Inventor · disambiguated record
Qianqiu Ye
Also filed as: YE QIANQIU · YE QIANQIU CHRISTINE
5 granted patents·9 pending applications·44 citations·filing 2001–2011
77Inventor score
Files withROHM & HAAS ELECT MAT4BIAN JINRU2RODEL INC1ROHM AND ELECTRONIC MATERIALS CMP HOLDINGS INC1THOMAS TERENCE M1
Top patents by PatentIndex Score
14 records- 0177US6916742B2Modular barrier removal polishing slurryROHM & HAAS ELECT MAT·Filed 2003·Granted Jul 12, 2005·23 cites·16 claims
- 0269US7785487B2Polymeric barrier removal polishing slurryROHM & HAAS ELECT MAT·Filed 2006·Granted Aug 31, 2010·3 cites·10 claims
- 0369US6530824B2Method and composition for polishing by CMPRODEL INC·Filed 2001·Granted Mar 11, 2003·15 cites·22 claims
- 0449US7270762B2Polishing compositions for noble metalsROHM & HAAS ELECT MAT·Filed 2003·Granted Sep 18, 2007·2 cites·10 claims
- 0546US7070485B2Polishing compositionROHM & HAAS ELECT MAT·Filed 2001·Granted Jul 4, 2006·1 cites·23 claims
- 0642US2009031636A1Polymeric barrier removal polishing slurryYE QIANQIU·Filed 2007·Application pending·0 cites
- 0742US2009032765A1Selective barrier polishing slurryBIAN JINRU·Filed 2007·Application pending·0 cites
- 0839US2005194562A1Polishing compositions for controlling metal interconnect removal rate in semiconductor wafersFiled 2004·Application pending·0 cites
- 0938US2002039839A1Polishing compositions for noble metalsFiled 2001·Application pending·0 cites
- 1036US2008276543A1Alkaline barrier polishing slurryTHOMAS TERENCE M·Filed 2007·Application pending·0 cites
- 1135US2003006396A1Polishing composition for CMP having abrasive particlesFiled 2002·Application pending·0 cites
- 1235US2005136670A1Compositions and methods for controlled polishing of copperFiled 2003·Application pending·0 cites
- 1334US2006135045A1Polishing compositions for reducing erosion in semiconductor wafersBIAN JINRU·Filed 2004·Application pending·0 cites
- 1433US2013045599A1Method for chemical mechanical polishing copperROHM AND ELECTRONIC MATERIALS CMP HOLDINGS INC·Filed 2011·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →