Inventor · disambiguated record
Qi Jie Peng
Also filed as: PENG QI JIE
2 granted patents·3 pending applications·1 citations·filing 2019–2020
30Inventor score
Technology areasH10P
Files withAPPLIED MATERIALS INC5
Top patents by PatentIndex Score
5 records- 0165US11177146B2Methods and apparatus for processing a substrateAPPLIED MATERIALS INC·Filed 2019·Granted Nov 16, 2021·1 cites·16 claims
- 0247US10847400B2Adhesive-less substrate bonding to carrier plateAPPLIED MATERIALS INC·Filed 2019·Granted Nov 24, 2020·0 cites·20 claims
- 0339US2021057238A1Methods and apparatus for contactless substrate warpage correctionAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 0438US2021035795A1Methods and apparatus for substrate warpage correctionAPPLIED MATERIALS INC·Filed 2020·Application pending·0 cites
- 0536US2020306931A1Methods and apparatus for removing abrasive particlesAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →