Inventor · disambiguated record
Qingguo Wu
Also filed as: WU QINGGUO
16 granted patents·1,458 citations·filing 2003–2011
95Inventor score
Top patents by PatentIndex Score
16 records- 0198US7906174B1PECVD methods for producing ultra low-k dielectric films using UV treatmentNOVELLUS SYSTEMS INC·Filed 2006·Granted Mar 15, 2011·507 cites·23 claims
- 0298US7208389B1Method of porogen removal from porous low-k films using UV radiationNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 24, 2007·602 cites·38 claims
- 0396US7906817B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Mar 15, 2011·40 cites·8 claims
- 0494US7923385B2Methods for producing low stress porous and CDO low-K dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2009·Granted Apr 12, 2011·17 cites·24 claims
- 0592US7390537B1Methods for producing low-k CDO films with low residual stressNOVELLUS SYSTEMS INC·Filed 2004·Granted Jun 24, 2008·51 cites·25 claims
- 0692US7241704B1Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 10, 2007·58 cites·30 claims
- 0791US7473653B1Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jan 6, 2009·12 cites·18 claims
- 0891US7112615B2Porous material formation by chemical vapor deposition onto colloidal crystal templatesMASSACHUSETTS INST TECHNOLOGY·Filed 2003·Granted Sep 26, 2006·38 cites·42 claims
- 0990US7737525B1Method for producing low-K CDO filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 15, 2010·9 cites·20 claims
- 1088US7622400B1Method for improving mechanical properties of low dielectric constant materialsNOVELLUS SYSTEMS INC·Filed 2004·Granted Nov 24, 2009·42 cites·28 claims
- 1186US7998881B1Method for making high stress boron-doped carbon filmsNOVELLUS SYSTEMS INC·Filed 2008·Granted Aug 16, 2011·11 cites·17 claims
- 1284US8362571B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2011·Granted Jan 29, 2013·5 cites·17 claims
- 1383US7799705B1Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2009·Granted Sep 21, 2010·5 cites·20 claims
- 1480US7341761B1Methods for producing low-k CDO filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Mar 11, 2008·17 cites·14 claims
- 1580US7326444B1Methods for improving integration performance of low stress CDO filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Feb 5, 2008·30 cites·29 claims
- 1671US7781351B1Methods for producing low-k carbon doped oxide films with low residual stressNOVELLUS SYSTEMS INC·Filed 2004·Granted Aug 24, 2010·14 cites·30 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →