Inventor · disambiguated record
Quang Nguyen
Also filed as: NGUYEN QUANG · NGUYEN QUANG-TAN
11 granted patents·9 pending applications·35 citations·filing 1990–2024
82Inventor score
Files withMICRON TECHNOLOGY INC12CADENCE DESIGN SYSTEMS INC2NGUYEN QUANG2CIT ALCATEL1MARVELL ASIA PTE LTD1
Top patents by PatentIndex Score
20 records- 0174US12211814B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2023·Granted Jan 28, 2025·0 cites·21 claims
- 0273US2025079371A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0369US5132609ACircuit for measuring the level of an electrical signal and including offset correction means, and application thereof to amplifiers having automatic gain controlCIT ALCATEL·Filed 1990·Granted Jul 21, 1992·34 cites·15 claims
- 0465US11728307B2Semiconductor interconnect structures with conductive elements, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2021·Granted Aug 15, 2023·0 cites·21 claims
- 0565US11664360B2Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2021·Granted May 30, 2023·0 cites·11 claims
- 0661US2023260943A1Semiconductor die assemblies with flexible interconnects and associated methods and systemsMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 0758US9756915B2Case for mobile electronic device with movable sensor coverNGUYEN QUANG·Filed 2015·Granted Sep 12, 2017·1 cites·19 claims
- 0858US2024339496A1Semiconductor dies with rounded or chamfered edgesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 0957US11150295B1Relay circuit for reducing a voltage glitch during device testingMARVELL ASIA PTE LTD·Filed 2019·Granted Oct 19, 2021·0 cites·19 claims
- 1057US2024145337A1Semiconductor device assembly with a thermally-conductive channelMICRON TECHNOLOGY INC·Filed 2023·Application pending·0 cites
- 1157US2025014959A1Microelectronic devices including recesses in an encapsulant material and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1256US2022085002A1Circuit board with spaces for embedding componentsMICRON TECHNOLOGY INC·Filed 2020·Application pending·0 cites
- 1356US2024407080A1Printed circuit board with enhanced structural supportMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 1454US12341110B2Methods and apparatus for using structural elements to improve drop/shock resilience in semiconductor devicesMICRON TECHNOLOGY INC·Filed 2022·Granted Jun 24, 2025·0 cites·14 claims
- 1554US2025038491A1Power Distribution Unit with DIN-Rail Breaker Panel MountVERTIV CORP·Filed 2024·Application pending·0 cites
- 1651US8670245B2Communication circuit for driving a plurality of devicesNGUYEN QUANG·Filed 2011·Granted Mar 11, 2014·0 cites·13 claims
- 1749US10996723B1Synchronized reset for a circuit emulatorCADENCE DESIGN SYSTEMS INC·Filed 2018·Granted May 4, 2021·0 cites·20 claims
- 1848US11537772B1Synchronized clock signals for circuit emulatorsCADENCE DESIGN SYSTEMS INC·Filed 2018·Granted Dec 27, 2022·0 cites·20 claims
- 1946US2024117855A1A damper for a printed circuit board assemblyMICRON TECHNOLOGY INC·Filed 2022·Application pending·0 cites
- 2042US8023280B2Communication circuit for driving a plurality of devicesQUALCOMM INC·Filed 2003·Granted Sep 20, 2011·0 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →