·20 claims
- 4391US7321275B2Ultra-low voltage capable zipper switchINTEL CORP·Filed 2005·Granted Jan 22, 2008·30 cites·20 claims
- 4491US6662419B2Method for fabricating film bulk acoustic resonators to achieve high-Q and low lossINTEL CORP·Filed 2001·Granted Dec 16, 2003·36 cites·19 claims
- 4591US6655924B2Peristaltic bubble pumpINTEL CORP·Filed 2001·Granted Dec 2, 2003·39 cites·18 claims
- 4690US7183622B2Module integrating MEMS and passive componentsINTEL CORP·Filed 2004·Granted Feb 27, 2007·61 cites·33 claims
- 4790US6362091B1Method for making a semiconductor device having a low-k dielectric layerINTEL CORP·Filed 2000·Granted Mar 26, 2002·68 cites·9 claims
- 4889US9686861B2Glass core substrate for integrated circuit devices and methods of making the sameINTEL CORP·Filed 2016·Granted Jun 20, 2017·5 cites·5 claims
- 4989US6940363B2Switch architecture using MEMS switches and solid state switches in parallelINTEL CORP·Filed 2002·Granted Sep 6, 2005·37 cites·13 claims
- 5088US7796492B2Double electrode cantilever actuation for seek-scan-probe data accessINTEL CORP·Filed 2007·Granted Sep 14, 2010·6 cites·2 claims
Showing the top 50 of 187 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →