Inventor · disambiguated record
Qing Xu
Also filed as: XU QING · XU QING-CHI
20 granted patents·9 pending applications·50 citations·filing 2011–2025
91Inventor score
Top patents by PatentIndex Score
29 records- 0195US9991128B2Atomic layer etching in continuous plasmaLAM RES CORP·Filed 2017·Granted Jun 5, 2018·26 cites·19 claims
- 0288US9824896B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2015·Granted Nov 21, 2017·4 cites·23 claims
- 0386US10658194B2Silicon-based deposition for semiconductor processingLAM RES CORP·Filed 2016·Granted May 19, 2020·2 cites·13 claims
- 0483US8440473B2Use of spectrum to synchronize RF switching with gas switching during etchXU QING·Filed 2011·Granted May 14, 2013·6 cites·19 claims
- 0582US10943789B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2017·Granted Mar 9, 2021·2 cites·16 claims
- 0676US9767991B2Methods and systems for independent control of radical density, ion density, and ion energy in pulsed plasma semiconductor device fabricationLAM RES CORP·Filed 2015·Granted Sep 19, 2017·2 cites·18 claims
- 0775US10242845B2Near-substrate supplemental plasma density generation with low bias voltage within inductively coupled plasma processing chamberLAM RES CORP·Filed 2017·Granted Mar 26, 2019·2 cites·15 claims
- 0875US8691698B2Controlled gas mixing for smooth sidewall rapid alternating etch processXU QING·Filed 2012·Granted Apr 8, 2014·3 cites·19 claims
- 0973US12165872B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 1066US9852924B1Line edge roughness improvement with sidewall sputteringLAM RES CORP·Filed 2016·Granted Dec 26, 2017·1 cites·18 claims
- 1166US8871105B2Method for achieving smooth side walls after Bosch etch processWINNICZEK JAROSLAW W·Filed 2012·Granted Oct 28, 2014·2 cites·19 claims
- 1261US2025149330A1Method for etching features using a targeted deposition for selective passivationLAM RES CORP·Filed 2025·Application pending·0 cites
- 1359US12217955B2Method for etching features using a targeted deposition for selective passivationLAM RES CORP·Filed 2020·Granted Feb 4, 2025·0 cites·20 claims
- 1459US11049726B2Methods and systems for advanced ion control for etching processesLAM RES CORP·Filed 2017·Granted Jun 29, 2021·0 cites·23 claims
- 1552US9543225B2Systems and methods for detecting endpoint for through-silicon via reveal applicationsLAM RES CORP·Filed 2014·Granted Jan 10, 2017·0 cites·17 claims
- 1651US2025277148A1Organochloride etch with passivation and profile controlLAM RES CORP·Filed 2023·Application pending·0 cites
- 1750US10177003B2Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power levelLAM RES CORP·Filed 2017·Granted Jan 8, 2019·0 cites·20 claims
- 1849US9941178B2Methods for detecting endpoint for through-silicon via reveal applicationsLAM RES CORP·Filed 2016·Granted Apr 10, 2018·0 cites·16 claims
- 1949US2018005803A1Methods and Systems for Independent Control of Radical Density, Ion Density, and Ion Energy in Pulsed Plasma Semiconductor Device FabricationLAM RES CORP·Filed 2017·Application pending·0 cites
- 2049US2025357135A1High aspect ratio etch with a metal or metalloid containing maskLAM RES CORP·Filed 2023·Application pending·0 cites
- 2148US2024429063A1Silicon etch with organochlorideLAM RES CORP·Filed 2022·Application pending·0 cites
- 2247US9691625B2Methods and systems for plasma etching using bi-modal process gas composition responsive to plasma power levelLAM RES CORP·Filed 2015·Granted Jun 27, 2017·0 cites·20 claims
- 2347US2025095964A1Method to control etch profile by rf pulsingLAM RES CORP·Filed 2022·Application pending·0 cites
- 2446US9997366B2Silicon oxide silicon nitride stack ion-assisted etchLAM RES CORP·Filed 2017·Granted Jun 12, 2018·0 cites·16 claims
- 2545US9859127B1Line edge roughness improvement with photon-assisted plasma processLAM RES CORP·Filed 2016·Granted Jan 2, 2018·0 cites·11 claims
- 2645US2023298896A1Metal-based liner protection for high aspect ratio plasma etchLAM RES CORP·Filed 2022·Application pending·0 cites
- 2744US2023230807A1Control of mask cdLAM RES CORP·Filed 2022·Application pending·0 cites
- 2841US2014364795A1Synthesis of upconversion nanocomposites for photodynamic therapyUNIV NANYANG TECH·Filed 2012·Application pending·0 cites
- 2940US8609548B2Method for providing high etch rateXU QING·Filed 2011·Granted Dec 17, 2013·0 cites·12 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →